SG11201909904XA - Laser soldering method and device - Google Patents
Laser soldering method and deviceInfo
- Publication number
- SG11201909904XA SG11201909904XA SG11201909904XA SG11201909904XA SG 11201909904X A SG11201909904X A SG 11201909904XA SG 11201909904X A SG11201909904X A SG 11201909904XA SG 11201909904X A SG11201909904X A SG 11201909904XA
- Authority
- SG
- Singapore
- Prior art keywords
- solder
- laser
- laser light
- soldering
- solder droplet
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/36—Circuit design at the analogue level
- G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Evolutionary Computation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017090417A JP6913350B2 (ja) | 2017-04-28 | 2017-04-28 | レーザーはんだ付け方法および装置 |
PCT/JP2018/016599 WO2018199086A1 (ja) | 2017-04-28 | 2018-04-24 | レーザーはんだ付け方法および装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201909904XA true SG11201909904XA (en) | 2019-11-28 |
Family
ID=63919878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201909904X SG11201909904XA (en) | 2017-04-28 | 2018-04-24 | Laser soldering method and device |
Country Status (9)
Country | Link |
---|---|
US (1) | US11453076B2 (ja) |
EP (1) | EP3616819B1 (ja) |
JP (1) | JP6913350B2 (ja) |
KR (1) | KR102490907B1 (ja) |
CN (1) | CN110621432B (ja) |
PH (1) | PH12019550234A1 (ja) |
SG (1) | SG11201909904XA (ja) |
TW (1) | TWI775845B (ja) |
WO (1) | WO2018199086A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10556284B2 (en) * | 2015-08-24 | 2020-02-11 | Seagate Technology Llc | Method of forming electrical connections with solder dispensing and reflow |
US10780515B2 (en) * | 2018-04-26 | 2020-09-22 | Raytheon Technologies Corporation | Auto-adaptive braze dispensing systems and methods |
US10964867B2 (en) * | 2018-10-08 | 2021-03-30 | Facebook Technologies, Llc | Using underfill or flux to promote placing and parallel bonding of light emitting diodes |
US11929334B2 (en) | 2020-03-17 | 2024-03-12 | STATS ChipPAC Pte. Ltd. | Die-beam alignment for laser-assisted bonding |
CN113042922B (zh) * | 2021-05-17 | 2023-01-13 | 深圳市艾雷激光科技有限公司 | 一种激光焊的方法 |
JPWO2022254807A1 (ja) * | 2021-06-02 | 2022-12-08 | ||
JP2023128986A (ja) * | 2022-03-04 | 2023-09-14 | 株式会社ディスコ | レーザリフロー方法 |
KR20240080787A (ko) | 2022-11-30 | 2024-06-07 | 한국생산기술연구원 | 홀 드릴링 패턴을 이용한 접합소재 레이저 솔더링 접합방법 및 이에 사용되는 접합물 구조체 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59150665A (ja) * | 1983-02-03 | 1984-08-28 | Toshiba Corp | はんだ付け方法 |
JPS60180666A (ja) * | 1984-02-29 | 1985-09-14 | Canon Inc | レ−ザ−はんだ付け方法及びこれに用いるはんだ付け装置 |
JPH0744332B2 (ja) * | 1985-05-17 | 1995-05-15 | 株式会社日立製作所 | 端子接続方法および装置 |
JPH0818125B2 (ja) * | 1989-10-03 | 1996-02-28 | 日本電気株式会社 | レーザはんだ付け装置 |
JP3246189B2 (ja) | 1994-06-28 | 2002-01-15 | 株式会社日立製作所 | 半導体表示装置 |
US6278078B1 (en) * | 1999-06-02 | 2001-08-21 | Lockheed Martin Corporation | Laser soldering method |
JP2006156446A (ja) * | 2004-11-25 | 2006-06-15 | Shinka Jitsugyo Kk | 半田付け方法及び装置 |
JP2007067165A (ja) * | 2005-08-31 | 2007-03-15 | Matsushita Electric Ind Co Ltd | 光照射条件抽出方法および光照射条件抽出装置およびはんだ付け装置 |
JP2008173659A (ja) * | 2007-01-17 | 2008-07-31 | Japan Unix Co Ltd | はんだ付け用レーザーヘッド |
CN102717598B (zh) * | 2007-02-21 | 2014-12-17 | 武藏工业株式会社 | 喷墨喷头涂布控制方法 |
CN101428372B (zh) * | 2008-11-26 | 2011-05-25 | 深圳市大族激光科技股份有限公司 | 一种半导体激光焊接方法 |
JP5495574B2 (ja) * | 2009-01-16 | 2014-05-21 | パナソニック株式会社 | レーザはんだ付け方法 |
JP5294916B2 (ja) * | 2009-02-17 | 2013-09-18 | パナソニック株式会社 | レーザはんだ付け装置 |
WO2010098921A2 (en) * | 2009-02-27 | 2010-09-02 | Georgia Tech Research Corporation | High speed autofocus interferometric inspection systems & methods |
CN102139412B (zh) * | 2011-03-18 | 2014-10-01 | 宁波镭基光电技术有限公司 | 一种激光焊接方法 |
JP6294084B2 (ja) * | 2014-01-10 | 2018-03-14 | 株式会社アマダミヤチ | レーザ溶接方法及びレーザ溶接システム |
JP5941113B2 (ja) * | 2014-09-30 | 2016-06-29 | ファナック株式会社 | 集光径を拡大できるレーザ加工装置 |
-
2017
- 2017-04-28 JP JP2017090417A patent/JP6913350B2/ja active Active
-
2018
- 2018-04-24 KR KR1020197029708A patent/KR102490907B1/ko active IP Right Grant
- 2018-04-24 SG SG11201909904X patent/SG11201909904XA/en unknown
- 2018-04-24 US US16/607,922 patent/US11453076B2/en active Active
- 2018-04-24 CN CN201880028068.7A patent/CN110621432B/zh active Active
- 2018-04-24 WO PCT/JP2018/016599 patent/WO2018199086A1/ja active Application Filing
- 2018-04-24 EP EP18790294.5A patent/EP3616819B1/en active Active
- 2018-04-27 TW TW107114545A patent/TWI775845B/zh active
-
2019
- 2019-10-28 PH PH12019550234A patent/PH12019550234A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20200094336A1 (en) | 2020-03-26 |
EP3616819A4 (en) | 2021-02-17 |
WO2018199086A1 (ja) | 2018-11-01 |
JP2018187638A (ja) | 2018-11-29 |
EP3616819B1 (en) | 2024-04-03 |
TWI775845B (zh) | 2022-09-01 |
EP3616819A1 (en) | 2020-03-04 |
KR20200002812A (ko) | 2020-01-08 |
US11453076B2 (en) | 2022-09-27 |
TW201842999A (zh) | 2018-12-16 |
CN110621432B (zh) | 2021-10-26 |
KR102490907B1 (ko) | 2023-01-19 |
JP6913350B2 (ja) | 2021-08-04 |
PH12019550234A1 (en) | 2020-07-06 |
CN110621432A (zh) | 2019-12-27 |
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