SG11201911765QA - Solar cell bonding - Google Patents
Solar cell bondingInfo
- Publication number
- SG11201911765QA SG11201911765QA SG11201911765QA SG11201911765QA SG11201911765QA SG 11201911765Q A SG11201911765Q A SG 11201911765QA SG 11201911765Q A SG11201911765Q A SG 11201911765QA SG 11201911765Q A SG11201911765Q A SG 11201911765QA SG 11201911765Q A SG11201911765Q A SG 11201911765QA
- Authority
- SG
- Singapore
- Prior art keywords
- solar cell
- cell bonding
- bonding
- solar
- cell
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662354976P | 2016-06-27 | 2016-06-27 | |
| US15/627,890 US10411152B2 (en) | 2016-06-27 | 2017-06-20 | Solar cell bonding |
| PCT/US2017/067608 WO2018236417A1 (fr) | 2016-06-27 | 2017-12-20 | Liaison de cellules solaires |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201911765QA true SG11201911765QA (en) | 2020-01-30 |
Family
ID=60677915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201911765QA SG11201911765QA (en) | 2016-06-27 | 2017-12-20 | Solar cell bonding |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10411152B2 (fr) |
| EP (1) | EP3642886B1 (fr) |
| JP (1) | JP7100673B2 (fr) |
| KR (1) | KR102527371B1 (fr) |
| CN (1) | CN110785858B (fr) |
| PH (1) | PH12019550277A1 (fr) |
| SG (1) | SG11201911765QA (fr) |
| TW (1) | TWI760409B (fr) |
| WO (1) | WO2018236417A1 (fr) |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4909429A (en) | 1987-03-30 | 1990-03-20 | Westinghouse Electric Corp. | Method and apparatus for solder deposition |
| US8138413B2 (en) | 2006-04-13 | 2012-03-20 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
| JP2000323505A (ja) * | 1999-05-12 | 2000-11-24 | Casio Comput Co Ltd | ボンディングヘッド |
| JP2001051284A (ja) * | 1999-08-10 | 2001-02-23 | Matsushita Electric Ind Co Ltd | 液晶表示装置製造装置 |
| GB2375733B (en) * | 2001-01-15 | 2004-11-03 | Lintec Corp | Laminating apparatus and laminating method |
| DE10210521A1 (de) | 2002-03-09 | 2003-09-18 | Hans Thoma | Verfahren und Vorrichtung zum Herstellen von Solarmodulen |
| US20040112424A1 (en) * | 2002-10-03 | 2004-06-17 | Daido Steel Co., Ltd. | Solar cell assembly, and photovoltaic solar electric generator of concentrator type |
| JP2005088237A (ja) * | 2003-09-12 | 2005-04-07 | Riso Kagaku Corp | 太陽熱製版装置 |
| JP2006147887A (ja) * | 2004-11-19 | 2006-06-08 | Nisshinbo Ind Inc | 太陽電池用タブリードのハンダ付け方法並びにそのための装置 |
| DE102006006715B4 (de) | 2005-02-18 | 2016-10-20 | Komax Holding Ag | Vorrichtung und Verfahren zum Ausrichten und Befestigen eines Bandes an einer Solarzelle |
| US7799182B2 (en) * | 2006-12-01 | 2010-09-21 | Applied Materials, Inc. | Electroplating on roll-to-roll flexible solar cell substrates |
| DE102006058493B4 (de) | 2006-12-12 | 2012-03-22 | Erich Thallner | Verfahren und Vorrichtung zum Bonden von Wafern |
| TW200905901A (en) * | 2007-03-29 | 2009-02-01 | Daniel F Baldwin | Solar module manufacturing processes |
| CN102017066B (zh) * | 2008-03-14 | 2012-11-21 | 陶氏康宁公司 | 形成光伏电池模块的方法 |
| JP5089456B2 (ja) * | 2008-03-26 | 2012-12-05 | 三洋電機株式会社 | 圧着装置及び太陽電池モジュールの製造方法 |
| NL2001958C (en) * | 2008-09-05 | 2010-03-15 | Stichting Energie | Method of monolithic photo-voltaic module assembly. |
| DE102008049220B4 (de) * | 2008-09-27 | 2015-11-19 | Solarworld Innovations Gmbh | Halbleiterbauelement mit Kontakten aus einlegierten Metalldrähten |
| JP2011096792A (ja) * | 2009-10-28 | 2011-05-12 | Hitachi High-Technologies Corp | 太陽電池パネルの実装装置 |
| DE102010016476B4 (de) | 2010-04-16 | 2022-09-29 | Meyer Burger (Germany) Gmbh | Verfahren zum Aufbringen von Kontaktdrähten auf eine Oberfläche einer Photovoltaikzelle, Photovoltaikzelle, Photovoltaikmodul, Anordnung zum Aufbringen von Kontaktdrähten auf eine Oberfläche einer Photovoltaikzelle |
| DE102010016771B4 (de) | 2010-05-04 | 2017-08-24 | Solarworld Innovations Gmbh | Verfahren zum Fixieren eines Photovoltaik-Zellenverbinders auf einer Oberfläche einer Photovoltaik-Zelle |
| JP5604236B2 (ja) | 2010-09-07 | 2014-10-08 | デクセリアルズ株式会社 | 太陽電池モジュールの製造方法、太陽電池セルの接続装置、太陽電池モジュール |
| US9029689B2 (en) * | 2010-12-23 | 2015-05-12 | Sunpower Corporation | Method for connecting solar cells |
| JP2012248639A (ja) | 2011-05-26 | 2012-12-13 | Hitachi High-Technologies Corp | 導電性フィルム貼付ユニット及び太陽電池モジュール組立装置 |
| DE102011104159A1 (de) * | 2011-06-14 | 2012-12-20 | Institut Für Solarenergieforschung Gmbh | Verfahren zum elektrischen verbinden mehrerer solarzellen und photovoltaikmodul |
| EP2546889B1 (fr) * | 2011-07-12 | 2020-06-17 | Airbus Defence and Space GmbH | Ensemble de cellules solaires et procédé de fabrication d'ensemble de cellules solaires |
| JP5485958B2 (ja) * | 2011-09-16 | 2014-05-07 | 東京エレクトロン株式会社 | 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム |
| US8328077B1 (en) | 2011-11-01 | 2012-12-11 | Flextronics Ap, Llc | PV cell mass reflow |
| CN104884256A (zh) * | 2012-12-21 | 2015-09-02 | 梅耶博格公司 | 使用管状压力部件的用于太阳能组件的层压机 |
| WO2014157082A1 (fr) * | 2013-03-29 | 2014-10-02 | 東京応化工業株式会社 | Procédé de fixation |
| US9947637B2 (en) * | 2013-11-01 | 2018-04-17 | Nikon Corporation | System and method for clamping wafers together in alignment using pressure |
| US9282650B2 (en) | 2013-12-18 | 2016-03-08 | Intel Corporation | Thermal compression bonding process cooling manifold |
| WO2015118592A1 (fr) * | 2014-02-06 | 2015-08-13 | パナソニックＩｐマネジメント株式会社 | Cellule solaire et procédé de fabrication de cellule solaire |
| US9818903B2 (en) * | 2014-04-30 | 2017-11-14 | Sunpower Corporation | Bonds for solar cell metallization |
| EP3208828A4 (fr) * | 2014-10-17 | 2018-06-06 | Bondtech Co., Ltd. | Procédé de collage de substrats entre eux et dispositif de collage de substrats |
| CN107078173B (zh) * | 2014-10-27 | 2020-06-09 | 松下知识产权经营株式会社 | 太阳能电池组件的制造方法和太阳能电池组件的制造装置 |
| WO2016068487A1 (fr) * | 2014-10-27 | 2016-05-06 | 주식회사 제우스 | Appareil d'alimentation en fil pour dispositif de pose de fil de tabulation |
| US9515108B2 (en) | 2015-03-11 | 2016-12-06 | Semiconductor Components Industries, Llc | Image sensors with contamination barrier structures |
| US9722103B2 (en) | 2015-06-26 | 2017-08-01 | Sunpower Corporation | Thermal compression bonding approaches for foil-based metallization of solar cells |
-
2017
- 2017-06-20 US US15/627,890 patent/US10411152B2/en active Active
- 2017-12-20 CN CN201780092290.9A patent/CN110785858B/zh active Active
- 2017-12-20 SG SG11201911765QA patent/SG11201911765QA/en unknown
- 2017-12-20 JP JP2019570367A patent/JP7100673B2/ja active Active
- 2017-12-20 KR KR1020197038608A patent/KR102527371B1/ko active IP Right Grant
- 2017-12-20 EP EP17914758.2A patent/EP3642886B1/fr active Active
- 2017-12-20 WO PCT/US2017/067608 patent/WO2018236417A1/fr unknown
- 2017-12-22 TW TW106145399A patent/TWI760409B/zh active
-
2019
- 2019-12-11 PH PH12019550277A patent/PH12019550277A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR102527371B1 (ko) | 2023-04-28 |
| CN110785858A (zh) | 2020-02-11 |
| EP3642886A1 (fr) | 2020-04-29 |
| TWI760409B (zh) | 2022-04-11 |
| JP7100673B2 (ja) | 2022-07-13 |
| EP3642886B1 (fr) | 2024-05-08 |
| CN110785858B (zh) | 2023-07-04 |
| TW201906191A (zh) | 2019-02-01 |
| JP2020524411A (ja) | 2020-08-13 |
| KR20200010512A (ko) | 2020-01-30 |
| PH12019550277A1 (en) | 2021-01-04 |
| US10411152B2 (en) | 2019-09-10 |
| WO2018236417A1 (fr) | 2018-12-27 |
| EP3642886A4 (fr) | 2020-11-11 |
| US20170373217A1 (en) | 2017-12-28 |
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