SG11201900146VA - Tool health monitoring and matching - Google Patents

Tool health monitoring and matching

Info

Publication number
SG11201900146VA
SG11201900146VA SG11201900146VA SG11201900146VA SG11201900146VA SG 11201900146V A SG11201900146V A SG 11201900146VA SG 11201900146V A SG11201900146V A SG 11201900146VA SG 11201900146V A SG11201900146V A SG 11201900146VA SG 11201900146V A SG11201900146V A SG 11201900146VA
Authority
SG
Singapore
Prior art keywords
data
international
california
matching
states
Prior art date
Application number
SG11201900146VA
Other languages
English (en)
Inventor
Rao Ravichander Jayantha
Gary Taan
Andreas Russ
Roger Davis
Bryant Mantiply
Swati Ramanathan
Karen Biagini
Bjorn Brauer
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201900146VA publication Critical patent/SG11201900146VA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by monitoring or safety
    • G05B19/4065—Monitoring tool breakage, life or condition
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G05B19/4187—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow by tool management
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/26—Pc applications
    • G05B2219/2602—Wafer processing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20048—Transform domain processing
    • G06T2207/20056—Discrete and fast Fourier transform, [DFT, FFT]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30164—Workpiece; Machine component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Biochemistry (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
SG11201900146VA 2017-07-11 2017-07-26 Tool health monitoring and matching SG11201900146VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/646,808 US10360671B2 (en) 2017-07-11 2017-07-11 Tool health monitoring and matching
PCT/US2017/044030 WO2019013828A1 (en) 2017-07-11 2017-07-26 MONITORING AND MATCHING TOOL HEALTH

Publications (1)

Publication Number Publication Date
SG11201900146VA true SG11201900146VA (en) 2019-02-27

Family

ID=64999515

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201900146VA SG11201900146VA (en) 2017-07-11 2017-07-26 Tool health monitoring and matching

Country Status (7)

Country Link
US (1) US10360671B2 (zh)
KR (1) KR102222982B1 (zh)
CN (1) CN109564422B (zh)
IL (1) IL264107B (zh)
SG (1) SG11201900146VA (zh)
TW (1) TWI720227B (zh)
WO (1) WO2019013828A1 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10514685B2 (en) * 2014-06-13 2019-12-24 KLA—Tencor Corp. Automatic recipe stability monitoring and reporting
JP6745673B2 (ja) * 2016-08-05 2020-08-26 東京エレクトロン株式会社 半導体システム
US10402524B2 (en) * 2017-05-08 2019-09-03 Globalfoundries Inc. Prediction of process-sensitive geometries with machine learning
DE102019209110A1 (de) * 2019-06-24 2020-12-24 Sms Group Gmbh Industrielle Anlage, insbesondere Anlage der metallerzeugenden Industrie oder der Aluminium- oder Stahlindustrie und Verfahren zum Betreiben einer industriellen Anlage, insbesondere einer Anlage der metallerzeugenden Industrie oder der Aluminium- oder Stahlindustrie
US11100221B2 (en) 2019-10-08 2021-08-24 Nanotronics Imaging, Inc. Dynamic monitoring and securing of factory processes, equipment and automated systems
WO2021168308A1 (en) * 2020-02-21 2021-08-26 Nanotronics Imaging, Inc. Systems, methods, and media for manufacturing processes
US11086988B1 (en) 2020-02-28 2021-08-10 Nanotronics Imaging, Inc. Method, systems and apparatus for intelligently emulating factory control systems and simulating response data
KR20220132604A (ko) * 2020-03-30 2022-09-30 주식회사 히타치하이테크 진단 시스템
TWI724871B (zh) * 2020-04-17 2021-04-11 逢甲大學 智慧製造與先進排程決策輔助資訊管理系統
CN111787082B (zh) * 2020-06-22 2021-11-23 珠海格力电器股份有限公司 一种多级业务数据上报的方法、设备及系统
WO2023014708A1 (en) * 2021-08-02 2023-02-09 Arch Systems Inc. Method for manufacturing system analysis and/or maintenance
US11868971B2 (en) 2021-08-02 2024-01-09 Arch Systems Inc. Method for manufacturing system analysis and/or maintenance
WO2023101969A1 (en) * 2021-11-30 2023-06-08 Aveva Software, Llc Server, systems and methods for industrial process visual anomaly reporting
CN114419837B (zh) * 2021-12-07 2023-09-26 攀枝花钢城集团米易瑞地矿业有限公司 一种安全生产预警系统及其预警方法
CN114637270B (zh) 2022-05-17 2022-08-23 成都秦川物联网科技股份有限公司 基于集散控制的智能制造工业物联网及控制方法
US11886177B1 (en) 2022-08-26 2024-01-30 Arch Systems Inc. System and method for manufacturing system data analysis
US11947340B1 (en) 2022-08-26 2024-04-02 Arch Systems Inc. System and method for machine program analysis
KR102576639B1 (ko) 2022-11-09 2023-09-08 (주)오로스테크놀로지 초점 이동을 제어하는 오버레이 계측 장치 및 방법과 이를 위한 프로그램 저장 매체
CN116300771B (zh) * 2023-05-18 2023-08-11 深圳市致尚科技股份有限公司 智能柔性装配方法、装置及存储介质
CN118070198B (zh) * 2024-04-17 2024-07-26 全芯智造技术有限公司 测试异常的分析方法及装置、可读存储介质、终端
CN118444642B (zh) * 2024-04-30 2024-10-11 嘉兴锐星光学仪器有限公司 结合高精度测量的光学镜筒生产控制方法及系统

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483538B2 (en) 1998-11-05 2002-11-19 Tektronix, Inc. High precision sub-pixel spatial alignment of digital images
US6496958B1 (en) * 1999-04-27 2002-12-17 Infineon Technologies Richmond, Lp Yield prediction and statistical process control using predicted defect related yield loss
US20020046001A1 (en) * 2000-10-16 2002-04-18 Applied Materials, Inc. Method, computer readable medium and apparatus for accessing a defect knowledge library of a defect source identification system
US6618682B2 (en) * 2001-04-20 2003-09-09 International Business Machines Corporation Method for test optimization using historical and actual fabrication test data
US6965895B2 (en) * 2001-07-16 2005-11-15 Applied Materials, Inc. Method and apparatus for analyzing manufacturing data
JP3904419B2 (ja) * 2001-09-13 2007-04-11 株式会社日立製作所 検査装置および検査システム
US6647348B2 (en) * 2001-10-03 2003-11-11 Lsi Logic Corporation Latent defect classification system
US7454312B2 (en) * 2006-03-15 2008-11-18 Applied Materials, Inc. Tool health information monitoring and tool performance analysis in semiconductor processing
US8260035B2 (en) * 2006-09-22 2012-09-04 Kla-Tencor Corporation Threshold determination in an inspection system
US7974728B2 (en) * 2007-05-04 2011-07-05 Taiwan Semiconductor Manufacturing Company, Ltd. System for extraction of key process parameters from fault detection classification to enable wafer prediction
US8010321B2 (en) * 2007-05-04 2011-08-30 Applied Materials, Inc. Metrics independent and recipe independent fault classes
US8285414B2 (en) 2009-03-31 2012-10-09 International Business Machines Corporation Method and system for evaluating a machine tool operating characteristics
JP2012018955A (ja) 2010-07-06 2012-01-26 Toshiba Corp 半導体装置の不良解析方法
US9142014B2 (en) * 2013-05-30 2015-09-22 Dmo Systems Limited System and method for identifying systematic defects in wafer inspection using hierarchical grouping and filtering
KR20130065684A (ko) * 2013-05-30 2013-06-19 송시우 검사장치의 반도체 제조 공정 검사 방법
CN103487441B (zh) * 2013-09-24 2015-09-30 电子科技大学 一种用于硅晶片缺陷检测和面形测量的方法
CN104897706B (zh) * 2014-03-07 2018-05-11 旺宏电子股份有限公司 一种测量芯片或晶片表面结构的方法
KR102238648B1 (ko) 2014-06-03 2021-04-09 삼성전자주식회사 반도체 공정 관리 시스템, 이를 포함하는 반도체 제조 시스템 및 반도체 제조 방법
US10514685B2 (en) * 2014-06-13 2019-12-24 KLA—Tencor Corp. Automatic recipe stability monitoring and reporting
WO2016091536A1 (en) * 2014-12-09 2016-06-16 Asml Netherlands B.V. Method and apparatus for image analysis
US9754769B2 (en) * 2015-09-15 2017-09-05 Lam Research Corporation Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matching
CN106409711B (zh) * 2016-09-12 2019-03-12 佛山市南海区广工大数控装备协同创新研究院 一种太阳能硅晶片缺陷检测系统及方法
US10372114B2 (en) 2016-10-21 2019-08-06 Kla-Tencor Corporation Quantifying and reducing total measurement uncertainty
CN107024478A (zh) * 2017-04-05 2017-08-08 合肥德仁智能科技有限公司 一种零件加工自动缺陷识别系统

Also Published As

Publication number Publication date
IL264107B (en) 2022-01-01
KR20200018822A (ko) 2020-02-20
US20190019280A1 (en) 2019-01-17
CN109564422B (zh) 2021-03-09
IL264107A (en) 2019-05-30
US10360671B2 (en) 2019-07-23
KR102222982B1 (ko) 2021-03-03
TW201908896A (zh) 2019-03-01
TWI720227B (zh) 2021-03-01
WO2019013828A1 (en) 2019-01-17
CN109564422A (zh) 2019-04-02

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