SG11201805283UA - Wafer singulation process control - Google Patents
Wafer singulation process controlInfo
- Publication number
- SG11201805283UA SG11201805283UA SG11201805283UA SG11201805283UA SG11201805283UA SG 11201805283U A SG11201805283U A SG 11201805283UA SG 11201805283U A SG11201805283U A SG 11201805283UA SG 11201805283U A SG11201805283U A SG 11201805283UA SG 11201805283U A SG11201805283U A SG 11201805283UA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- singulation
- czaja
- massachusetts
- english
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/10—Segmentation; Edge detection
- G06T7/13—Edge detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/764—Air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20212—Image combination
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
- G06T7/33—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/50—Depth or shape recovery
- G06T7/55—Depth or shape recovery from multiple images
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
- G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
- G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Dicing (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 6 July 2017 (06.07.2017) WIPOIPCT (10) International Publication Number WO 2017/117051 A1 (51) International Patent Classification: H01L 21/78 (2006.01) H01L 21/02 (2006.01) H01L 21/76 (2006.01) H01L 21/764 (2006.01) (21) International Application Number: (22) International Filing Date: (25) Filing Language: (26) Publication Language: PCT/US2016/068519 23 December 2016 (23.12.2016) English (30) Priority Data: 62/272,876 30 December 2015 (30.12.2015) (71) Applicant: RUDOLPH TECHNOLOGIES, INC. [US/US]; 16 Jonspin Road, Wilmington, Massachusetts 01887 (US). (72) Inventor: FITZGERALD, Wayne; 460 River Road, Apt 328, Andover, Massachusetts 01810 (US). AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. US English (84) Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). (74) Agents: CZAJA, Timothy A. et al.; Dicke, Billig & Czaja, PLLC, 100 South Fifth Street, Suite 2250, Minneapolis, Minnesota 55402 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, Declarations under Rule 4.17: — as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(H)) Published: — with international search report (Art. 21(3)) (54) Title: WAFER SINGULATION PROCESS CONTROL 54 n 52 56 26 ... 50 (57) : A method for monitor ing and controlling a substrate singula tion process is described. Device edges are imaged and identified for analysis. Discrepancies in device edges are noted and used to modify a singulation pro cess and to monitor the operation of singulation processes for anomalous be havior. 20 o i> Fig. 1 O CJ o £
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562272876P | 2015-12-30 | 2015-12-30 | |
PCT/US2016/068519 WO2017117051A1 (en) | 2015-12-30 | 2016-12-23 | Wafer singulation process control |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201805283UA true SG11201805283UA (en) | 2018-07-30 |
Family
ID=59225820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201805283UA SG11201805283UA (en) | 2015-12-30 | 2016-12-23 | Wafer singulation process control |
Country Status (8)
Country | Link |
---|---|
US (1) | US11315832B2 (en) |
EP (1) | EP3398204A4 (en) |
JP (1) | JP6966448B2 (en) |
KR (1) | KR20180089543A (en) |
CN (1) | CN108701650A (en) |
SG (1) | SG11201805283UA (en) |
TW (1) | TWI713083B (en) |
WO (1) | WO2017117051A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020504320A (en) * | 2016-11-18 | 2020-02-06 | ヴェンタナ メディカル システムズ, インク. | Method and system for detecting substrate placement accuracy |
JP2020043266A (en) * | 2018-09-12 | 2020-03-19 | 株式会社日立ハイテクノロジーズ | Semiconductor wafer defect observation system and defect observation method |
DE102019209088A1 (en) * | 2019-06-24 | 2020-12-24 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for evaluating a laser cut edge, mobile device and system |
JP7296835B2 (en) | 2019-09-19 | 2023-06-23 | 株式会社ディスコ | WAFER PROCESSING METHOD AND CHIP MEASURING DEVICE |
CN117067112B (en) * | 2023-10-17 | 2024-01-16 | 杭州泓芯微半导体有限公司 | Water cutting machine and control method thereof |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5419366A (en) * | 1977-07-14 | 1979-02-14 | Nippon Jidoseigyo Ltd | Device for inspecting fault of pattern |
JPH0680728B2 (en) * | 1984-03-31 | 1994-10-12 | 東芝精機株式会社 | Angle adjusting method of dicing line and pellet bonding apparatus |
JPH0623999B2 (en) * | 1986-07-28 | 1994-03-30 | 株式会社日立製作所 | Pattern defect detection method |
JPH03236260A (en) | 1990-02-14 | 1991-10-22 | Sumitomo Electric Ind Ltd | Dicing apparatus for semiconductor wafer |
JP2628256B2 (en) * | 1992-05-15 | 1997-07-09 | 株式会社ディスコ | Automatic dicing system based on calf check |
JP3252472B2 (en) | 1992-08-31 | 2002-02-04 | ダイキン工業株式会社 | Fluorine-containing copolymer |
JP3280747B2 (en) | 1993-05-11 | 2002-05-13 | 株式会社東京精密 | Dicing processing management method and processing quality management system |
US5710825A (en) | 1995-03-31 | 1998-01-20 | Seiko Seiki Kabushiki Kaisha | Cutting line measuring apparatus |
IL120656A (en) | 1997-04-13 | 2001-04-30 | Inspectech Ltd | Apparatus for analyzing cuts |
US20020114507A1 (en) * | 2001-02-21 | 2002-08-22 | Mark Lynch | Saw alignment technique for array device singulation |
TW591237B (en) * | 2002-07-31 | 2004-06-11 | Advanced Semiconductor Eng | Semiconductor wafer and testing method for the same |
JP4238041B2 (en) * | 2003-02-06 | 2009-03-11 | アドバンスト ダイシング テクノロジース リミテッド | Dicing apparatus, dicing method, and manufacturing method of semiconductor device |
JP2004288761A (en) * | 2003-03-20 | 2004-10-14 | Renesas Technology Corp | Test method of semiconductor device |
US7041578B2 (en) * | 2003-07-02 | 2006-05-09 | Texas Instruments Incorporated | Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment including the backside |
JP2009074952A (en) * | 2007-09-21 | 2009-04-09 | Nec Electronics Corp | Visual inspection method |
SG188094A1 (en) * | 2008-01-30 | 2013-03-28 | Rudolph Technologies Inc | High resolution edge inspection |
JP2011061069A (en) | 2009-09-11 | 2011-03-24 | Renesas Electronics Corp | Method for manufacturing semiconductor device |
CN101701801A (en) * | 2009-11-17 | 2010-05-05 | 博磊科技股份有限公司 | Method for inspecting non-workpiece shear mark |
US9165832B1 (en) * | 2014-06-30 | 2015-10-20 | Applied Materials, Inc. | Method of die singulation using laser ablation and induction of internal defects with a laser |
JP6465722B2 (en) * | 2015-04-06 | 2019-02-06 | 株式会社ディスコ | Processing equipment |
-
2016
- 2016-12-23 KR KR1020187021613A patent/KR20180089543A/en not_active Application Discontinuation
- 2016-12-23 SG SG11201805283UA patent/SG11201805283UA/en unknown
- 2016-12-23 CN CN201680080297.4A patent/CN108701650A/en active Pending
- 2016-12-23 EP EP16882467.0A patent/EP3398204A4/en not_active Withdrawn
- 2016-12-23 US US16/067,748 patent/US11315832B2/en active Active
- 2016-12-23 JP JP2018532444A patent/JP6966448B2/en active Active
- 2016-12-23 WO PCT/US2016/068519 patent/WO2017117051A1/en active Application Filing
- 2016-12-27 TW TW105143386A patent/TWI713083B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI713083B (en) | 2020-12-11 |
EP3398204A4 (en) | 2019-08-21 |
JP2019500754A (en) | 2019-01-10 |
KR20180089543A (en) | 2018-08-08 |
TW201737303A (en) | 2017-10-16 |
US11315832B2 (en) | 2022-04-26 |
US20190019728A1 (en) | 2019-01-17 |
CN108701650A (en) | 2018-10-23 |
EP3398204A1 (en) | 2018-11-07 |
WO2017117051A1 (en) | 2017-07-06 |
JP6966448B2 (en) | 2021-11-17 |
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