SG11201810356VA - Method for healing defects in a layer obtained by implantation then detachment from a substrate - Google Patents

Method for healing defects in a layer obtained by implantation then detachment from a substrate

Info

Publication number
SG11201810356VA
SG11201810356VA SG11201810356VA SG11201810356VA SG11201810356VA SG 11201810356V A SG11201810356V A SG 11201810356VA SG 11201810356V A SG11201810356V A SG 11201810356VA SG 11201810356V A SG11201810356V A SG 11201810356VA SG 11201810356V A SG11201810356V A SG 11201810356VA
Authority
SG
Singapore
Prior art keywords
layer
substrate
implantation
healing defects
detachment
Prior art date
Application number
SG11201810356VA
Other languages
English (en)
Inventor
Bruno Ghyselen
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG11201810356VA publication Critical patent/SG11201810356VA/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/08Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/04Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/05Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/08Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/082Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/853Ceramic compositions
    • H10N30/8542Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/222Constructional or flow details for analysing fluids
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Physical Vapour Deposition (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
SG11201810356VA 2016-05-25 2017-05-24 Method for healing defects in a layer obtained by implantation then detachment from a substrate SG11201810356VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1654673A FR3051979B1 (fr) 2016-05-25 2016-05-25 Procede de guerison de defauts dans une couche obtenue par implantation puis detachement d'un substrat
PCT/FR2017/051290 WO2017203173A1 (fr) 2016-05-25 2017-05-24 Procede de guerison de defauts dans une couche obtenue par implantation puis detachement d'un substrat

Publications (1)

Publication Number Publication Date
SG11201810356VA true SG11201810356VA (en) 2018-12-28

Family

ID=56557781

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201810356VA SG11201810356VA (en) 2016-05-25 2017-05-24 Method for healing defects in a layer obtained by implantation then detachment from a substrate

Country Status (8)

Country Link
US (1) US11398595B2 (ko)
EP (1) EP3465787B1 (ko)
JP (1) JP7066638B2 (ko)
KR (1) KR102232158B1 (ko)
CN (1) CN109155358B (ko)
FR (1) FR3051979B1 (ko)
SG (1) SG11201810356VA (ko)
WO (1) WO2017203173A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180038369A (ko) * 2016-10-06 2018-04-16 신에쓰 가가꾸 고교 가부시끼가이샤 복합 기판의 제조 방법

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6786967B1 (en) * 1998-05-11 2004-09-07 California Institute Of Technology Ion exchange waveguides and methods of fabrication
US7548015B2 (en) * 2000-11-02 2009-06-16 Danfoss A/S Multilayer composite and a method of making such
FR2816445B1 (fr) * 2000-11-06 2003-07-25 Commissariat Energie Atomique Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible
EP1271221A1 (en) * 2001-06-28 2003-01-02 Corning O.T.I. S.p.A. Integrated optical waveguide device
US20030127042A1 (en) * 2002-01-09 2003-07-10 Der-Hou Tsou Method of forming high quality waveguides by vapor-phase proton-exchange process with post-thermal annealing and reversed proton-exchange
FR2855909B1 (fr) * 2003-06-06 2005-08-26 Soitec Silicon On Insulator Procede d'obtention concomitante d'au moins une paire de structures comprenant au moins une couche utile reportee sur un substrat
KR100596391B1 (ko) * 2004-12-03 2006-07-04 한국전자통신연구원 강유전체/상유전체 다층 박막 및 그 제조 방법과 그를이용한 초고주파 가변 소자
US7566629B2 (en) * 2005-06-16 2009-07-28 International Business Machines Corporation Patterned silicon-on-insulator layers and methods for forming the same
FR2896255B1 (fr) * 2006-01-17 2008-05-09 Soitec Silicon On Insulator Procede d'ajustement de la contrainte d'un substrat en un materiau semi-conducteur
WO2009081651A1 (ja) * 2007-12-25 2009-07-02 Murata Manufacturing Co., Ltd. 複合圧電基板の製造方法
FR2930072B1 (fr) * 2008-04-15 2010-08-20 Commissariat Energie Atomique Procede de transfert d'une couche mince par echange protonique.
EP2161741B1 (en) * 2008-09-03 2014-06-11 Soitec Method for fabricating a semiconductor on insulator substrate with reduced SECCO defect density
JP4582235B2 (ja) * 2008-10-31 2010-11-17 株式会社村田製作所 圧電デバイスの製造方法
JP4821834B2 (ja) * 2008-10-31 2011-11-24 株式会社村田製作所 圧電性複合基板の製造方法
US8189981B2 (en) 2009-11-23 2012-05-29 The Aerospace Corporation Stable lithium niobate waveguides, and methods of making and using same
EP2506431A4 (en) 2009-11-26 2014-02-26 Murata Manufacturing Co PIEZOELECTRIC DEVICE AND METHOD FOR PRODUCING THE PIEZOELECTRIC DEVICE
FR2972564B1 (fr) * 2011-03-08 2016-11-04 S O I Tec Silicon On Insulator Tech Procédé de traitement d'une structure de type semi-conducteur sur isolant
FR2977260B1 (fr) * 2011-06-30 2013-07-19 Soitec Silicon On Insulator Procede de fabrication d'une couche epitaxiale epaisse de nitrure de gallium sur un substrat de silicium ou analogue et couche obtenue par ledit procede
FR2983342B1 (fr) * 2011-11-30 2016-05-20 Soitec Silicon On Insulator Procede de fabrication d'une heterostructure limitant la formation de defauts et heterostructure ainsi obtenue
US9876160B2 (en) * 2012-03-21 2018-01-23 Parker-Hannifin Corporation Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
CN104871431B (zh) * 2012-12-26 2018-04-10 日本碍子株式会社 复合基板及其制造方法,以及弹性波装置
US10095057B2 (en) * 2013-10-23 2018-10-09 Honeywell International Inc. Treatment and/or stabilizing gases in an optical gyro based on an inorganic waveguide
WO2016118536A2 (en) * 2015-01-20 2016-07-28 The Johns Hopkins University Printable high dielectric constant and self-healable dielectric polymer composition
CN104852271A (zh) * 2015-05-29 2015-08-19 南京信息工程大学 一种波导激光器的制备方法
JP6728630B2 (ja) * 2015-10-29 2020-07-22 セイコーエプソン株式会社 圧電素子、圧電モジュール、電子機器、及び圧電素子の製造方法

Also Published As

Publication number Publication date
EP3465787B1 (fr) 2020-03-18
EP3465787A1 (fr) 2019-04-10
CN109155358B (zh) 2022-06-03
US20200328342A1 (en) 2020-10-15
JP7066638B2 (ja) 2022-05-13
US11398595B2 (en) 2022-07-26
FR3051979A1 (fr) 2017-12-01
WO2017203173A1 (fr) 2017-11-30
KR102232158B1 (ko) 2021-03-25
FR3051979B1 (fr) 2018-05-18
CN109155358A (zh) 2019-01-04
JP2019519154A (ja) 2019-07-04
KR20190013896A (ko) 2019-02-11

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