SG11201911765QA - Solar cell bonding - Google Patents
Solar cell bondingInfo
- Publication number
- SG11201911765QA SG11201911765QA SG11201911765QA SG11201911765QA SG11201911765QA SG 11201911765Q A SG11201911765Q A SG 11201911765QA SG 11201911765Q A SG11201911765Q A SG 11201911765QA SG 11201911765Q A SG11201911765Q A SG 11201911765QA SG 11201911765Q A SG11201911765Q A SG 11201911765QA
- Authority
- SG
- Singapore
- Prior art keywords
- solar cell
- cell bonding
- bonding
- solar
- cell
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662354976P | 2016-06-27 | 2016-06-27 | |
| US15/627,890 US10411152B2 (en) | 2016-06-27 | 2017-06-20 | Solar cell bonding |
| PCT/US2017/067608 WO2018236417A1 (en) | 2016-06-27 | 2017-12-20 | Solar cell bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201911765QA true SG11201911765QA (en) | 2020-01-30 |
Family
ID=60677915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201911765QA SG11201911765QA (en) | 2016-06-27 | 2017-12-20 | Solar cell bonding |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10411152B2 (en) |
| EP (1) | EP3642886A4 (en) |
| JP (1) | JP7100673B2 (en) |
| KR (1) | KR102527371B1 (en) |
| CN (1) | CN110785858B (en) |
| PH (1) | PH12019550277A1 (en) |
| SG (1) | SG11201911765QA (en) |
| TW (1) | TWI760409B (en) |
| WO (1) | WO2018236417A1 (en) |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4909429A (en) | 1987-03-30 | 1990-03-20 | Westinghouse Electric Corp. | Method and apparatus for solder deposition |
| US8138413B2 (en) | 2006-04-13 | 2012-03-20 | Daniel Luch | Collector grid and interconnect structures for photovoltaic arrays and modules |
| JP2000323505A (en) | 1999-05-12 | 2000-11-24 | Casio Comput Co Ltd | Bonding head |
| JP2001051284A (en) * | 1999-08-10 | 2001-02-23 | Matsushita Electric Ind Co Ltd | Device for manufacturing liquid crystal display device |
| TW516081B (en) | 2001-01-15 | 2003-01-01 | Lintec Corp | Bonding apparatus and bonding method |
| DE10210521A1 (en) | 2002-03-09 | 2003-09-18 | Hans Thoma | Manufacturing solar modules involves taking solar cells from magazine stack, forming rows of string sections, laying between foils covered by glass plates, framing and placing in hot oven |
| US20040112424A1 (en) * | 2002-10-03 | 2004-06-17 | Daido Steel Co., Ltd. | Solar cell assembly, and photovoltaic solar electric generator of concentrator type |
| JP2005088237A (en) * | 2003-09-12 | 2005-04-07 | Riso Kagaku Corp | Solar heat plate making apparatus |
| JP2006147887A (en) | 2004-11-19 | 2006-06-08 | Nisshinbo Ind Inc | Method for soldering tab lead for solar battery and device for the method |
| DE102006006715B4 (en) | 2005-02-18 | 2016-10-20 | Komax Holding Ag | Apparatus and method for aligning and securing a tape to a solar cell |
| US7799182B2 (en) | 2006-12-01 | 2010-09-21 | Applied Materials, Inc. | Electroplating on roll-to-roll flexible solar cell substrates |
| DE102006058493B4 (en) | 2006-12-12 | 2012-03-22 | Erich Thallner | Method and apparatus for bonding wafers |
| WO2008121293A2 (en) * | 2007-03-29 | 2008-10-09 | Baldwin Daniel F | Solar module manufacturing processes |
| EP2253011B1 (en) * | 2008-03-14 | 2014-04-23 | Dow Corning Corporation | Method of forming a photovoltaic cell module |
| JP5089456B2 (en) * | 2008-03-26 | 2012-12-05 | 三洋電機株式会社 | Crimping apparatus and solar cell module manufacturing method |
| NL2001958C (en) * | 2008-09-05 | 2010-03-15 | Stichting Energie | Method of monolithic photo-voltaic module assembly. |
| DE102008049220B4 (en) | 2008-09-27 | 2015-11-19 | Solarworld Innovations Gmbh | Semiconductor device with contacts of alloyed metal wires |
| JP2011096792A (en) * | 2009-10-28 | 2011-05-12 | Hitachi High-Technologies Corp | Mounting device for solar cell panel |
| DE102010016476B4 (en) | 2010-04-16 | 2022-09-29 | Meyer Burger (Germany) Gmbh | Method for applying contact wires to a surface of a photovoltaic cell, photovoltaic cell, photovoltaic module, arrangement for applying contact wires to a surface of a photovoltaic cell |
| DE102010016771B4 (en) | 2010-05-04 | 2017-08-24 | Solarworld Innovations Gmbh | A method of fixing a photovoltaic cell connector on a surface of a photovoltaic cell |
| JP5604236B2 (en) | 2010-09-07 | 2014-10-08 | デクセリアルズ株式会社 | Solar cell module manufacturing method, solar cell connection device, solar cell module |
| US9029689B2 (en) * | 2010-12-23 | 2015-05-12 | Sunpower Corporation | Method for connecting solar cells |
| JP2012248639A (en) * | 2011-05-26 | 2012-12-13 | Hitachi High-Technologies Corp | Conductive film affixation unit and solar battery module assembling device |
| DE102011104159A1 (en) * | 2011-06-14 | 2012-12-20 | Institut Für Solarenergieforschung Gmbh | METHOD FOR THE ELECTRICAL CONNECTION OF SEVERAL SOLAR CELLS AND PHOTOVOLTAIC MODULE |
| EP2546889B1 (en) * | 2011-07-12 | 2020-06-17 | Airbus Defence and Space GmbH | Solar cell assembly and method of fabrication of solar cell assembly |
| JP5485958B2 (en) * | 2011-09-16 | 2014-05-07 | 東京エレクトロン株式会社 | Joining method, program, computer storage medium, joining apparatus and joining system |
| US8328077B1 (en) | 2011-11-01 | 2012-12-11 | Flextronics Ap, Llc | PV cell mass reflow |
| CN104884256A (en) * | 2012-12-21 | 2015-09-02 | 梅耶博格公司 | Laminator for solar modules using a tube like pressing member |
| US9484238B2 (en) * | 2013-03-29 | 2016-11-01 | Tokyo Ohka Kogyo Co., Ltd. | Attachment method |
| US10121760B2 (en) * | 2013-11-01 | 2018-11-06 | Nikon Corporation | Wafer bonding system and method |
| US9282650B2 (en) | 2013-12-18 | 2016-03-08 | Intel Corporation | Thermal compression bonding process cooling manifold |
| WO2015118592A1 (en) * | 2014-02-06 | 2015-08-13 | パナソニックＩｐマネジメント株式会社 | Solar cell and solar cell manufacturing method |
| US9818903B2 (en) * | 2014-04-30 | 2017-11-14 | Sunpower Corporation | Bonds for solar cell metallization |
| JP6448656B2 (en) * | 2014-10-17 | 2019-01-09 | ボンドテック株式会社 | Substrate bonding method and substrate bonding apparatus |
| KR102053104B1 (en) * | 2014-10-27 | 2019-12-09 | 주식회사 제우스 | Wire transfer apparatus of tabbing apparatus |
| EP3214658A4 (en) | 2014-10-27 | 2017-10-25 | Panasonic Intellectual Property Management Co., Ltd. | Method for manufacturing solar cell module and apparatus for manufacturing solar cell module |
| US9515108B2 (en) | 2015-03-11 | 2016-12-06 | Semiconductor Components Industries, Llc | Image sensors with contamination barrier structures |
| US9722103B2 (en) | 2015-06-26 | 2017-08-01 | Sunpower Corporation | Thermal compression bonding approaches for foil-based metallization of solar cells |
-
2017
- 2017-06-20 US US15/627,890 patent/US10411152B2/en active Active
- 2017-12-20 WO PCT/US2017/067608 patent/WO2018236417A1/en unknown
- 2017-12-20 CN CN201780092290.9A patent/CN110785858B/en active Active
- 2017-12-20 EP EP17914758.2A patent/EP3642886A4/en active Pending
- 2017-12-20 SG SG11201911765QA patent/SG11201911765QA/en unknown
- 2017-12-20 KR KR1020197038608A patent/KR102527371B1/en active IP Right Grant
- 2017-12-20 JP JP2019570367A patent/JP7100673B2/en active Active
- 2017-12-22 TW TW106145399A patent/TWI760409B/en active
-
2019
- 2019-12-11 PH PH12019550277A patent/PH12019550277A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN110785858A (en) | 2020-02-11 |
| EP3642886A1 (en) | 2020-04-29 |
| WO2018236417A1 (en) | 2018-12-27 |
| US20170373217A1 (en) | 2017-12-28 |
| US10411152B2 (en) | 2019-09-10 |
| KR20200010512A (en) | 2020-01-30 |
| JP2020524411A (en) | 2020-08-13 |
| EP3642886A4 (en) | 2020-11-11 |
| KR102527371B1 (en) | 2023-04-28 |
| JP7100673B2 (en) | 2022-07-13 |
| TWI760409B (en) | 2022-04-11 |
| PH12019550277A1 (en) | 2021-01-04 |
| TW201906191A (en) | 2019-02-01 |
| CN110785858B (en) | 2023-07-04 |
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