SG11201805283UA - Wafer singulation process control - Google Patents

Wafer singulation process control

Info

Publication number
SG11201805283UA
SG11201805283UA SG11201805283UA SG11201805283UA SG11201805283UA SG 11201805283U A SG11201805283U A SG 11201805283UA SG 11201805283U A SG11201805283U A SG 11201805283UA SG 11201805283U A SG11201805283U A SG 11201805283UA SG 11201805283U A SG11201805283U A SG 11201805283UA
Authority
SG
Singapore
Prior art keywords
international
singulation
czaja
massachusetts
english
Prior art date
Application number
SG11201805283UA
Inventor
Wayne Fitzgerald
Original Assignee
Rudolph Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rudolph Technologies Inc filed Critical Rudolph Technologies Inc
Publication of SG11201805283UA publication Critical patent/SG11201805283UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02021—Edge treatment, chamfering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/764—Air gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/30—Determination of transform parameters for the alignment of images, i.e. image registration
    • G06T7/33—Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/55—Depth or shape recovery from multiple images
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Dicing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 6 July 2017 (06.07.2017) WIPOIPCT (10) International Publication Number WO 2017/117051 A1 (51) International Patent Classification: H01L 21/78 (2006.01) H01L 21/02 (2006.01) H01L 21/76 (2006.01) H01L 21/764 (2006.01) (21) International Application Number: (22) International Filing Date: (25) Filing Language: (26) Publication Language: PCT/US2016/068519 23 December 2016 (23.12.2016) English (30) Priority Data: 62/272,876 30 December 2015 (30.12.2015) (71) Applicant: RUDOLPH TECHNOLOGIES, INC. [US/US]; 16 Jonspin Road, Wilmington, Massachusetts 01887 (US). (72) Inventor: FITZGERALD, Wayne; 460 River Road, Apt 328, Andover, Massachusetts 01810 (US). AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. US English (84) Designated States (unless otherwise indicated, for every kind of regional protection available)'. ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). (74) Agents: CZAJA, Timothy A. et al.; Dicke, Billig & Czaja, PLLC, 100 South Fifth Street, Suite 2250, Minneapolis, Minnesota 55402 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available)'. AE, AG, AL, AM, Declarations under Rule 4.17: — as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(H)) Published: — with international search report (Art. 21(3)) (54) Title: WAFER SINGULATION PROCESS CONTROL 54 n 52 56 26 ... 50 (57) : A method for monitor­ ing and controlling a substrate singula­ tion process is described. Device edges are imaged and identified for analysis. Discrepancies in device edges are noted and used to modify a singulation pro­ cess and to monitor the operation of singulation processes for anomalous be­ havior. 20 o i> Fig. 1 O CJ o £
SG11201805283UA 2015-12-30 2016-12-23 Wafer singulation process control SG11201805283UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562272876P 2015-12-30 2015-12-30
PCT/US2016/068519 WO2017117051A1 (en) 2015-12-30 2016-12-23 Wafer singulation process control

Publications (1)

Publication Number Publication Date
SG11201805283UA true SG11201805283UA (en) 2018-07-30

Family

ID=59225820

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201805283UA SG11201805283UA (en) 2015-12-30 2016-12-23 Wafer singulation process control

Country Status (8)

Country Link
US (1) US11315832B2 (en)
EP (1) EP3398204A4 (en)
JP (1) JP6966448B2 (en)
KR (1) KR20180089543A (en)
CN (1) CN108701650A (en)
SG (1) SG11201805283UA (en)
TW (1) TWI713083B (en)
WO (1) WO2017117051A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020504320A (en) * 2016-11-18 2020-02-06 ヴェンタナ メディカル システムズ， インク． Method and system for detecting substrate placement accuracy
JP2020043266A (en) * 2018-09-12 2020-03-19 株式会社日立ハイテクノロジーズ Semiconductor wafer defect observation system and defect observation method
DE102019209088A1 (en) * 2019-06-24 2020-12-24 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method for evaluating a laser cut edge, mobile device and system
JP7296835B2 (en) * 2019-09-19 2023-06-23 株式会社ディスコ WAFER PROCESSING METHOD AND CHIP MEASURING DEVICE
CN117067112B (en) * 2023-10-17 2024-01-16 杭州泓芯微半导体有限公司 Water cutting machine and control method thereof

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JPS5419366A (en) * 1977-07-14 1979-02-14 Nippon Jidoseigyo Ltd Device for inspecting fault of pattern
JPH0680728B2 (en) * 1984-03-31 1994-10-12 東芝精機株式会社 Angle adjusting method of dicing line and pellet bonding apparatus
JPH0623999B2 (en) * 1986-07-28 1994-03-30 株式会社日立製作所 Pattern defect detection method
JPH03236260A (en) * 1990-02-14 1991-10-22 Sumitomo Electric Ind Ltd Dicing apparatus for semiconductor wafer
JP2628256B2 (en) * 1992-05-15 1997-07-09 株式会社ディスコ Automatic dicing system based on calf check
JP3252472B2 (en) 1992-08-31 2002-02-04 ダイキン工業株式会社 Fluorine-containing copolymer
JP3280747B2 (en) 1993-05-11 2002-05-13 株式会社東京精密 Dicing processing management method and processing quality management system
US5710825A (en) * 1995-03-31 1998-01-20 Seiko Seiki Kabushiki Kaisha Cutting line measuring apparatus
IL120656A (en) * 1997-04-13 2001-04-30 Inspectech Ltd Apparatus for analyzing cuts
US20020114507A1 (en) 2001-02-21 2002-08-22 Mark Lynch Saw alignment technique for array device singulation
TW591237B (en) * 2002-07-31 2004-06-11 Advanced Semiconductor Eng Semiconductor wafer and testing method for the same
JP4238041B2 (en) 2003-02-06 2009-03-11 アドバンスト ダイシング テクノロジース リミテッド Dicing apparatus, dicing method, and manufacturing method of semiconductor device
JP2004288761A (en) * 2003-03-20 2004-10-14 Renesas Technology Corp Test method of semiconductor device
US7041578B2 (en) * 2003-07-02 2006-05-09 Texas Instruments Incorporated Method for reducing stress concentrations on a semiconductor wafer by surface laser treatment including the backside
JP2009074952A (en) * 2007-09-21 2009-04-09 Nec Electronics Corp Visual inspection method
US20090196489A1 (en) * 2008-01-30 2009-08-06 Le Tuan D High resolution edge inspection
JP2011061069A (en) 2009-09-11 2011-03-24 Renesas Electronics Corp Method for manufacturing semiconductor device
CN101701801A (en) * 2009-11-17 2010-05-05 博磊科技股份有限公司 Method for inspecting non-workpiece shear mark
US9165832B1 (en) * 2014-06-30 2015-10-20 Applied Materials, Inc. Method of die singulation using laser ablation and induction of internal defects with a laser
JP6465722B2 (en) * 2015-04-06 2019-02-06 株式会社ディスコ Processing equipment

Also Published As

Publication number Publication date
TW201737303A (en) 2017-10-16
KR20180089543A (en) 2018-08-08
JP2019500754A (en) 2019-01-10
WO2017117051A1 (en) 2017-07-06
EP3398204A1 (en) 2018-11-07
JP6966448B2 (en) 2021-11-17
US20190019728A1 (en) 2019-01-17
EP3398204A4 (en) 2019-08-21
CN108701650A (en) 2018-10-23
US11315832B2 (en) 2022-04-26
TWI713083B (en) 2020-12-11

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