SG11201707342TA - Contact probe for a testing head - Google Patents

Contact probe for a testing head

Info

Publication number
SG11201707342TA
SG11201707342TA SG11201707342TA SG11201707342TA SG11201707342TA SG 11201707342T A SG11201707342T A SG 11201707342TA SG 11201707342T A SG11201707342T A SG 11201707342TA SG 11201707342T A SG11201707342T A SG 11201707342TA SG 11201707342T A SG11201707342T A SG 11201707342TA
Authority
SG
Singapore
Prior art keywords
contact probe
testing head
testing
head
probe
Prior art date
Application number
SG11201707342TA
Other languages
English (en)
Inventor
Roberto Crippa
Giuseppe Crippa
Raffaele Vallauri
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Publication of SG11201707342TA publication Critical patent/SG11201707342TA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
SG11201707342TA 2015-03-13 2016-03-09 Contact probe for a testing head SG11201707342TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITMI20150382 2015-03-13
PCT/EP2016/055023 WO2016146451A1 (en) 2015-03-13 2016-03-09 Contact probe for a testing head

Publications (1)

Publication Number Publication Date
SG11201707342TA true SG11201707342TA (en) 2017-10-30

Family

ID=53052982

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201707342TA SG11201707342TA (en) 2015-03-13 2016-03-09 Contact probe for a testing head

Country Status (10)

Country Link
US (2) US20170269125A1 (zh)
EP (1) EP3268750A1 (zh)
JP (1) JP6752828B2 (zh)
KR (1) KR102487269B1 (zh)
CN (1) CN107580680B (zh)
MY (1) MY186744A (zh)
PH (1) PH12017501671A1 (zh)
SG (1) SG11201707342TA (zh)
TW (1) TWI704352B (zh)
WO (1) WO2016146451A1 (zh)

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* Cited by examiner, † Cited by third party
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DE102017002150A1 (de) * 2017-03-06 2018-09-06 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Kontaktelement
TWI713939B (zh) 2017-12-18 2020-12-21 義大利商探針科技公司 用於測試電子裝置的測試頭的接觸探針
WO2019183548A1 (en) * 2018-03-22 2019-09-26 Formfactor, Inc. Probe tip with embedded skate
IT201900024889A1 (it) * 2019-12-19 2021-06-19 Technoprobe Spa Sonda di contatto per applicazioni ad alta frequenza con migliorata portata di corrente
IT202000017539A1 (it) * 2020-07-20 2022-01-20 Technoprobe Spa Sonda di contatto per testa di misura
DE102020126546A1 (de) 2020-10-09 2022-04-14 Infineon Technologies Ag Ein teststift mit einer stiftspitze mit seitlich angeordneten stiftspitzenabschnitten
KR102577539B1 (ko) * 2021-04-09 2023-09-12 (주)포인트엔지니어링 전기 전도성 접촉핀 및 이의 제조방법
KR20220164899A (ko) * 2021-06-07 2022-12-14 (주)포인트엔지니어링 전기 전도성 접촉핀
KR102321083B1 (ko) * 2021-07-21 2021-11-03 (주)새한마이크로텍 접촉 프로브
JP2024082419A (ja) * 2022-12-08 2024-06-20 株式会社日本マイクロニクス プローブ

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AU3603497A (en) * 1996-07-05 1998-02-02 Formfactor, Inc. Floating lateral support for ends of elongate interconnection elements
JPH10319039A (ja) * 1997-05-19 1998-12-04 Toshiba Corp プローブ用垂直ニードル、垂直ニードル型プローブおよびそれに用いられる複合細線
JP3578959B2 (ja) * 2000-02-24 2004-10-20 松下電器産業株式会社 テーブルタップおよびテーブルタップを用いた監視システム
CN1285915C (zh) * 2001-07-02 2006-11-22 日本发条株式会社 导电性接头
ATE376679T1 (de) * 2004-03-24 2007-11-15 Technoprobe Spa Kontaktstift für einen prüfkopf
US9476911B2 (en) * 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
JP2005351846A (ja) * 2004-06-14 2005-12-22 Micronics Japan Co Ltd プローブ針
US7609080B2 (en) * 2005-03-22 2009-10-27 Formfactor, Inc. Voltage fault detection and protection
JP4684855B2 (ja) * 2005-11-08 2011-05-18 株式会社日本マイクロニクス プローブおよびその製造方法
US7759776B2 (en) * 2006-03-28 2010-07-20 Taiwan Semiconductor Manufacturing Co., Ltd. Space transformer having multi-layer pad structures
DE102006054673A1 (de) 2006-11-17 2008-05-21 Suss Microtec Test Systems Gmbh Sondenaufnahme zur Halterung einer Sonde zur Prüfung von Halbleiterbauelementen, Sondenhalterarm und Prüfvorrichtung
KR100885064B1 (ko) 2007-05-31 2009-02-25 송광석 반도체소자 검사용 접촉체
DE102007034251B4 (de) 2007-07-23 2013-12-05 Continental Automotive Gmbh Fehleranalyseverfahren für eine Lambda-Sonde, Motorsteuerung für eine Brennkraftmaschine zur Ausführung des Fehleranalyseverfahrens sowie Programmspeicher
KR100920706B1 (ko) * 2007-09-07 2009-10-07 박준언 반도체시험 장치용 커넥터 시스템
DE102008023761B9 (de) * 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
US7740508B2 (en) 2008-09-08 2010-06-22 3M Innovative Properties Company Probe block assembly
CN102025416B (zh) 2009-09-22 2013-12-04 华为技术有限公司 一种定位海缆故障的方法、中继器及通信系统
WO2011132377A1 (ja) * 2010-04-23 2011-10-27 パナソニック株式会社 検知装置及び検知システム
JP2012233861A (ja) * 2011-05-09 2012-11-29 Japan Electronic Materials Corp プローブ
EP2574948B1 (en) * 2011-09-09 2017-08-30 GS Yuasa International Ltd. Electric storage device monitor
JP2013088389A (ja) * 2011-10-21 2013-05-13 Tokyo Electron Ltd プローブカード用接触端子及びプローブカード
US9194887B2 (en) * 2012-11-15 2015-11-24 Advantest America, Inc. Fine pitch probes for semiconductor testing, and a method to fabricate and assemble same
JP6074244B2 (ja) * 2012-12-06 2017-02-01 石福金属興業株式会社 Ａｇ基合金からなるプローブピン用材料、プローブピン、プローブピンの製造方法
US9470715B2 (en) * 2013-01-11 2016-10-18 Mpi Corporation Probe head
KR101439342B1 (ko) * 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
US9329317B2 (en) * 2013-07-10 2016-05-03 Shenzhen China Star Optoelectronics Technology Co., Ltd LCD and backlight module thereof
SG11201510255QA (en) * 2013-07-11 2016-01-28 Johnstech Int Corp Testing apparatus for wafer level ic testing
US9507004B2 (en) * 2013-07-31 2016-11-29 The Government Of The United States Of America, As Represented By The Secretary Of Commerce Electron spin resonance spectrometer and method for using same
US10732201B2 (en) * 2014-04-13 2020-08-04 Infineon Technologies Ag Test probe and method of manufacturing a test probe

Also Published As

Publication number Publication date
CN107580680A (zh) 2018-01-12
EP3268750A1 (en) 2018-01-17
US10228392B2 (en) 2019-03-12
WO2016146451A1 (en) 2016-09-22
JP6752828B2 (ja) 2020-09-09
MY186744A (en) 2021-08-16
JP2018508027A (ja) 2018-03-22
KR20170128352A (ko) 2017-11-22
CN107580680B (zh) 2021-03-09
US20170269125A1 (en) 2017-09-21
TW201640122A (zh) 2016-11-16
KR102487269B1 (ko) 2023-01-11
PH12017501671A1 (en) 2018-03-19
US20170059612A1 (en) 2017-03-02
TWI704352B (zh) 2020-09-11

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