SG11201810475VA - Projection exposure device and projection exposure method thereof - Google Patents

Projection exposure device and projection exposure method thereof

Info

Publication number
SG11201810475VA
SG11201810475VA SG11201810475VA SG11201810475VA SG11201810475VA SG 11201810475V A SG11201810475V A SG 11201810475VA SG 11201810475V A SG11201810475V A SG 11201810475VA SG 11201810475V A SG11201810475V A SG 11201810475VA SG 11201810475V A SG11201810475V A SG 11201810475VA
Authority
SG
Singapore
Prior art keywords
projection exposure
workpiece
area
loaded
unit
Prior art date
Application number
SG11201810475VA
Inventor
Hideto Kotani
Ryowa Tanaka
Takamasa Oba
Original Assignee
Cerma Precision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cerma Precision Inc filed Critical Cerma Precision Inc
Publication of SG11201810475VA publication Critical patent/SG11201810475VA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

Abstract

The present invention is provided with: a sliding table 120 having a plurality of areas 110 and 111 where workpieces are placed formed thereon, a first loader 310 and 5 second loader 311 capable of loading and unloading workpieces 510 and 511, a first position detection unit 210, a second position detection unit 211, a light source unit 10, a photomask 20 and a projection optical system 50, and a control unit 410 that controls the sliding table 120 and each unit; wherein, the control unit 410 carries out parallel processing consisting of detecting the loaded position of the workpiece 510 placed in 10 the first area 110 when exposure light is projected onto the workpiece 511 loaded in the second area 111, and carrying out parallel processing consisting of detecting the loaded position of the workpiece 511 placed in the second area 111 when exposure light is projected onto the workpiece 510 loaded in the first area 110.
SG11201810475VA 2016-05-26 2017-05-19 Projection exposure device and projection exposure method thereof SG11201810475VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016105090A JP6353487B2 (en) 2016-05-26 2016-05-26 Projection exposure apparatus and projection exposure method
PCT/JP2017/018781 WO2017204101A1 (en) 2016-05-26 2017-05-19 Projection exposure device and projection exposure method therefor

Publications (1)

Publication Number Publication Date
SG11201810475VA true SG11201810475VA (en) 2018-12-28

Family

ID=60412760

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201810475VA SG11201810475VA (en) 2016-05-26 2017-05-19 Projection exposure device and projection exposure method thereof

Country Status (6)

Country Link
JP (1) JP6353487B2 (en)
KR (1) KR102406914B1 (en)
CN (1) CN109154785A (en)
SG (1) SG11201810475VA (en)
TW (1) TWI730104B (en)
WO (1) WO2017204101A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI755963B (en) * 2020-06-23 2022-02-21 國立成功大學 Method and apparatus for forming three-dimensional micro-structure

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6387725A (en) * 1986-10-01 1988-04-19 Sumitomo Heavy Ind Ltd Stage conveying mechanism
JPS63261850A (en) * 1987-04-20 1988-10-28 Fujitsu Ltd Vertical x-y stage
JPH11260697A (en) 1998-03-12 1999-09-24 Fujitsu Ltd Method and system for scanning-type reduction projection exposure
JP2000150369A (en) * 1999-01-01 2000-05-30 Nikon Corp Aligner and device manufactured thereby, and exposure method and manufacturing method of the device using the exposure method
JP2001203161A (en) 2000-12-18 2001-07-27 Canon Inc Projection aligner and manufacturing method of semiconductor element using the same
EP1646074A4 (en) * 2003-07-09 2007-10-03 Nikon Corp Exposure apparatus and method for manufacturing device
CN101504512B (en) * 2003-08-07 2012-11-14 株式会社尼康 Exposure method, expose apparatus, carrier apparatus and equipment manufacturing method
US7589822B2 (en) * 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
JP2007055237A (en) * 2005-07-26 2007-03-08 Canon Finetech Inc Recording medium
TW200719095A (en) * 2005-11-09 2007-05-16 Nikon Corp Exposure apparatus, exposure method and device manufacturing method
US20090153824A1 (en) * 2007-12-17 2009-06-18 Kla-Tencor Corporation Multiple chuck scanning stage
JP5096965B2 (en) * 2008-02-29 2012-12-12 キヤノン株式会社 Alignment method, alignment apparatus, exposure method, and device manufacturing method
JP5515323B2 (en) * 2009-02-25 2014-06-11 株式会社ニコン Projection optical apparatus, exposure apparatus, and device manufacturing method
US20110102762A1 (en) * 2009-10-30 2011-05-05 Nikon Corporation Exposure apparatus and device manufacturing method
US20110164238A1 (en) * 2009-12-02 2011-07-07 Nikon Corporation Exposure apparatus and device fabricating method
JP5799304B2 (en) * 2011-06-10 2015-10-21 株式会社ブイ・テクノロジー Exposure unit and exposure method using the same
CN102681363B (en) * 2012-05-11 2014-02-19 清华大学 Multi-stage exchange system and exchange method for multi-station silicon wafer stage

Also Published As

Publication number Publication date
KR102406914B1 (en) 2022-06-08
KR20190010538A (en) 2019-01-30
JP2017211534A (en) 2017-11-30
WO2017204101A1 (en) 2017-11-30
TW201805740A (en) 2018-02-16
TWI730104B (en) 2021-06-11
CN109154785A (en) 2019-01-04
JP6353487B2 (en) 2018-07-04

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