SG11201709208PA - Laminating apparatus - Google Patents
Laminating apparatusInfo
- Publication number
- SG11201709208PA SG11201709208PA SG11201709208PA SG11201709208PA SG11201709208PA SG 11201709208P A SG11201709208P A SG 11201709208PA SG 11201709208P A SG11201709208P A SG 11201709208PA SG 11201709208P A SG11201709208P A SG 11201709208PA SG 11201709208P A SG11201709208P A SG 11201709208PA
- Authority
- SG
- Singapore
- Prior art keywords
- laminating apparatus
- laminating
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1054—Regulating the dimensions of the laminate, e.g. by adjusting the nip or platen gap
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C43/183—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the preformed layer being a lining, e.g. shaped in the mould before compression moulding, or a preformed shell adapted to the shape of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/20—Making multilayered or multicoloured articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/34—Heating or cooling presses or parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5808—Measuring, controlling or regulating pressure or compressing force
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/28—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2905/00—Use of metals, their alloys or their compounds, as mould material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Press Drives And Press Lines (AREA)
- Presses And Accessory Devices Thereof (AREA)
- Control Of Presses (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015115700 | 2015-06-08 | ||
PCT/JP2016/066520 WO2016199687A1 (en) | 2015-06-08 | 2016-06-03 | Laminating apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201709208PA true SG11201709208PA (en) | 2017-12-28 |
Family
ID=57503978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201709208PA SG11201709208PA (en) | 2015-06-08 | 2016-06-03 | Laminating apparatus |
Country Status (8)
Country | Link |
---|---|
US (1) | US10239299B2 (en) |
JP (1) | JP6125105B1 (en) |
KR (1) | KR102266461B1 (en) |
CN (1) | CN107614232B (en) |
MY (1) | MY185498A (en) |
SG (1) | SG11201709208PA (en) |
TW (1) | TWI674052B (en) |
WO (1) | WO2016199687A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107750092B (en) * | 2017-11-18 | 2023-06-20 | 上海伯乐电子有限公司 | Automatic thermal protruding equipment for printed circuit board |
CN108437437A (en) * | 2018-05-17 | 2018-08-24 | 深圳市永顺创能技术有限公司 | A kind of high-precision adjustment platform |
JP6878365B2 (en) * | 2018-08-20 | 2021-05-26 | ニッコー・マテリアルズ株式会社 | Laminating equipment and laminating method |
TWI681701B (en) * | 2018-09-03 | 2020-01-01 | 活躍科技股份有限公司 | Energy-saving platen press |
CN111114085A (en) * | 2018-10-31 | 2020-05-08 | 东泰高科装备科技有限公司 | Laminating apparatus |
CN111114883A (en) * | 2018-10-31 | 2020-05-08 | 东泰高科装备科技有限公司 | Film sticking machine |
KR102144768B1 (en) * | 2018-11-19 | 2020-08-14 | (주)카스아이엔씨 | High frequency bonding machine with transfer cylinder and pressing cylinder |
SK500282019A3 (en) * | 2019-05-28 | 2020-12-02 | Manz Slovakia S R O | Device for pressing shaped moldings, particularly into multilayer film |
CN110065289A (en) * | 2019-05-29 | 2019-07-30 | 厦门弘信电子科技股份有限公司 | A kind of chip fast press automatically |
CN110170578B (en) * | 2019-06-28 | 2020-07-24 | 湖南元创机械有限公司 | Automobile metal plate stamping die |
JP6995815B2 (en) * | 2019-10-11 | 2022-01-17 | ニッコー・マテリアルズ株式会社 | Laminating device and laminating method using it |
JP7245768B2 (en) * | 2019-12-24 | 2023-03-24 | 株式会社日本製鋼所 | LAMINATE SYSTEM AND METHOD OF CONTROLLING THE LAMINATE SYSTEM |
JP6929989B1 (en) | 2020-05-19 | 2021-09-01 | ニッコー・マテリアルズ株式会社 | Laminating equipment |
JP6995929B2 (en) * | 2020-05-28 | 2022-01-17 | ニッコー・マテリアルズ株式会社 | Laminating equipment |
TWI819316B (en) * | 2021-01-22 | 2023-10-21 | 日商日興材料股份有限公司 | laminated device |
US11325365B1 (en) | 2021-02-16 | 2022-05-10 | Nikko-Materials Co., Ltd. | Laminating apparatus |
TWI795734B (en) * | 2021-02-26 | 2023-03-11 | 志聖工業股份有限公司 | Laminator |
US11485124B1 (en) * | 2021-07-29 | 2022-11-01 | Nikko-Materials Co., Ltd. | Laminating apparatus and laminating method using same |
JP7033356B1 (en) | 2021-08-23 | 2022-03-10 | 伸和コントロールズ株式会社 | Laminating system, cooling device for laminating system, film laminating cutting device, laminating method, and manufacturing method of laminated product |
JP7106242B1 (en) * | 2022-04-19 | 2022-07-26 | 株式会社日本製鋼所 | Laminate molding system control method and laminate molding system |
JP7097520B1 (en) * | 2022-04-19 | 2022-07-07 | 株式会社日本製鋼所 | Laminate molding system, control method of laminating molding system, and manufacturing method of laminated molded product |
CN114554733B (en) * | 2022-04-25 | 2022-06-28 | 绵阳新能智造科技有限公司 | Pasting device for laminated PCB |
WO2024015435A1 (en) * | 2022-07-13 | 2024-01-18 | Mjr Vision Llc | Curing system and method for curing pressure-sensitive adhesive applied to products |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3803820B2 (en) | 2000-10-16 | 2006-08-02 | 株式会社名機製作所 | Laminating equipment |
JP3646101B2 (en) | 2002-04-08 | 2005-05-11 | ニチゴー・モートン株式会社 | Lamination method |
JP2004090398A (en) | 2002-08-30 | 2004-03-25 | Uht Corp | Press machine for laminated plate |
JP2004172087A (en) * | 2002-11-05 | 2004-06-17 | Ngk Insulators Ltd | Display |
US20090166487A1 (en) * | 2005-02-04 | 2009-07-02 | Pollack Robert W | Universal tile accessory system |
JP4926840B2 (en) | 2006-06-07 | 2012-05-09 | ニチゴー・モートン株式会社 | Laminating apparatus and laminating method using the same |
JP2009166487A (en) | 2007-12-18 | 2009-07-30 | Nichigo Morton Co Ltd | Flat pressing machine, laminating apparatus and laminating method using them |
JP2010099730A (en) | 2008-10-27 | 2010-05-06 | Yamada Dobby Co Ltd | Press |
JP2010155350A (en) * | 2008-12-26 | 2010-07-15 | Nisshinbo Holdings Inc | Laminating device |
CN103958150B (en) * | 2012-11-09 | 2017-09-19 | 夏普株式会社 | Shape material producing device and molding manufacture method |
JP5685672B1 (en) | 2014-07-10 | 2015-03-18 | 株式会社山岡製作所 | Resin molding method |
-
2016
- 2016-06-03 WO PCT/JP2016/066520 patent/WO2016199687A1/en active Application Filing
- 2016-06-03 TW TW105117483A patent/TWI674052B/en active
- 2016-06-03 MY MYPI2017704410A patent/MY185498A/en unknown
- 2016-06-03 CN CN201680029538.2A patent/CN107614232B/en active Active
- 2016-06-03 JP JP2016536790A patent/JP6125105B1/en active Active
- 2016-06-03 SG SG11201709208PA patent/SG11201709208PA/en unknown
- 2016-06-03 US US15/575,442 patent/US10239299B2/en active Active
- 2016-06-03 KR KR1020177033698A patent/KR102266461B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US10239299B2 (en) | 2019-03-26 |
TWI674052B (en) | 2019-10-01 |
MY185498A (en) | 2021-05-19 |
CN107614232B (en) | 2020-02-07 |
KR102266461B1 (en) | 2021-06-17 |
CN107614232A (en) | 2018-01-19 |
WO2016199687A1 (en) | 2016-12-15 |
KR20180016997A (en) | 2018-02-20 |
US20180162111A1 (en) | 2018-06-14 |
TW201707536A (en) | 2017-02-16 |
JPWO2016199687A1 (en) | 2017-06-22 |
JP6125105B1 (en) | 2017-05-10 |
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