SG11201903503TA - Apparatus and method for cleaning semiconductor wafers - Google Patents

Apparatus and method for cleaning semiconductor wafers

Info

Publication number
SG11201903503TA
SG11201903503TA SG11201903503TA SG11201903503TA SG11201903503TA SG 11201903503T A SG11201903503T A SG 11201903503TA SG 11201903503T A SG11201903503T A SG 11201903503TA SG 11201903503T A SG11201903503T A SG 11201903503TA SG 11201903503T A SG11201903503T A SG 11201903503TA
Authority
SG
Singapore
Prior art keywords
shanghai
semiconductor wafer
international
bld
ultra
Prior art date
Application number
SG11201903503TA
Inventor
Hui Wang
Xi Wang
Zhenming Chu
Fuping Chen
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11201903503TA publication Critical patent/SG11201903503TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 1#11101111 0 11101 HOE HI 1 0 011101 Ell Ell 01111101011 MEV OEN Organization International Bureau (10) International Publication Number (43) International Publication Date ......0\"\" WO 2018/076152 Al 03 May 2018 (03.05.2018) WIP01 PCT (51) International Patent Classification: ming; Bld. 4, No. 1690 Cailun Road, Zhangjiang High-Tech B08B 3/12 (2006.01) H01L 21/00 (2006.01) Park, Shanghai 201203 (CN). CHEN, Fuping; Bld. 4, No. (21) International Application Number: 1690 Cailun Road, Zhangjiang High-Tech Park, Shanghai 201203 (CN). PCT/CN2016/103151 (22) International Filing Date: (74) Agent: SHANGHAI PATENT & TRADEMARK LAW 25 October 2016 (25.10.2016) OFFICE, LLC; 435 Guiping Road, Shanghai 200233 (CN). (25) Filing Language: English (81) Designated States (unless otherwise indicated, for every (26) Publication Language: English kind of national protection available): AE, AG, AL, AM, (71) Applicant: ACM RESEARCH (SHANGHAI) INC. AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, [CN/CN]; Bld. 4, No. 1690 Cailun Road, Zhangjiang High- DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, Tech Park, Shanghai 201203 (CN). HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KW, (72) Inventors: WANG, Hui; Bld. 4, No. 1690 Cailun Road, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, Zhangjiang High-Tech Park, Shanghai 201203 (CN). MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, WANG, Xi; Bld. 4, No. 1690 Cailun Road, Zhangjiang PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, High-Tech Park, Shanghai 201203 (CN). CHU, Zhen- (54) Title: APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR WAFERS 112 . / 103 102 Cm4 1 I i 101 „........_ ....„ 1 104 108 _ ---, /// / 4 / - , 4 107 113 107 / 106 Fig. 1A 105 111 1— H ..0 (57) : An apparatus for cleaning a semiconductor wafer comprises a chuck (106), an ultra or mega sonic device, an actuator (1 1 3 ), at least one dispenser (108, 209) and a rotating driving mechanism (111). The chuck (106) holds the semiconductor wafer (105). N The actuator (113) drives the ultra or mage sonic device to a position above the surface of the semiconductor wafer (105) and a gap iln is formed between the ultra or mega sonic device and the surface of the semiconductor wafer (105). The at least one dispenser (108, 11 ,t: 209) sprays cleaning liquid on the surface of the semiconductor wafer (105). The rotating driving mechanism drives the chuck (106) IN to rotate at a spin speed lower than a set spin speed for ensuring that the gap between the ultra or mega sonic device and the surface of 0 --.... the semiconductor wafer (105) is fully and continuously filled with the cleaning liquid (104), making the ultra or mega sonic energy ° Il O be stably transferred to the entire surface of the semiconductor wafer (105) through the cleaning liquid (104). A method for cleaning C a semiconductor wafer is also disclosed. ei C [Continued on next page] WO 2018/076152 Al 111111111111111111101010111110111110111011111111111111110111111111111111110111111111111 SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
SG11201903503TA 2016-10-25 2016-10-25 Apparatus and method for cleaning semiconductor wafers SG11201903503TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/103151 WO2018076152A1 (en) 2016-10-25 2016-10-25 Apparatus and method for cleaning semiconductor wafers

Publications (1)

Publication Number Publication Date
SG11201903503TA true SG11201903503TA (en) 2019-05-30

Family

ID=62023025

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201903503TA SG11201903503TA (en) 2016-10-25 2016-10-25 Apparatus and method for cleaning semiconductor wafers

Country Status (6)

Country Link
US (1) US20190252215A1 (en)
JP (2) JP2019533314A (en)
KR (1) KR20190062526A (en)
CN (1) CN109890520A (en)
SG (1) SG11201903503TA (en)
WO (1) WO2018076152A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102216351B1 (en) 2020-08-21 2021-02-17 (주)네온테크 Semiconductor Chip Washing Machine And Semiconductor Chip Making Method Using The Same
CN114308798B (en) * 2020-10-10 2023-03-31 中国科学院微电子研究所 Cleaning assembly
CN112768378B (en) * 2020-12-31 2023-02-10 上海至纯洁净系统科技股份有限公司 Staggered wafer surface wet cleaning system and cleaning method
CN117299666A (en) * 2022-06-23 2023-12-29 盛美半导体设备(上海)股份有限公司 Substrate processing apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154471A (en) * 1997-08-05 1999-02-26 Tokyo Electron Ltd Treatment device and treatment method
JP2002280343A (en) * 2001-03-15 2002-09-27 Nec Corp Cleaning process apparatus and cutting work apparatus
US6730176B2 (en) * 2001-07-09 2004-05-04 Birol Kuyel Single wafer megasonic cleaner method, system, and apparatus
KR100520819B1 (en) * 2003-02-25 2005-10-12 삼성전자주식회사 method of cleaning a substrate
JP2009536450A (en) * 2006-05-05 2009-10-08 ラム・リサーチ・アクチエンゲゼルシヤフト Apparatus and method for wet processing of plate-like substrate
JP4532580B2 (en) * 2008-08-20 2010-08-25 株式会社カイジョー Ultrasonic cleaning equipment
WO2010066081A1 (en) * 2008-12-12 2010-06-17 Acm Research (Shanghai) Inc. Methods and apparatus for cleaning semiconductor wafers
EP2226834B1 (en) * 2009-03-06 2020-04-29 IMEC vzw Method for physical force assisted cleaning with reduced damage
CN101879511B (en) * 2009-05-08 2013-01-02 盛美半导体设备（上海）有限公司 Method and device for cleaning semiconductor silicon wafer
US9044794B2 (en) * 2009-12-31 2015-06-02 Lam Research Ag Ultrasonic cleaning fluid, method and apparatus
US9796000B2 (en) * 2011-07-04 2017-10-24 Product Systems Incorporated Uniform fluid manifold for acoustic transducer
CN102641869A (en) * 2012-04-17 2012-08-22 北京七星华创电子股份有限公司 Wafer cleaning device and cleaning method

Also Published As

Publication number Publication date
CN109890520A (en) 2019-06-14
JP2021177578A (en) 2021-11-11
US20190252215A1 (en) 2019-08-15
WO2018076152A1 (en) 2018-05-03
JP7348932B2 (en) 2023-09-21
KR20190062526A (en) 2019-06-05
JP2019533314A (en) 2019-11-14

Similar Documents

Publication Publication Date Title
SG11201903503TA (en) Apparatus and method for cleaning semiconductor wafers
SG11201903365SA (en) Elastic wave device with sub-wavelength thick piezoelectric layer
SG11201407650VA (en) Composition and process for stripping photoresist from a surface including titanium nitride
SG11201408451WA (en) Use of vacuum chucks to hold a wafer or wafer sub-stack
SG11201806322QA (en) Maytansinoid derivatives, conjugates thereof, and methods of use
SG11201810381QA (en) Facilitating rider pick-up for a self-driving vehicle
SG11201407657YA (en) Aqueous clean solution with low copper etch rate for organic residue removal improvement
SG11201808355TA (en) Method and apparatus for pausing uplink transmission during a transmission time interval
SG11201811778PA (en) Substrate supporting apparatus
SG11201906905XA (en) Subnanometer-level light-based substrate cleaning mechanism
SG11201810486VA (en) High resistivity single crystal silicon ingot and wafer having improved mechanical strength
SG11201407845VA (en) Photoactivated etching paste and its use
SG11201809356YA (en) Multilayer coating and process of preparing the multilayer coating
SG11201407294UA (en) Contamination identification system
SG11201407800SA (en) Selective binding of biological targets to solid phase ureides
SG11201809942WA (en) Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
SG11201407801VA (en) Methods for use of mixed multifunctional surfaces for reducing aggregate content in protein preparations
SG11201809685XA (en) A method of enhancing the performance of chromatography methods for purification of proteins
SG11201902257TA (en) Process for the generation of thin silicon-containing films
SG11201804440XA (en) Chemical reprogramming of human glial cells into neurons with small molecule cocktail
SG11201907369TA (en) Anti-factor d antibodies and uses thereof
SG11201805283UA (en) Wafer singulation process control
SG11201903502WA (en) Apparatus and method for wet process on semiconductor substrate
SG11201909298UA (en) Aligner apparatus and methods
SG11201906903PA (en) Sub-nanometer-level substrate cleaning mechanism