SG11201810119PA - Composition for post chemical-mechanical-polishing cleaning - Google Patents
Composition for post chemical-mechanical-polishing cleaningInfo
- Publication number
- SG11201810119PA SG11201810119PA SG11201810119PA SG11201810119PA SG11201810119PA SG 11201810119P A SG11201810119P A SG 11201810119PA SG 11201810119P A SG11201810119P A SG 11201810119PA SG 11201810119P A SG11201810119P A SG 11201810119PA SG 11201810119P A SG11201810119P A SG 11201810119PA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- ludwigshafen
- composition
- strasse
- chd
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 5
- 238000004140 cleaning Methods 0.000 title abstract 3
- 238000005498 polishing Methods 0.000 title abstract 3
- 101000764817 Chromohalobacter salexigens (strain ATCC BAA-138 / DSM 3043 / CIP 106854 / NCIMB 13768 / 1H11) Oxygen-dependent choline dehydrogenase 1 Proteins 0.000 abstract 2
- 229920002125 Sokalan® Polymers 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 229920001577 copolymer Polymers 0.000 abstract 2
- 235000013350 formula milk Nutrition 0.000 abstract 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 2
- -1 poly(acrylic acid) Polymers 0.000 abstract 2
- 101100220553 Caenorhabditis elegans chd-3 gene Proteins 0.000 abstract 1
- 240000000233 Melia azedarach Species 0.000 abstract 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 abstract 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 abstract 1
- 239000011976 maleic acid Substances 0.000 abstract 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 abstract 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 abstract 1
- 230000008520 organization Effects 0.000 abstract 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
- C11D1/721—End blocked ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/722—Ethers of polyoxyalkylene glycols having mixed oxyalkylene groups; Polyalkoxylated fatty alcohols or polyalkoxylated alkylaryl alcohols with mixed oxyalkylele groups
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
- C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02074—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a planarization of conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 14 December 2017 (14.12.2017) WIPO I PCT ill~~~~~~~~ 011101tIIl tun Hol om moll °nom oimIE (10) International Publication Number WO 2017/211653 Al (51) International Patent Classification: CHD 1/72 (2006.01) C11D 11/00 (2006.01) CHD 1/722 (2006.01) HO1L 21/02 (2006.01) CHD 3/37 (2006.01) (21) International Application Number: PCT/EP2017/063215 (22) International Filing Date: 31 May 2017 (31.05.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 16173998.2 10 June 2016 (10.06.2016) EP (71) Applicant: BASF SE [DE/DE]; Carl-Bosch-Strasse 38, 67056 Ludwigshafen am Rhein (DE). (72) Inventors: DAESCHLEIN, Christian; Markgrafenstr. 4, 44791 Bochum (DE). SIEBERT, Max; Voelklinger Strasse 20, 67063 Ludwigshafen (DE). LAUTER, Michael; Gontardstrasse 4, 68163 Mannheim (DE). LEUNISSEN, Leonardus; Buergermeister-Fries-Strasse 13a, 67069 Lud- wigshafen (DE). GARCIA ROMERO, Ivan; U4 7, 68161 Mannheim (DE). GUEVENC, Haci Osman; Langer Anger 109, 69115 Heidelberg (DE). PRZYBYLSKI, Peter; Lenaustr. 8, 67063 Ludwigshafen (DE). PROELSS, Ju- lian; Bennigsenstr. 40, 67549 Worms (DE). KLIPP, An- dreas; Viktoriaring 15, 67245 Lambsheim (DE). (74) Agent: BASF IP ASSOCIATION; BASF SE, G-FLP- C006, 67056 Ludwigshafen (DE). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) (54) Title: COMPOSITION FOR POST CHEMICAL-MECHANICAL-POLISHING CLEANING N O (I) (57) : Described is a post chemical-mechanical-polishing (post-CMP) cleaning composition comprising or consisting of: (A) one or more water-soluble nonionic copolymers of the general for- mula (I) and mixtures thereof, formula (I) wherein R1 and R3 are idependently from each other hydrogen, methyl, ethyl, n-propyl, iso- propyl, n-butyl, iso-Butyl, or sec-butyl, R2 is methyl and x and y are an integer,1 (B)poly(acrylic acid) (PAA) oracrylic acid-maleic acid copolymer with a mass average molar mass (Mw) of up to 10,000 g/ mol, and (C)water, wherein the pH of the composition is in the range of from 7.0 to 10.5.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16173998 | 2016-06-10 | ||
PCT/EP2017/063215 WO2017211653A1 (en) | 2016-06-10 | 2017-05-31 | Composition for post chemical-mechanical-polishing cleaning |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201810119PA true SG11201810119PA (en) | 2018-12-28 |
Family
ID=56117643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201810119PA SG11201810119PA (en) | 2016-06-10 | 2017-05-31 | Composition for post chemical-mechanical-polishing cleaning |
Country Status (9)
Country | Link |
---|---|
US (1) | US10865361B2 (en) |
EP (1) | EP3469049B1 (en) |
JP (1) | JP6932147B2 (en) |
KR (1) | KR102377573B1 (en) |
CN (1) | CN109312263B (en) |
IL (1) | IL263453B (en) |
SG (1) | SG11201810119PA (en) |
TW (1) | TWI730115B (en) |
WO (1) | WO2017211653A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG11201804636YA (en) * | 2015-12-22 | 2018-07-30 | Basf Se | Composition for post chemical-mechanical-polishing cleaning |
CN109576090A (en) * | 2018-12-13 | 2019-04-05 | 中国科学院上海光学精密机械研究所 | Leftover cleaning agent and preparation method thereof after the chemically mechanical polishing of oxide optical element |
BR112023019583A2 (en) | 2021-04-01 | 2023-12-05 | Sterilex LLC | QUATERNARY-FREE POWDER DISINFECTANT/SANITIZER |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1609847B1 (en) * | 2004-06-25 | 2007-03-21 | JSR Corporation | Cleaning composition for semiconductor components and process for manufacturing semiconductor device |
US7311856B2 (en) * | 2005-03-30 | 2007-12-25 | Cabot Microelectronics Corporation | Polymeric inhibitors for enhanced planarization |
WO2006125462A1 (en) * | 2005-05-25 | 2006-11-30 | Freescale Semiconductor, Inc | Cleaning solution for a semiconductor wafer |
JP3803360B2 (en) * | 2005-08-31 | 2006-08-02 | 花王株式会社 | Cleaning composition |
US20100273330A1 (en) * | 2006-08-23 | 2010-10-28 | Citibank N.A. As Collateral Agent | Rinse formulation for use in the manufacture of an integrated circuit |
JP4777197B2 (en) | 2006-09-11 | 2011-09-21 | 富士フイルム株式会社 | Cleaning liquid and cleaning method using the same |
US20090056744A1 (en) | 2007-08-29 | 2009-03-05 | Micron Technology, Inc. | Wafer cleaning compositions and methods |
JP2009069505A (en) | 2007-09-13 | 2009-04-02 | Tosoh Corp | Cleaning solution and cleaning method for removing resist |
JP2012072267A (en) * | 2010-09-28 | 2012-04-12 | Sanyo Chem Ind Ltd | Detergent for electronic material |
US10176979B2 (en) * | 2012-02-15 | 2019-01-08 | Entegris, Inc. | Post-CMP removal using compositions and method of use |
US20160122696A1 (en) * | 2013-05-17 | 2016-05-05 | Advanced Technology Materials, Inc. | Compositions and methods for removing ceria particles from a surface |
SG11201804636YA (en) * | 2015-12-22 | 2018-07-30 | Basf Se | Composition for post chemical-mechanical-polishing cleaning |
-
2017
- 2017-05-31 US US16/307,191 patent/US10865361B2/en active Active
- 2017-05-31 EP EP17726645.9A patent/EP3469049B1/en active Active
- 2017-05-31 CN CN201780034922.6A patent/CN109312263B/en active Active
- 2017-05-31 SG SG11201810119PA patent/SG11201810119PA/en unknown
- 2017-05-31 JP JP2018564814A patent/JP6932147B2/en active Active
- 2017-05-31 WO PCT/EP2017/063215 patent/WO2017211653A1/en unknown
- 2017-05-31 KR KR1020197000645A patent/KR102377573B1/en active IP Right Grant
- 2017-05-31 IL IL263453A patent/IL263453B/en unknown
- 2017-06-08 TW TW106118993A patent/TWI730115B/en active
Also Published As
Publication number | Publication date |
---|---|
US20190144781A1 (en) | 2019-05-16 |
US10865361B2 (en) | 2020-12-15 |
EP3469049B1 (en) | 2020-07-22 |
IL263453A (en) | 2019-01-31 |
TW201809251A (en) | 2018-03-16 |
KR102377573B1 (en) | 2022-03-22 |
EP3469049A1 (en) | 2019-04-17 |
KR20190016093A (en) | 2019-02-15 |
CN109312263A (en) | 2019-02-05 |
TWI730115B (en) | 2021-06-11 |
CN109312263B (en) | 2022-04-15 |
WO2017211653A1 (en) | 2017-12-14 |
IL263453B (en) | 2022-08-01 |
JP6932147B2 (en) | 2021-09-08 |
JP2019518849A (en) | 2019-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201804636YA (en) | Composition for post chemical-mechanical-polishing cleaning | |
SG11201804934PA (en) | Novel Compounds | |
SG11201901623TA (en) | Comb polymers for improving noack evaporation loss of engine oil formulations | |
SG11201909432SA (en) | Compounds for increasing genome editing efficiency | |
SG11201807301SA (en) | Spiro-condensed pyrrolidine derivatives as deubiquitylating enzymes (dub) inhibitors | |
SG11201808878UA (en) | Heterocyclic compounds as ret kinase inhibitors | |
SG11201808799SA (en) | Amine-substituted aryl or heteroaryl compounds as ehmt1 and ehmt2 inhibitors | |
SG11201810119PA (en) | Composition for post chemical-mechanical-polishing cleaning | |
SG11201806845VA (en) | Moisturizing compositions and uses thereof | |
SG11201900545TA (en) | Pharmaceutical compounds | |
SG11201803686UA (en) | Prodrugs of a jak inhibitor compound for treatment of gastrointestinal inflammatory disease | |
SG11201804637UA (en) | Composition for post chemical-mechanical-polishing cleaning | |
SG11201810402PA (en) | Process for preparing high-reactivity isobutene homo- or copolymers | |
SG11201804916PA (en) | Three-dimensional polymer networks with channels situated therein | |
SG11201808566WA (en) | Polymorphic form of n-{6-(2-hydroxypropan-2-yl)-2-[2-(methylsulphonyl)ethyl]-2h-indazol-5-yl}-6-(trifluoromethyl)pyridine-2-carboxamide | |
SG11201900405XA (en) | Compounds, compositions and methods for treating or preventing a sympton associated with gout or hyperuricemia | |
SG11201804223TA (en) | OCTAHYDROPYRROLO [3, 4-c] PYRROLE DERIVATIVES AND USES THEREOF | |
SG11201806480UA (en) | Derivatives of pyrroloimidazole or analogues thereof which are useful for the treatment of inter alia cancer | |
SG11201809681WA (en) | Low-to-mid range water-reducing polymer with mixed polyoxyalkylene side chains | |
SG11201805898RA (en) | Liquid composition comprising a multistage polymer, its method of preparation and its use | |
SG11201809976PA (en) | Protection of plant extracts and compounds from degradation | |
SG11201806393QA (en) | Use of gabaa receptor modulators for treatment of itch | |
SG11201807549TA (en) | Combination of a cxcr4 antagonist and an immune checkpoint inhibitor | |
SG11201900043TA (en) | Antibody formulations | |
SG11201807775SA (en) | Aqueous polymer dispersions, a method for their preparation and the use thereof as pour-point depressants for crude oil, petroleum, and petroleum products |