SG11201703778RA - Coated compressive subpad for chemical mechanical polishing - Google Patents

Coated compressive subpad for chemical mechanical polishing

Info

Publication number
SG11201703778RA
SG11201703778RA SG11201703778RA SG11201703778RA SG11201703778RA SG 11201703778R A SG11201703778R A SG 11201703778RA SG 11201703778R A SG11201703778R A SG 11201703778RA SG 11201703778R A SG11201703778R A SG 11201703778RA SG 11201703778R A SG11201703778R A SG 11201703778RA
Authority
SG
Singapore
Prior art keywords
subpad
mechanical polishing
chemical mechanical
compressive
coated
Prior art date
Application number
SG11201703778RA
Inventor
Diane Scott
Paul Andre Lefevre
Original Assignee
Nexplanar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nexplanar Corp filed Critical Nexplanar Corp
Publication of SG11201703778RA publication Critical patent/SG11201703778RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B32B2266/0278—Polyurethane

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201703778RA 2014-11-21 2015-11-12 Coated compressive subpad for chemical mechanical polishing SG11201703778RA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462083101P 2014-11-21 2014-11-21
US14/635,973 US20160144477A1 (en) 2014-11-21 2015-03-02 Coated compressive subpad for chemical mechanical polishing
PCT/US2015/060343 WO2016081272A1 (en) 2014-11-21 2015-11-12 Coated compressive subpad for chemical mechanical polishing

Publications (1)

Publication Number Publication Date
SG11201703778RA true SG11201703778RA (en) 2017-06-29

Family

ID=56009296

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201703778RA SG11201703778RA (en) 2014-11-21 2015-11-12 Coated compressive subpad for chemical mechanical polishing

Country Status (9)

Country Link
US (2) US20160144477A1 (en)
EP (1) EP3221085B1 (en)
JP (1) JP6640854B2 (en)
KR (1) KR102474501B1 (en)
CN (1) CN107206569A (en)
MY (1) MY182612A (en)
SG (1) SG11201703778RA (en)
TW (1) TWI583492B (en)
WO (1) WO2016081272A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
TWI626117B (en) * 2017-01-19 2018-06-11 智勝科技股份有限公司 Polishing pad and polishing method
EP3571009A4 (en) * 2017-01-20 2021-01-20 Applied Materials, Inc. A thin plastic polishing article for cmp applications
US20190212792A1 (en) * 2018-01-05 2019-07-11 Lander LLC Thermally Resistive Electronics Case
US20200206874A1 (en) * 2018-12-28 2020-07-02 Saint-Gobain Abrasives, Inc. Lay flat coated abrasive discs
US20220203497A1 (en) * 2019-04-30 2022-06-30 Cmc Materials, Inc. Chemical-mechanical polishing pad with textured platen adhesive
TWI818029B (en) * 2019-05-31 2023-10-11 智勝科技股份有限公司 Polishing pad, manufacturing method of polishing pad and polishing method
CN116847948A (en) * 2020-12-22 2023-10-03 Cmc材料有限责任公司 Chemical-mechanical polishing subpad with porogen having polymeric shell
CN114227530B (en) * 2021-12-10 2022-05-10 湖北鼎汇微电子材料有限公司 Polishing pad and method for manufacturing semiconductor device

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JP2000077366A (en) * 1998-08-28 2000-03-14 Nitta Ind Corp Polishing cloth and method for attaching/detaching polishing cloth to/from turn table of polishing machine
US6746311B1 (en) * 2000-01-24 2004-06-08 3M Innovative Properties Company Polishing pad with release layer
WO2002002274A2 (en) * 2000-06-30 2002-01-10 Rodel Holdings, Inc. Base-pad for a polishing pad
EP1588802A1 (en) * 2004-04-20 2005-10-26 Psiloquest, Inc. A polishing pad resistant to delamination
JP2005161490A (en) * 2003-12-04 2005-06-23 Diatex Co Ltd Backing material for polishing pad
WO2005077602A1 (en) * 2004-02-17 2005-08-25 Skc Co., Ltd. Base pad polishing pad and multi-layer pad comprising the same
US7132033B2 (en) * 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
JP4859093B2 (en) * 2005-08-05 2012-01-18 東洋ゴム工業株式会社 Multilayer polishing pad and manufacturing method thereof
US7942724B2 (en) * 2006-07-03 2011-05-17 Applied Materials, Inc. Polishing pad with window having multiple portions
JP4964553B2 (en) * 2006-10-03 2012-07-04 株式会社クラレ Polishing pad adhesive
KR20080058860A (en) * 2006-12-22 2008-06-26 삼성전자주식회사 Chemical mechanical polishing method and fabrication method of semiconductor device using the same
US20080274674A1 (en) * 2007-05-03 2008-11-06 Cabot Microelectronics Corporation Stacked polishing pad for high temperature applications
US8430721B2 (en) 2007-12-31 2013-04-30 Innopad, Inc. Chemical-mechanical planarization pad
US7820005B2 (en) * 2008-07-18 2010-10-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad manufacturing process
US7645186B1 (en) * 2008-07-18 2010-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad manufacturing assembly
CA2743774C (en) * 2008-11-24 2017-11-28 Kimberly-Clark Worldwide, Inc. Antimicrobial laminate constructs
WO2010138724A1 (en) * 2009-05-27 2010-12-02 Rogers Corporation Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer
US9017140B2 (en) * 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
JP2012106328A (en) * 2010-03-25 2012-06-07 Toyo Tire & Rubber Co Ltd Laminate polishing pad
JP5858576B2 (en) * 2011-04-21 2016-02-10 東洋ゴム工業株式会社 Hot melt adhesive sheet for laminated polishing pad and support layer with adhesive layer for laminated polishing pad
JP5847031B2 (en) * 2011-07-15 2016-01-20 ローム アンド ハース カンパニーＲｏｈｍ Ａｎｄ Ｈａａｓ Ｃｏｍｐａｎｙ Fluid additives for urethane systems
US10710211B2 (en) * 2012-08-02 2020-07-14 3M Innovative Properties Company Abrasive articles with precisely shaped features and method of making thereof
JP6474346B2 (en) * 2012-08-02 2019-02-27 スリーエム イノベイティブ プロパティズ カンパニー Abrasive element precursor having precisely formed forming portion and method for producing the same
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Also Published As

Publication number Publication date
KR102474501B1 (en) 2022-12-06
TW201632304A (en) 2016-09-16
EP3221085B1 (en) 2024-05-29
MY182612A (en) 2021-01-27
WO2016081272A1 (en) 2016-05-26
US20160144477A1 (en) 2016-05-26
CN107206569A (en) 2017-09-26
KR20170095871A (en) 2017-08-23
JP6640854B2 (en) 2020-02-05
TWI583492B (en) 2017-05-21
JP2017537801A (en) 2017-12-21
US11440158B2 (en) 2022-09-13
EP3221085A1 (en) 2017-09-27
US20180141183A1 (en) 2018-05-24

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