SG11201804637UA - Composition for post chemical-mechanical-polishing cleaning - Google Patents
Composition for post chemical-mechanical-polishing cleaningInfo
- Publication number
- SG11201804637UA SG11201804637UA SG11201804637UA SG11201804637UA SG11201804637UA SG 11201804637U A SG11201804637U A SG 11201804637UA SG 11201804637U A SG11201804637U A SG 11201804637UA SG 11201804637U A SG11201804637U A SG 11201804637UA SG 11201804637U A SG11201804637U A SG 11201804637UA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- acid
- composition
- mechanical
- pct
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3707—Polyethers, e.g. polyalkyleneoxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0026—Low foaming or foam regulating compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3719—Polyamides or polyimides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
- C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/378—(Co)polymerised monomers containing sulfur, e.g. sulfonate
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3784—(Co)polymerised monomers containing phosphorus
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
- H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
- H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/18—Glass; Plastics
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15201910 | 2015-12-22 | ||
| PCT/EP2016/081847 WO2017108743A1 (en) | 2015-12-22 | 2016-12-20 | Composition for post chemical-mechanical-polishing cleaning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201804637UA true SG11201804637UA (en) | 2018-07-30 |
Family
ID=55023982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201804637UA SG11201804637UA (en) | 2015-12-22 | 2016-12-20 | Composition for post chemical-mechanical-polishing cleaning |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10844325B2 (https=) |
| EP (1) | EP3394234B1 (https=) |
| JP (1) | JP6949846B2 (https=) |
| KR (1) | KR102870073B1 (https=) |
| CN (1) | CN108473918B (https=) |
| SG (1) | SG11201804637UA (https=) |
| TW (1) | TWI794152B (https=) |
| WO (1) | WO2017108743A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6886469B2 (ja) * | 2015-12-22 | 2021-06-16 | ビーエイエスエフ・ソシエタス・エウロパエアＢａｓｆ Ｓｅ | 化学機械研磨後の洗浄組成物 |
| WO2019105777A1 (en) * | 2017-11-29 | 2019-06-06 | Basf Se | A process for styling human hair |
| CN109576090A (zh) * | 2018-12-13 | 2019-04-05 | 中国科学院上海光学精密机械研究所 | 氧化物光学元件化学机械抛光后残留物清洗剂及其制备方法 |
| KR20260046540A (ko) * | 2020-03-19 | 2026-04-07 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 세정 조성물과 이를 사용하는 방법 |
| JP2022144640A (ja) * | 2021-03-19 | 2022-10-03 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 基板処理液、これを用いる基板の製造方法およびデバイスの製造方法 |
| MX2023011631A (es) | 2021-04-01 | 2023-12-15 | Sterilex LLC | Desinfectante/higienizante en polvo sin compuesto de amonio cuaternario (quat). |
| CN119325501A (zh) | 2022-05-31 | 2025-01-17 | 巴斯夫欧洲公司 | 用于清洁包含钴和铜的衬底的组合物、其用途及方法 |
| CN121548628A (zh) | 2023-06-20 | 2026-02-17 | 巴斯夫欧洲公司 | 用于清洁包含钴和铜的衬底的碱性组合物、其用途及方法 |
| CN121399239A (zh) | 2023-06-20 | 2026-01-23 | 巴斯夫欧洲公司 | 用于清洁包含钴和铜的衬底的碱性组合物、其用途及方法 |
| WO2026057376A1 (en) | 2024-09-11 | 2026-03-19 | Basf Se | Alkaline composition, its use and a process for cleaning substrates comprising cobalt and copper |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3907985A (en) * | 1973-07-27 | 1975-09-23 | Burton Parsons And Company Inc | Polystyrene sulfonate containing opthalmic solutions |
| EP0734434A1 (en) * | 1993-12-14 | 1996-10-02 | The Procter & Gamble Company | Liquid laundry detergents containing polyamino acid and polyalkylene glycol |
| DE60006135T2 (de) * | 1999-08-24 | 2004-07-08 | Rodel Holdings, Inc., Wilmington | Zusammensetzung und verfahren zum chemisch-mechanischen polieren von isolatoren und metallen |
| WO2008023215A1 (en) * | 2006-08-23 | 2008-02-28 | Freescale Semiconductor, Inc. | Post chemical mechanical polishing rinse formulation |
| JP4777197B2 (ja) | 2006-09-11 | 2011-09-21 | 富士フイルム株式会社 | 洗浄液及びそれを用いた洗浄方法 |
| US8685909B2 (en) * | 2006-09-21 | 2014-04-01 | Advanced Technology Materials, Inc. | Antioxidants for post-CMP cleaning formulations |
| JP5647517B2 (ja) * | 2007-05-17 | 2014-12-24 | アドバンスド テクノロジー マテリアルズ，インコーポレイテッド | Ｃｍｐ後洗浄配合物用の新規な酸化防止剤 |
| CA2692254C (en) | 2007-08-28 | 2013-12-31 | Ecolab Inc. | Paste-like detergent formulation comprising branched alkoxylated fatty alcohols as non-ionic surfactants |
| US20090056744A1 (en) | 2007-08-29 | 2009-03-05 | Micron Technology, Inc. | Wafer cleaning compositions and methods |
| JP2009069505A (ja) | 2007-09-13 | 2009-04-02 | Tosoh Corp | レジスト除去用洗浄液及び洗浄方法 |
| KR101846597B1 (ko) * | 2010-10-01 | 2018-04-06 | 미쯔비시 케미컬 주식회사 | 반도체 디바이스용 기판의 세정액 및 세정 방법 |
| KR102105381B1 (ko) * | 2012-02-15 | 2020-04-29 | 엔테그리스, 아이엔씨. | 조성물을 이용한 cmp-후 제거 방법 및 그의 이용 방법 |
| TWI573864B (zh) * | 2012-03-14 | 2017-03-11 | 卡博特微電子公司 | 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物 |
| EP3022280B1 (en) * | 2013-07-19 | 2019-01-02 | Ecolab USA Inc. | Mild alkaline solid instrument cleaner |
| KR102040050B1 (ko) * | 2013-08-02 | 2019-11-05 | 동우 화인켐 주식회사 | 웨이퍼 다이싱용 세정제 조성물 |
| JP2015181079A (ja) * | 2014-03-05 | 2015-10-15 | 三洋化成工業株式会社 | 磁気ディスク基板用洗浄剤組成物 |
-
2016
- 2016-12-20 WO PCT/EP2016/081847 patent/WO2017108743A1/en not_active Ceased
- 2016-12-20 CN CN201680075224.6A patent/CN108473918B/zh active Active
- 2016-12-20 US US16/064,918 patent/US10844325B2/en active Active
- 2016-12-20 JP JP2018533247A patent/JP6949846B2/ja active Active
- 2016-12-20 EP EP16822665.2A patent/EP3394234B1/en active Active
- 2016-12-20 KR KR1020187021141A patent/KR102870073B1/ko active Active
- 2016-12-20 SG SG11201804637UA patent/SG11201804637UA/en unknown
- 2016-12-21 TW TW105142442A patent/TWI794152B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017108743A1 (en) | 2017-06-29 |
| CN108473918A (zh) | 2018-08-31 |
| CN108473918B (zh) | 2021-11-30 |
| JP2019502803A (ja) | 2019-01-31 |
| KR20180091928A (ko) | 2018-08-16 |
| EP3394234A1 (en) | 2018-10-31 |
| KR102870073B1 (ko) | 2025-10-13 |
| US10844325B2 (en) | 2020-11-24 |
| JP6949846B2 (ja) | 2021-10-13 |
| TWI794152B (zh) | 2023-03-01 |
| EP3394234B1 (en) | 2019-10-09 |
| US20180371371A1 (en) | 2018-12-27 |
| TW201732026A (zh) | 2017-09-16 |
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