SG11201808803QA - Foup measurement chamber - Google Patents

Foup measurement chamber

Info

Publication number
SG11201808803QA
SG11201808803QA SG11201808803QA SG11201808803QA SG11201808803QA SG 11201808803Q A SG11201808803Q A SG 11201808803QA SG 11201808803Q A SG11201808803Q A SG 11201808803QA SG 11201808803Q A SG11201808803Q A SG 11201808803QA SG 11201808803Q A SG11201808803Q A SG 11201808803QA
Authority
SG
Singapore
Prior art keywords
foup
sensor
gas
nest
flowmeter
Prior art date
Application number
SG11201808803QA
Other languages
English (en)
Inventor
Martin Bachlechner
Nadja Erler-Lohse
Cornelius Günther
Original Assignee
Fabmatics Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fabmatics Gmbh filed Critical Fabmatics Gmbh
Publication of SG11201808803QA publication Critical patent/SG11201808803QA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00Control of flow
    • G05D7/06Control of flow characterised by the use of electric means
    • G05D7/0617Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • H01L21/67393Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/05Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
    • G01F1/34Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004Gaseous mixtures, e.g. polluted air
    • G01N33/0009General constructional details of gas analysers, e.g. portable test equipment
    • G01N33/0027General constructional details of gas analysers, e.g. portable test equipment concerning the detector
    • G01N33/0036General constructional details of gas analysers, e.g. portable test equipment concerning the detector specially adapted to detect a particular component

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201808803QA 2016-04-05 2017-04-04 Foup measurement chamber SG11201808803QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016205597.6A DE102016205597B4 (de) 2016-04-05 2016-04-05 Purge-Messsystem für FOUPs
PCT/EP2017/057917 WO2017174540A1 (fr) 2016-04-05 2017-04-04 Chambre de mesure d'enceinte foup

Publications (1)

Publication Number Publication Date
SG11201808803QA true SG11201808803QA (en) 2018-11-29

Family

ID=58530523

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201808803QA SG11201808803QA (en) 2016-04-05 2017-04-04 Foup measurement chamber

Country Status (4)

Country Link
US (1) US10847396B2 (fr)
DE (1) DE102016205597B4 (fr)
SG (1) SG11201808803QA (fr)
WO (1) WO2017174540A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102130872B1 (ko) * 2016-04-27 2020-07-06 주식회사 엘지화학 고체 시료의 수분 측정 장치, 고체 시료 수분 함량 측정 방법 및 이미드화율 분석 방법
US10861692B2 (en) * 2017-10-26 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate carrier deterioration detection and repair
US11031265B2 (en) 2018-11-28 2021-06-08 Brooks Automation, Inc. Load port module

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US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
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JP2000353738A (ja) * 1999-06-11 2000-12-19 Sony Corp 密閉コンテナ、保管装置および電子部品搬送システム、ならびに電子部品の保管および搬送方法
JP4235076B2 (ja) 2003-10-08 2009-03-04 東京エレクトロン株式会社 半導体製造装置および半導体製造方法
CN100468616C (zh) * 2004-02-05 2009-03-11 安格斯公司 晶圆传送容器的净化
JP3983254B2 (ja) * 2005-06-24 2007-09-26 Tdk株式会社 製品収容容器用パージシステム及び該パージシステムに供せられる台
WO2007107983A2 (fr) 2006-03-17 2007-09-27 Shlomo Shmuelov Système de stockage et de purge pour tranches semi-conductrices
KR101474572B1 (ko) * 2006-06-19 2014-12-18 엔테그리스, 아이엔씨. 레티클 스토리지 정화시스템
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US9212786B2 (en) * 2009-06-30 2015-12-15 Roylan Developments Limited Apparatus for purging containers for storing sensitive materials
JP5598728B2 (ja) * 2011-12-22 2014-10-01 株式会社ダイフク 不活性ガス注入装置
JP6087161B2 (ja) * 2012-02-03 2017-03-01 東京エレクトロン株式会社 基板収容容器のパージ方法
KR101418812B1 (ko) * 2012-10-31 2014-07-16 크린팩토메이션 주식회사 웨이퍼 퍼지 가능한 천장 보관 장치
JP6047228B2 (ja) * 2013-03-15 2016-12-21 株式会社日立国際電気 基板処理装置、半導体装置の製造方法およびプログラム
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Also Published As

Publication number Publication date
DE102016205597A1 (de) 2017-10-05
US10847396B2 (en) 2020-11-24
US20190131155A1 (en) 2019-05-02
DE102016205597B4 (de) 2022-06-23
WO2017174540A1 (fr) 2017-10-12

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