SG11201901210UA - Ferroelectric memory cells - Google Patents
Ferroelectric memory cellsInfo
- Publication number
- SG11201901210UA SG11201901210UA SG11201901210UA SG11201901210UA SG11201901210UA SG 11201901210U A SG11201901210U A SG 11201901210UA SG 11201901210U A SG11201901210U A SG 11201901210UA SG 11201901210U A SG11201901210U A SG 11201901210UA SG 11201901210U A SG11201901210U A SG 11201901210UA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- ferroelectric memory
- boise
- idaho
- capacitors
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/221—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements using ferroelectric capacitors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/225—Auxiliary circuits
- G11C11/2253—Address circuits or decoders
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/225—Auxiliary circuits
- G11C11/2259—Cell access
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/225—Auxiliary circuits
- G11C11/2273—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/225—Auxiliary circuits
- G11C11/2275—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/225—Auxiliary circuits
- G11C11/2293—Timing circuits or methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
- H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/20—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the three-dimensional arrangements, e.g. with cells on different height levels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/225—Auxiliary circuits
- G11C11/2253—Address circuits or decoders
- G11C11/2257—Word-line or row circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Semiconductor Memories (AREA)
- Dram (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 111111411 0 11101 HOE 3E1 0 011101 111011101111111111011110111011# Organization International Bureau (10) International Publication Number (43) International Publication Date .....0\"\" WO 2018/044485 Al 08 March 2018 (08.03.2018) WIP0 I PCT (51) International Patent Classification: KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, Gl1C 11/22 (2006.01) H01L 27/11507 (2017.01) MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, (21) International Application Number: OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, PCT/US2017/045167 SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (22) International Filing Date: (84) Designated States (unless otherwise indicated, for every 02 August 2017 (02.08.2017) kind of regional protection available): ARIPO (BW, GH, (25) Filing Language: English GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, (26) Publication Language: English UG, TM), ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, (30) Priority Data: EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, 62/381,942 31 August 2016 (31.08.2016) US MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, (71) Applicant: MICRON TECHNOLOGY, INC. [US/US]; KM, ML, MR, NE, SN, TD, TG). 8000 South Federal Way, Boise, Idaho 83716 (US). (72) Inventors: DERNER, Scott J.; 5032 E. Sagewood Drive, Published: Boise, Idaho 83716 (US). KAWAMURA, Christopher J.; — with international search report (Art. 21(3)) 1778 S. Toluka Way, Boise, Idaho 83712 (US). (74) Agent: ENG, Kimton et al.; Dorsey & Whitney LLP, 701 5th Ave, Suite 6100, Seattle, Washington 98104 (US). Designated States (unless otherwise indicated, for every = (81) kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, =_ CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, = (54) Title: FERROELECTRIC MEMORY CELLS = (57) : Apparatuses and methods are disclosed that include ferro- 0-10 electric memory cells. An example ferroelectric memory cell includes two transistors and two capacitors. Another example ferroelectric memory cell SA includes three transistors and two capacitors. Another example ferroelec- = _ = tric memory cell includes four transistors and two capacitors. = = MC(0) 105 = = M 1 105 1-1 • WIN ir) MCA) . GC 71' /05 71' 71' 0 --.... CP 00 1-1 © el FIG, 2A 0
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662381942P | 2016-08-31 | 2016-08-31 | |
PCT/US2017/045167 WO2018044485A1 (en) | 2016-08-31 | 2017-08-02 | Ferroelectric memory cells |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201901210UA true SG11201901210UA (en) | 2019-03-28 |
Family
ID=61243175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201901210UA SG11201901210UA (en) | 2016-08-31 | 2017-08-02 | Ferroelectric memory cells |
Country Status (8)
Country | Link |
---|---|
US (4) | US10153018B2 (en) |
EP (1) | EP3507804A4 (en) |
JP (1) | JP6980006B2 (en) |
KR (2) | KR102227270B1 (en) |
CN (1) | CN109791784A (en) |
SG (1) | SG11201901210UA (en) |
TW (2) | TWI716011B (en) |
WO (1) | WO2018044485A1 (en) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3507805A4 (en) | 2016-08-31 | 2020-06-03 | Micron Technology, Inc. | Apparatuses and methods including ferroelectric memory and for operating ferroelectric memory |
WO2018044487A1 (en) | 2016-08-31 | 2018-03-08 | Micron Technology, Inc. | Apparatuses and methods including ferroelectric memory and for accessing ferroelectric memory |
KR102227270B1 (en) | 2016-08-31 | 2021-03-15 | 마이크론 테크놀로지, 인크. | Ferroelectric memory cell |
KR102314663B1 (en) | 2016-08-31 | 2021-10-21 | 마이크론 테크놀로지, 인크. | Apparatus and method for including and accessing a 2 transistor-1 capacitor memory |
US10867675B2 (en) | 2017-07-13 | 2020-12-15 | Micron Technology, Inc. | Apparatuses and methods for memory including ferroelectric memory cells and dielectric memory cells |
US10790008B2 (en) * | 2017-08-29 | 2020-09-29 | Micron Technology, Inc. | Volatile memory device with 3-D structure including vertical pillars and memory cells vertically stacked one over anoher in multiple levels |
US10446502B2 (en) | 2017-08-30 | 2019-10-15 | Micron, Technology, Inc. | Apparatuses and methods for shielded memory architecture |
US10762944B2 (en) | 2017-12-18 | 2020-09-01 | Micron Technology, Inc. | Single plate configuration and memory array operation |
US10529410B2 (en) | 2017-12-18 | 2020-01-07 | Micron Technology, Inc. | Techniques for accessing an array of memory cells to reduce parasitic coupling |
US10600468B2 (en) | 2018-08-13 | 2020-03-24 | Wuxi Petabyte Technologies Co, Ltd. | Methods for operating ferroelectric memory cells each having multiple capacitors |
US10403631B1 (en) * | 2018-08-13 | 2019-09-03 | Wuxi Petabyte Technologies Co., Ltd. | Three-dimensional ferroelectric memory devices |
US10991411B2 (en) | 2018-08-17 | 2021-04-27 | Micron Technology, Inc. | Method and apparatuses for performing a voltage adjustment operation on a section of memory cells based on a quantity of access operations |
US10431281B1 (en) * | 2018-08-17 | 2019-10-01 | Micron Technology, Inc. | Access schemes for section-based data protection in a memory device |
US11393927B2 (en) * | 2018-09-26 | 2022-07-19 | Intel Coropration | Memory cells based on thin-film transistors |
US10886286B2 (en) * | 2018-09-28 | 2021-01-05 | Intel Corporation | Vertical memory control circuitry located in interconnect layers |
US10796729B2 (en) | 2019-02-05 | 2020-10-06 | Micron Technology, Inc. | Dynamic allocation of a capacitive component in a memory device |
US11194726B2 (en) | 2019-02-25 | 2021-12-07 | Micron Technology, Inc. | Stacked memory dice for combined access operations |
US11476261B2 (en) | 2019-02-27 | 2022-10-18 | Kepler Computing Inc. | High-density low voltage non-volatile memory with unidirectional plate-line and bit-line and pillar capacitor |
JP7313853B2 (en) * | 2019-03-22 | 2023-07-25 | キオクシア株式会社 | semiconductor memory |
US11062763B2 (en) | 2019-04-09 | 2021-07-13 | Micron Technology, Inc. | Memory array with multiplexed digit lines |
US11017831B2 (en) | 2019-07-15 | 2021-05-25 | Micron Technology, Inc. | Ferroelectric memory cell access |
JP2021048193A (en) * | 2019-09-17 | 2021-03-25 | キオクシア株式会社 | Semiconductor storage device |
DE102020119199A1 (en) | 2019-10-23 | 2021-04-29 | Taiwan Semiconductor Manufacturing Co. Ltd. | 3D FERROELECTRIC MEMORY |
US11411025B2 (en) * | 2019-10-23 | 2022-08-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D ferroelectric memory |
KR20210103143A (en) | 2020-02-13 | 2021-08-23 | 삼성전자주식회사 | Semiconductor memory device and method for fabricating thereof |
KR20210104348A (en) * | 2020-02-17 | 2021-08-25 | 삼성전자주식회사 | Semiconductor memory device and method for fabricating thereof |
US11404444B2 (en) | 2020-05-29 | 2022-08-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Three-dimensional memory device and methods of forming |
DE102020128720B4 (en) * | 2020-05-29 | 2023-03-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | MEMORY DEVICE AND METHOD OF FORMING A MEMORY DEVICE |
US11476262B2 (en) | 2020-07-28 | 2022-10-18 | Micron Technology, Inc. | Methods of forming an array of capacitors |
US11450377B2 (en) * | 2020-07-29 | 2022-09-20 | Micron Technology, Inc. | Apparatuses and methods including memory cells, digit lines, and sense amplifiers |
US11527277B1 (en) | 2021-06-04 | 2022-12-13 | Kepler Computing Inc. | High-density low voltage ferroelectric memory bit-cell |
US11737283B1 (en) | 2021-11-01 | 2023-08-22 | Kepler Computing Inc. | Method of forming a stack of non-planar capacitors including capacitors with non-linear polar material and linear dielectric for common mode compensation in a memory bit-cell |
US11482270B1 (en) | 2021-11-17 | 2022-10-25 | Kepler Computing Inc. | Pulsing scheme for a ferroelectric memory bit-cell to minimize read or write disturb effect and refresh logic |
WO2023115418A1 (en) * | 2021-12-22 | 2023-06-29 | 华为技术有限公司 | Ferroelectric memory and electronic device |
US11997853B1 (en) | 2022-03-07 | 2024-05-28 | Kepler Computing Inc. | 1TnC memory bit-cell having stacked and folded planar capacitors with lateral offset |
Family Cites Families (122)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4103342A (en) | 1976-06-17 | 1978-07-25 | International Business Machines Corporation | Two-device memory cell with single floating capacitor |
US4873664A (en) | 1987-02-12 | 1989-10-10 | Ramtron Corporation | Self restoring ferroelectric memory |
US4853893A (en) | 1987-07-02 | 1989-08-01 | Ramtron Corporation | Data storage device and method of using a ferroelectric capacitance divider |
US4888733A (en) | 1988-09-12 | 1989-12-19 | Ramtron Corporation | Non-volatile memory cell and sensing method |
US5400275A (en) * | 1990-06-08 | 1995-03-21 | Kabushiki Kaisha Toshiba | Semiconductor memory device using ferroelectric capacitor and having only one sense amplifier selected |
JP3169599B2 (en) | 1990-08-03 | 2001-05-28 | 株式会社日立製作所 | Semiconductor device, driving method thereof, and reading method thereof |
US5241503A (en) | 1991-02-25 | 1993-08-31 | Motorola, Inc. | Dynamic random access memory with improved page-mode performance and method therefor having isolator between memory cells and sense amplifiers |
US5218566A (en) * | 1991-08-15 | 1993-06-08 | National Semiconductor Corporation | Dynamic adjusting reference voltage for ferroelectric circuits |
US5350705A (en) * | 1992-08-25 | 1994-09-27 | National Semiconductor Corporation | Ferroelectric memory cell arrangement having a split capacitor plate structure |
US5309391A (en) | 1992-10-02 | 1994-05-03 | National Semiconductor Corporation | Symmetrical polarization enhancement in a ferroelectric memory cell |
JP3483210B2 (en) | 1992-10-12 | 2004-01-06 | ローム株式会社 | Ferroelectric nonvolatile memory device |
KR970000870B1 (en) | 1992-12-02 | 1997-01-20 | 마쯔시다덴기산교 가부시기가이샤 | Semiconductor memory device |
US5539279A (en) * | 1993-06-23 | 1996-07-23 | Hitachi, Ltd. | Ferroelectric memory |
US5381364A (en) * | 1993-06-24 | 1995-01-10 | Ramtron International Corporation | Ferroelectric-based RAM sensing scheme including bit-line capacitance isolation |
US5373463A (en) * | 1993-07-06 | 1994-12-13 | Motorola Inc. | Ferroelectric nonvolatile random access memory having drive line segments |
US5424975A (en) * | 1993-12-30 | 1995-06-13 | Micron Technology, Inc. | Reference circuit for a non-volatile ferroelectric memory |
JP3745392B2 (en) * | 1994-05-26 | 2006-02-15 | 株式会社ルネサステクノロジ | Semiconductor device |
JP3591790B2 (en) * | 1994-08-29 | 2004-11-24 | 東芝マイクロエレクトロニクス株式会社 | Ferroelectric memory, card and card system using the same |
US5798964A (en) * | 1994-08-29 | 1998-08-25 | Toshiba Corporation | FRAM, FRAM card, and card system using the same |
JP3590115B2 (en) | 1994-12-20 | 2004-11-17 | 株式会社日立製作所 | Semiconductor memory |
JP3186485B2 (en) | 1995-01-04 | 2001-07-11 | 日本電気株式会社 | Ferroelectric memory device and operation control method thereof |
US5675530A (en) * | 1995-08-02 | 1997-10-07 | Matsushita Electric Industrial Co., Ltd. | Ferroelectric memory device |
US5598366A (en) * | 1995-08-16 | 1997-01-28 | Ramtron International Corporation | Ferroelectric nonvolatile random access memory utilizing self-bootstrapping plate line segment drivers |
JPH09288891A (en) * | 1996-04-19 | 1997-11-04 | Matsushita Electron Corp | Semiconductor memory |
US5818771A (en) * | 1996-09-30 | 1998-10-06 | Hitachi, Ltd. | Semiconductor memory device |
US5912846A (en) * | 1997-02-28 | 1999-06-15 | Ramtron International Corporation | Serial ferroelectric random access memory architecture to equalize column accesses and improve data retention reliability by mitigating imprint effects |
JPH10270654A (en) * | 1997-03-27 | 1998-10-09 | Toshiba Corp | Semiconductor storage device |
US5915167A (en) | 1997-04-04 | 1999-06-22 | Elm Technology Corporation | Three dimensional structure memory |
JPH10320981A (en) * | 1997-05-19 | 1998-12-04 | Rohm Co Ltd | Ferro-dielectric material memory |
US5917746A (en) * | 1997-08-27 | 1999-06-29 | Micron Technology, Inc. | Cell plate structure for a ferroelectric memory |
KR100268444B1 (en) | 1997-08-30 | 2000-10-16 | 윤종용 | Ferroelectric random access memory device |
KR100297874B1 (en) * | 1997-09-08 | 2001-10-24 | 윤종용 | Ferroelectric random access memory device |
US5959878A (en) | 1997-09-15 | 1999-09-28 | Celis Semiconductor Corporation | Ferroelectric memory cell with shunted ferroelectric capacitor and method of making same |
JPH11110976A (en) | 1997-10-02 | 1999-04-23 | Mitsubishi Electric Corp | Non-volatile semiconductor storage device |
US6028783A (en) * | 1997-11-14 | 2000-02-22 | Ramtron International Corporation | Memory cell configuration for a 1T/1C ferroelectric memory |
US6072711A (en) * | 1997-12-12 | 2000-06-06 | Lg Semicon Co., Ltd. | Ferroelectric memory device without a separate cell plate line and method of making the same |
US6363002B1 (en) * | 1997-12-31 | 2002-03-26 | Texas Instruments Incorporated | Ferroelectric memory with bipolar drive pulses |
JP3495905B2 (en) | 1998-02-19 | 2004-02-09 | シャープ株式会社 | Semiconductor storage device |
JP4299913B2 (en) | 1998-04-13 | 2009-07-22 | 株式会社東芝 | Semiconductor memory device |
US6028784A (en) * | 1998-05-01 | 2000-02-22 | Texas Instruments Incorporated | Ferroelectric memory device having compact memory cell array |
JP3249470B2 (en) | 1998-06-05 | 2002-01-21 | 株式会社東芝 | Nonvolatile semiconductor memory device and method of manufacturing the same |
KR100282045B1 (en) * | 1998-08-07 | 2001-03-02 | 윤종용 | Nonvolatile Dynamic Random Access Memory with Ferroelectric Capacitors |
JP2000187989A (en) | 1998-12-24 | 2000-07-04 | Matsushita Electric Ind Co Ltd | Data storage device |
JP2000268581A (en) * | 1999-03-17 | 2000-09-29 | Fujitsu Ltd | Ferroelectric memory device storing rom data |
US6147895A (en) * | 1999-06-04 | 2000-11-14 | Celis Semiconductor Corporation | Ferroelectric memory with two ferroelectric capacitors in memory cell and method of operating same |
JP4350222B2 (en) | 1999-08-26 | 2009-10-21 | Okiセミコンダクタ株式会社 | Method of operating a ferroelectric memory device |
JP4253734B2 (en) | 1999-09-02 | 2009-04-15 | Okiセミコンダクタ株式会社 | Ferroelectric memory device and method of reading data from the device |
JP3617615B2 (en) * | 1999-11-08 | 2005-02-09 | シャープ株式会社 | Ferroelectric memory device |
KR100320435B1 (en) * | 1999-11-22 | 2002-01-15 | 박종섭 | Nonvolatile ferroelectric memory device and method for manufacturing the same |
KR100340074B1 (en) * | 1999-12-28 | 2002-06-12 | 박종섭 | FeRAM having ferroelectric capacitor disposed over active area |
US6449184B2 (en) | 2000-06-19 | 2002-09-10 | Matsushita Electric Industrial Co., Ltd. | Method for driving semiconductor memory |
EP2287849A3 (en) | 2000-08-30 | 2011-03-09 | Micron Technology, Inc. | Semiconductor memory having dual port cell supporting hidden refresh |
JP4047531B2 (en) | 2000-10-17 | 2008-02-13 | 株式会社東芝 | Ferroelectric memory device |
US6720596B2 (en) | 2000-10-17 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method for driving the same |
JPWO2003052829A1 (en) | 2001-12-14 | 2005-04-28 | 株式会社日立製作所 | Semiconductor device and manufacturing method thereof |
JP2003197769A (en) | 2001-12-21 | 2003-07-11 | Mitsubishi Electric Corp | Semiconductor storage device |
JP3770171B2 (en) | 2002-02-01 | 2006-04-26 | ソニー株式会社 | Memory device and memory system using the same |
JP3957520B2 (en) * | 2002-02-07 | 2007-08-15 | 富士通株式会社 | Voltage generation circuit |
JP4035350B2 (en) | 2002-03-18 | 2008-01-23 | 富士通株式会社 | Semiconductor device and semiconductor device manufacturing method |
JP3650077B2 (en) | 2002-03-29 | 2005-05-18 | 沖電気工業株式会社 | Semiconductor memory device |
JP3984090B2 (en) | 2002-04-01 | 2007-09-26 | 株式会社東芝 | Ferroelectric memory device |
US6538914B1 (en) * | 2002-04-01 | 2003-03-25 | Ramtron International Corporation | Ferroelectric memory with bit-plate parallel architecture and operating method thereof |
US6704218B2 (en) | 2002-04-02 | 2004-03-09 | Agilent Technologies, Inc. | FeRAM with a single access/multiple-comparison operation |
KR100474737B1 (en) | 2002-05-02 | 2005-03-08 | 동부아남반도체 주식회사 | Dram fabrication capable of high integration and fabrication method |
US6809949B2 (en) | 2002-05-06 | 2004-10-26 | Symetrix Corporation | Ferroelectric memory |
KR100456598B1 (en) | 2002-09-09 | 2004-11-09 | 삼성전자주식회사 | Memory device arranged memory cells having complementary data |
US6804142B2 (en) * | 2002-11-12 | 2004-10-12 | Micron Technology, Inc. | 6F2 3-transistor DRAM gain cell |
US6898104B2 (en) | 2002-11-12 | 2005-05-24 | Kabushiki Kaisha Toshiba | Semiconductor device having semiconductor memory with sense amplifier |
US20040095799A1 (en) | 2002-11-20 | 2004-05-20 | Michael Jacob | 2T2C signal margin test mode using different pre-charge levels for BL and/BL |
US20040119105A1 (en) * | 2002-12-18 | 2004-06-24 | Wilson Dennis Robert | Ferroelectric memory |
JP3806084B2 (en) | 2002-12-25 | 2006-08-09 | 株式会社東芝 | Ferroelectric memory and data read method thereof |
KR100454254B1 (en) | 2002-12-30 | 2004-10-26 | 주식회사 하이닉스반도체 | Ferroelectric memory device with Merged-Top-Plate structure and method for fabricating the same |
EP1622162B1 (en) | 2003-04-10 | 2009-11-18 | Fujitsu Microelectronics Limited | Ferroelectric memory and method for reading its data |
AU2003241803A1 (en) | 2003-05-27 | 2005-01-21 | Fujitsu Limited | Ferroelectric memory |
JP4015968B2 (en) | 2003-06-09 | 2007-11-28 | 株式会社東芝 | Ferroelectric memory |
US6967365B2 (en) * | 2003-07-15 | 2005-11-22 | Texas Instruments Incorporated | Ferroelectric memory cell with angled cell transistor active region and methods for fabricating the same |
US7019352B2 (en) * | 2003-08-07 | 2006-03-28 | Texas Instruments Incorporated | Low silicon-hydrogen sin layer to inhibit hydrogen related degradation in semiconductor devices having ferroelectric components |
JP3777611B2 (en) | 2003-10-31 | 2006-05-24 | セイコーエプソン株式会社 | Ferroelectric memory device and electronic device |
JP2005141833A (en) * | 2003-11-06 | 2005-06-02 | Seiko Epson Corp | Ferroelectric memory device and electronic equipment |
JP2005223137A (en) | 2004-02-05 | 2005-08-18 | Matsushita Electric Ind Co Ltd | Ferroelectric memory device |
JP4364052B2 (en) | 2004-04-28 | 2009-11-11 | Okiセミコンダクタ株式会社 | Manufacturing method of semiconductor device |
CN1812105A (en) | 2005-01-24 | 2006-08-02 | 鸿富锦精密工业(深圳)有限公司 | Ferroelectric memory device and manufacturing method thereof |
KR100575005B1 (en) | 2005-03-23 | 2006-05-02 | 삼성전자주식회사 | Memory device having shared open bitline sense amplifier architecture |
US7957212B2 (en) | 2005-03-31 | 2011-06-07 | Hynix Semiconductor Inc. | Pseudo SRAM |
JP2006338747A (en) | 2005-05-31 | 2006-12-14 | Matsushita Electric Ind Co Ltd | Ferroelectric memory device |
JP4756915B2 (en) | 2005-05-31 | 2011-08-24 | Okiセミコンダクタ株式会社 | Ferroelectric memory device and manufacturing method thereof |
JP2007004839A (en) | 2005-06-21 | 2007-01-11 | Matsushita Electric Ind Co Ltd | Semiconductor storage device |
KR100765872B1 (en) * | 2005-08-02 | 2007-10-11 | 후지쯔 가부시끼가이샤 | Ferroelectric memory |
JP4746390B2 (en) | 2005-09-15 | 2011-08-10 | 株式会社東芝 | Semiconductor memory device |
US7209384B1 (en) | 2005-12-08 | 2007-04-24 | Juhan Kim | Planar capacitor memory cell and its applications |
JP2007266494A (en) * | 2006-03-29 | 2007-10-11 | Toshiba Corp | Semiconductor memory device |
JP2008066603A (en) * | 2006-09-08 | 2008-03-21 | Toshiba Corp | Semiconductor memory device and its manufacturing method |
JP4545133B2 (en) | 2006-11-09 | 2010-09-15 | 富士通株式会社 | Semiconductor memory device and manufacturing method thereof |
JP4493666B2 (en) | 2007-01-30 | 2010-06-30 | 株式会社ルネサステクノロジ | Ferroelectric memory |
KR101030765B1 (en) * | 2007-02-27 | 2011-04-27 | 후지쯔 세미컨덕터 가부시키가이샤 | Semiconductor storage unit, process for manufacturing the same, and method of forming package resin |
KR100849794B1 (en) | 2007-07-04 | 2008-07-31 | 주식회사 하이닉스반도체 | Semiconductor memory device with ferroelectric device |
CN101785185B (en) * | 2007-08-22 | 2012-07-04 | 罗姆股份有限公司 | Data holding device |
JP5162276B2 (en) | 2008-02-28 | 2013-03-13 | ローム株式会社 | Ferroelectric memory device |
JP4660564B2 (en) * | 2008-03-11 | 2011-03-30 | 株式会社東芝 | Semiconductor memory device |
JP2010062329A (en) | 2008-09-03 | 2010-03-18 | Toshiba Corp | Semiconductor device and method of manufacturing the same |
US8009459B2 (en) | 2008-12-30 | 2011-08-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Circuit for high speed dynamic memory |
JP5295991B2 (en) | 2010-02-15 | 2013-09-18 | 株式会社東芝 | Nonvolatile semiconductor memory device and control method of nonvolatile semiconductor memory device |
US20120074466A1 (en) * | 2010-09-28 | 2012-03-29 | Seagate Technology Llc | 3d memory array with vertical transistor |
JP5500051B2 (en) | 2010-11-22 | 2014-05-21 | 富士通セミコンダクター株式会社 | Ferroelectric memory |
US8508974B2 (en) | 2010-12-30 | 2013-08-13 | Texas Instruments Incorporated | Ferroelectric memory with shunt device |
US8477522B2 (en) | 2010-12-30 | 2013-07-02 | Texas Instruments Incorporated | Ferroelectric memory write-back |
US20120307545A1 (en) * | 2011-06-01 | 2012-12-06 | Texas Instruments Incorporated | Interleaved Bit Line Architecture for 2T2C Ferroelectric Memories |
JP5158295B1 (en) | 2011-07-15 | 2013-03-06 | パナソニック株式会社 | Method for driving semiconductor memory device |
JP2013065604A (en) | 2011-09-15 | 2013-04-11 | Toshiba Corp | Semiconductor device and manufacturing method of the same |
JP6145972B2 (en) * | 2012-03-05 | 2017-06-14 | 富士通セミコンダクター株式会社 | Nonvolatile latch circuit and memory device |
US20140029326A1 (en) * | 2012-07-26 | 2014-01-30 | Texas Instruments Incorporated | Ferroelectric random access memory with a non-destructive read |
KR101994309B1 (en) * | 2013-03-27 | 2019-09-30 | 에스케이하이닉스 주식회사 | Semiconductor device and method for manufacturing the same, and micro processor, processor, system, data storage system and memory system including the semiconductor device |
US9281044B2 (en) * | 2013-05-17 | 2016-03-08 | Micron Technology, Inc. | Apparatuses having a ferroelectric field-effect transistor memory array and related method |
US10216484B2 (en) | 2014-06-10 | 2019-02-26 | Texas Instruments Incorporated | Random number generation with ferroelectric random access memory |
US10134984B1 (en) | 2014-12-31 | 2018-11-20 | Crossbar, Inc. | Two-terminal memory electrode comprising a non-continuous contact surface |
US9853211B2 (en) | 2015-07-24 | 2017-12-26 | Micron Technology, Inc. | Array of cross point memory cells individually comprising a select device and a programmable device |
US9514797B1 (en) | 2016-03-03 | 2016-12-06 | Cypress Semiconductor Corporation | Hybrid reference generation for ferroelectric random access memory |
EP3507805A4 (en) | 2016-08-31 | 2020-06-03 | Micron Technology, Inc. | Apparatuses and methods including ferroelectric memory and for operating ferroelectric memory |
WO2018044487A1 (en) | 2016-08-31 | 2018-03-08 | Micron Technology, Inc. | Apparatuses and methods including ferroelectric memory and for accessing ferroelectric memory |
KR102227270B1 (en) | 2016-08-31 | 2021-03-15 | 마이크론 테크놀로지, 인크. | Ferroelectric memory cell |
KR102314663B1 (en) | 2016-08-31 | 2021-10-21 | 마이크론 테크놀로지, 인크. | Apparatus and method for including and accessing a 2 transistor-1 capacitor memory |
US10867675B2 (en) | 2017-07-13 | 2020-12-15 | Micron Technology, Inc. | Apparatuses and methods for memory including ferroelectric memory cells and dielectric memory cells |
-
2017
- 2017-08-02 KR KR1020197009019A patent/KR102227270B1/en active IP Right Grant
- 2017-08-02 KR KR1020217006969A patent/KR102369776B1/en active IP Right Grant
- 2017-08-02 JP JP2019511388A patent/JP6980006B2/en active Active
- 2017-08-02 CN CN201780060394.1A patent/CN109791784A/en active Pending
- 2017-08-02 SG SG11201901210UA patent/SG11201901210UA/en unknown
- 2017-08-02 WO PCT/US2017/045167 patent/WO2018044485A1/en unknown
- 2017-08-02 EP EP17847172.8A patent/EP3507804A4/en not_active Withdrawn
- 2017-08-16 US US15/678,978 patent/US10153018B2/en active Active
- 2017-08-22 TW TW108121824A patent/TWI716011B/en active
- 2017-08-22 TW TW106128403A patent/TWI667651B/en active
-
2018
- 2018-08-17 US US16/104,709 patent/US10354712B2/en active Active
-
2019
- 2019-05-29 US US16/425,769 patent/US10872650B2/en active Active
-
2020
- 2020-07-23 US US16/937,402 patent/US11107515B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN109791784A (en) | 2019-05-21 |
EP3507804A4 (en) | 2020-07-15 |
US11107515B2 (en) | 2021-08-31 |
US20200357454A1 (en) | 2020-11-12 |
TW201937494A (en) | 2019-09-16 |
TWI716011B (en) | 2021-01-11 |
US10872650B2 (en) | 2020-12-22 |
EP3507804A1 (en) | 2019-07-10 |
US10153018B2 (en) | 2018-12-11 |
US20190005999A1 (en) | 2019-01-03 |
KR102369776B1 (en) | 2022-03-03 |
WO2018044485A1 (en) | 2018-03-08 |
JP2019530974A (en) | 2019-10-24 |
KR20210030997A (en) | 2021-03-18 |
TW201812760A (en) | 2018-04-01 |
US10354712B2 (en) | 2019-07-16 |
US20180061468A1 (en) | 2018-03-01 |
TWI667651B (en) | 2019-08-01 |
US20190295623A1 (en) | 2019-09-26 |
KR20190038673A (en) | 2019-04-08 |
KR102227270B1 (en) | 2021-03-15 |
JP6980006B2 (en) | 2021-12-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201901210UA (en) | Ferroelectric memory cells | |
SG11201901168UA (en) | Apparatuses and methods including ferroelectric memory and for operating ferroelectric memory | |
SG11201900269XA (en) | Channel sensing for independent links | |
SG11201900399WA (en) | Method and apparatus for performing access barring check | |
SG11201807784SA (en) | 3-desoxy derivative and pharmaceutical compositions thereof | |
SG11201901211XA (en) | Apparatuses and methods including ferroelectric memory and for accessing ferroelectric memory | |
SG11201907063QA (en) | Techniques and apparatuses for control channel monitoring using a wakeup signal | |
SG11201811095UA (en) | Multi-level storage in ferroelectric memory | |
SG11201900772YA (en) | Gene editing of car-t cells for the treatment of t cell malignancies with chimeric antigen receptors | |
SG11201900186QA (en) | Hearable device comprising integrated device and wireless functionality | |
SG11201811225RA (en) | Ar+ breast cancer treatment methods | |
SG11201908857QA (en) | Methods for the treatment of inflammation and inflammatory conditions | |
SG11201908075UA (en) | A microneedle device | |
SG11201811723QA (en) | Using a mobile phone for monitoring a medical device | |
SG11201810411VA (en) | Metamaterial split ring resonator, metamaterial split ring resonator array and energy harvesting apparatus | |
SG11201908325PA (en) | Process for the preparation of glucuronide drug-linkers and intermediates thereof | |
SG11201808713YA (en) | Ophthalmic compositions comprising levodopa, an antioxidant and an aqueous carrier | |
SG11201810965YA (en) | 1h-pyrazolo[4,3-b]pyridines as pde1 inhibitors | |
SG11201901438VA (en) | Solid forms of cenicriviroc mesylate and processes of making solid forms of cenicriviroc mesylate | |
SG11201906852XA (en) | Treatment of diuretic resistance | |
SG11201903329WA (en) | Method for preparing electrocompetent yeast cells, and method for using said cells | |
SG11201808672TA (en) | Device for sampling one or more analytes | |
SG11201804440XA (en) | Chemical reprogramming of human glial cells into neurons with small molecule cocktail | |
SG11201907421QA (en) | Chemical composition | |
SG11201407208UA (en) | A method for dynamic generation and modification of an electronic entity architecture |