SG11201810354TA - Method for producing a layer - Google Patents

Method for producing a layer

Info

Publication number
SG11201810354TA
SG11201810354TA SG11201810354TA SG11201810354TA SG11201810354TA SG 11201810354T A SG11201810354T A SG 11201810354TA SG 11201810354T A SG11201810354T A SG 11201810354TA SG 11201810354T A SG11201810354T A SG 11201810354TA SG 11201810354T A SG11201810354T A SG 11201810354TA
Authority
SG
Singapore
Prior art keywords
layer
producing
composition
abo
donor substrate
Prior art date
Application number
SG11201810354TA
Inventor
Bruno Ghyselen
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG11201810354TA publication Critical patent/SG11201810354TA/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02015Characteristics of piezoelectric layers, e.g. cutting angles
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02543Characteristics of substrate, e.g. cutting angles
    • H03H9/02574Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/04Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/853Ceramic compositions
    • H10N30/8542Alkali metal based oxides, e.g. lithium, sodium or potassium niobates

Abstract

METHOD FOR PRODUCING A LAYER 5 The invention relates to a method for producing a layer of composition AA’BO 3, where A consists of at least one element selected from: Li, Na, K, Ca, Mg, Ba, Sr, Pb, La, Bi, Y, Dy, Gd, Tb, Ce, Pr, Nd, Sm, Eu, Ho, Zr, Sc, Ag, Tl and B consists of at least one element selected 10 from: Nb, Ta, Sb, Ti, Zr, Sn, Ru, Fe, V, Sc, C, Ga, Al, Si, Mn, Zr, Tl, characterised in that it comprises: - providing a donor substrate (100) of composition ABO 3, - forming a layer (10) of composition ABO 3 by 15 thinning said donor substrate (100), - before and/or after the thinning step, exposing said layer (10) of composition ABO 3 to a medium (M) containing ions of an element A’ belonging to the same list of elements as A, A’ being different from A, such 20 that said ions penetrate into said layer (10) to form a layer of compos ition AA’BO 3. Figure 1D
SG11201810354TA 2016-05-25 2017-05-24 Method for producing a layer SG11201810354TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1654685A FR3051785A1 (en) 2016-05-25 2016-05-25 PROCESS FOR PRODUCING A LAYER
PCT/FR2017/051291 WO2017203174A1 (en) 2016-05-25 2017-05-24 Method for producing a layer

Publications (1)

Publication Number Publication Date
SG11201810354TA true SG11201810354TA (en) 2018-12-28

Family

ID=56322225

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201810354TA SG11201810354TA (en) 2016-05-25 2017-05-24 Method for producing a layer

Country Status (8)

Country Link
US (1) US11744153B2 (en)
EP (1) EP3465788B1 (en)
JP (1) JP6929880B2 (en)
KR (1) KR102457258B1 (en)
CN (1) CN109690798B (en)
FR (1) FR3051785A1 (en)
SG (1) SG11201810354TA (en)
WO (1) WO2017203174A1 (en)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551647A (en) * 1983-03-08 1985-11-05 General Electric Company Temperature compensated piezoelectric transducer and lens assembly and method of making the assembly
JP3509113B2 (en) * 1992-04-28 2004-03-22 旭硝子株式会社 Nonlinear optical material
US6767749B2 (en) * 2002-04-22 2004-07-27 The United States Of America As Represented By The Secretary Of The Navy Method for making piezoelectric resonator and surface acoustic wave device using hydrogen implant layer splitting
US7557055B2 (en) * 2004-09-20 2009-07-07 Paratek Microwave, Inc. Tunable low loss material composition
JP4195884B2 (en) * 2005-02-17 2008-12-17 Nelクリスタル株式会社 Method for processing oxide ferroelectric crystal
FR2890489B1 (en) 2005-09-08 2008-03-07 Soitec Silicon On Insulator METHOD FOR MANUFACTURING A SEMICONDUCTOR TYPE HETEROSTRUCTURE ON INSULATION
WO2009081651A1 (en) * 2007-12-25 2009-07-02 Murata Manufacturing Co., Ltd. Composite piezoelectric substrate manufacturing method
JP5133279B2 (en) * 2009-01-27 2013-01-30 信越化学工業株式会社 Method for producing lithium tantalate crystals
FR2942910B1 (en) 2009-03-06 2011-09-30 Soitec Silicon On Insulator METHOD FOR MANUFACTURING A HETEROSTRUCTURE TO REDUCE THE STRAIN STRENGTH OF THE DONOR SUBSTRATE
US8189981B2 (en) * 2009-11-23 2012-05-29 The Aerospace Corporation Stable lithium niobate waveguides, and methods of making and using same
JP5555072B2 (en) 2010-06-25 2014-07-23 富士フイルム株式会社 Piezoelectric film, piezoelectric element, and liquid ejection device
JP5611915B2 (en) * 2011-09-16 2014-10-22 信越化学工業株式会社 Method for manufacturing piezoelectric substrate for surface acoustic wave device
FR3004289B1 (en) * 2013-04-08 2015-05-15 Soitec Silicon On Insulator SURFACE ACOUSTIC WAVE COMPONENT AND METHOD OF MANUFACTURING THE SAME
JP6174061B2 (en) * 2014-05-09 2017-08-02 信越化学工業株式会社 Method for manufacturing piezoelectric oxide single crystal substrate

Also Published As

Publication number Publication date
CN109690798A (en) 2019-04-26
EP3465788B1 (en) 2020-05-20
FR3051785A1 (en) 2017-12-01
CN109690798B (en) 2023-04-28
US11744153B2 (en) 2023-08-29
US20200259069A1 (en) 2020-08-13
KR20190013899A (en) 2019-02-11
EP3465788A1 (en) 2019-04-10
JP6929880B2 (en) 2021-09-01
KR102457258B1 (en) 2022-10-20
WO2017203174A1 (en) 2017-11-30
JP2019523743A (en) 2019-08-29

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