SG11201808117RA - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
SG11201808117RA
SG11201808117RA SG11201808117RA SG11201808117RA SG11201808117RA SG 11201808117R A SG11201808117R A SG 11201808117RA SG 11201808117R A SG11201808117R A SG 11201808117RA SG 11201808117R A SG11201808117R A SG 11201808117RA SG 11201808117R A SG11201808117R A SG 11201808117RA
Authority
SG
Singapore
Prior art keywords
processing apparatus
substrate processing
polishing surface
fluid
communicates
Prior art date
Application number
SG11201808117RA
Other languages
English (en)
Inventor
Hiroyuki Shinozaki
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201808117RA publication Critical patent/SG11201808117RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG11201808117RA 2016-04-21 2017-03-14 Substrate processing apparatus SG11201808117RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016085184 2016-04-21
PCT/JP2017/010158 WO2017183360A1 (ja) 2016-04-21 2017-03-14 基板処理装置

Publications (1)

Publication Number Publication Date
SG11201808117RA true SG11201808117RA (en) 2018-10-30

Family

ID=60115849

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201808117RA SG11201808117RA (en) 2016-04-21 2017-03-14 Substrate processing apparatus

Country Status (5)

Country Link
US (1) US20190126430A1 (zh)
JP (1) JP6843126B2 (zh)
SG (1) SG11201808117RA (zh)
TW (1) TWI733780B (zh)
WO (1) WO2017183360A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102478384B1 (ko) * 2017-12-26 2022-12-16 주식회사 케이씨텍 기판 처리 장치
JP7089420B2 (ja) * 2018-06-29 2022-06-22 キヤノン株式会社 基板処理装置、および物品製造方法
JP7162465B2 (ja) 2018-08-06 2022-10-28 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7083722B2 (ja) * 2018-08-06 2022-06-13 株式会社荏原製作所 研磨装置、及び、研磨方法
KR20220073192A (ko) * 2020-11-26 2022-06-03 에스케이실트론 주식회사 연마 패드 세정 장치 및 연마 장치
WO2024044023A1 (en) * 2022-08-24 2024-02-29 Applied Materials, Inc. Pad surface cleaning device around pad conditioner to enable insitu pad conditioning

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3722591B2 (ja) * 1997-05-30 2005-11-30 株式会社日立製作所 研磨装置
JPH11291155A (ja) * 1998-04-10 1999-10-26 Hitachi Cable Ltd 脆性材料研磨用定盤の掃除方法及びその装置並びに研磨装置
JP2001277095A (ja) * 2000-03-31 2001-10-09 Mitsubishi Materials Corp パッドコンディショニング装置及びパッドコンディショニング方法
JP2007035973A (ja) * 2005-07-27 2007-02-08 Fujitsu Ltd 半導体装置の製造方法及び研磨装置
TWI548483B (zh) * 2011-07-19 2016-09-11 荏原製作所股份有限公司 研磨裝置及方法
US9138861B2 (en) * 2012-02-15 2015-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. CMP pad cleaning apparatus
JP5911792B2 (ja) * 2012-12-17 2016-04-27 株式会社荏原製作所 研磨方法
WO2014149676A1 (en) * 2013-03-15 2014-09-25 Applied Materials, Inc. Polishing pad cleaning with vacuum apparatus
KR101841549B1 (ko) * 2015-10-29 2018-03-23 에스케이실트론 주식회사 드레싱 장치 및 이를 포함하는 웨이퍼 연마 장치

Also Published As

Publication number Publication date
JPWO2017183360A1 (ja) 2019-02-21
TW201801807A (zh) 2018-01-16
WO2017183360A1 (ja) 2017-10-26
TWI733780B (zh) 2021-07-21
US20190126430A1 (en) 2019-05-02
JP6843126B2 (ja) 2021-03-17

Similar Documents

Publication Publication Date Title
SG11201808117RA (en) Substrate processing apparatus
SG10201808052SA (en) Substrate Polishing Apparatus
USD794753S1 (en) Showerhead for a semiconductor processing chamber
USD793526S1 (en) Showerhead for a semiconductor processing chamber
USD745231S1 (en) Hand carriable vacuum cleaner
USD790041S1 (en) Gas dispersing plate for semiconductor manufacturing apparatus
USD741823S1 (en) Vaporizer for substrate processing apparatus
MX2016014030A (es) Aparato de limpieza de superficie.
GB2561785B (en) Dirt-collection chamber and suction head for a vacuum cleaner
SG10201402882PA (en) Chamber wall of a plasma processing apparatus including a flowing protective liquid layer
MX2019002775A (es) Soporte de vacío con junta de falda extensible.
MY172257A (en) Non-contact transfer hand
USD722061S1 (en) Device support for a work surface
USD831198S1 (en) Collet for a fluid delivery apparatus
EP2561783A3 (en) Auxiliary suction nozzle and port for vacuum cleaner
MX2019014698A (es) Dispositivo de procesamiento de alimentos, que comprende un frasco.
USD890572S1 (en) Gas supply nozzle for substrate processing apparatus
MY181954A (en) Conveying apparatus
EP2989952A3 (en) Suction nozzle and vacuum cleaner having the same
MY173967A (en) Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism
MX2018005086A (es) Modulos de chip microfluidico, sistemas, y metodos para mejorar la calidad del aire.
AU2015214510A8 (en) Extractor cleaning machine
MX2018013531A (es) Compartimento para infusión en un sustrato lineal.
TW201612355A (en) Film deposition apparatus
MX2016012954A (es) Instalacion de corte por suspension de agua-abrasivo.