SG11201702198QA - Transparent conductive layer, a film comprising the layer, and a process for its production - Google Patents

Transparent conductive layer, a film comprising the layer, and a process for its production

Info

Publication number
SG11201702198QA
SG11201702198QA SG11201702198QA SG11201702198QA SG11201702198QA SG 11201702198Q A SG11201702198Q A SG 11201702198QA SG 11201702198Q A SG11201702198Q A SG 11201702198QA SG 11201702198Q A SG11201702198Q A SG 11201702198QA SG 11201702198Q A SG11201702198Q A SG 11201702198QA
Authority
SG
Singapore
Prior art keywords
layer
film
production
transparent conductive
conductive layer
Prior art date
Application number
SG11201702198QA
Other languages
English (en)
Inventor
Rui Rachel Zhang
Garo Khanarian
Herve Dietsch
Andreas Kühner
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG11201702198QA publication Critical patent/SG11201702198QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/36—Micro- or nanomaterials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Laminated Bodies (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
SG11201702198QA 2014-09-22 2015-09-17 Transparent conductive layer, a film comprising the layer, and a process for its production SG11201702198QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462053272P 2014-09-22 2014-09-22
PCT/EP2015/071350 WO2016046061A1 (en) 2014-09-22 2015-09-17 Transparent conductive layer, a film comprising the layer, and a process for its production

Publications (1)

Publication Number Publication Date
SG11201702198QA true SG11201702198QA (en) 2017-04-27

Family

ID=54148509

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201702198QA SG11201702198QA (en) 2014-09-22 2015-09-17 Transparent conductive layer, a film comprising the layer, and a process for its production

Country Status (10)

Country Link
US (1) US10201082B2 (ko)
EP (1) EP3197962A1 (ko)
JP (1) JP2017535930A (ko)
KR (1) KR20170060094A (ko)
CN (1) CN107257942A (ko)
CA (1) CA2961842A1 (ko)
IL (1) IL251209A0 (ko)
SG (1) SG11201702198QA (ko)
TW (1) TWI689951B (ko)
WO (1) WO2016046061A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170135909A (ko) * 2015-04-09 2017-12-08 바스프 에스이 전기 전도성 투명층의 제조를 위한 알코올/물 혼합물 중의 은 나노와이어 및 분산된 스티렌/(메트)아크릴 공중합체를 포함하는 조성물
US10703925B2 (en) * 2017-04-13 2020-07-07 The Diller Corporation Electrically-conductive ink formulations containing microcrystalline cellulose, methods of printing electrically-conductive traces, and laminates containing the same
DE102019107423B4 (de) * 2019-03-22 2021-04-22 Pas Deutschland Gmbh Verfahren zur Herstellung einer Sensorvorrichtung, Sensorvorrichtung, Bedienblende und Haushaltsgerät
KR102461794B1 (ko) 2020-08-13 2022-11-02 한국과학기술연구원 은 나노와이어 메쉬 전극 및 이의 제조방법
CN113744927A (zh) * 2021-08-03 2021-12-03 暨南大学 一种金属纳米线的光熔接方法、金属透明导电电极及金属纳米线油墨

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US6300594B1 (en) 1998-02-19 2001-10-09 Ricoh Microelectronics Company, Ltd. Method and apparatus for machining an electrically conductive film
SG150514A1 (en) 2005-08-12 2009-03-30 Cambrios Technologies Corp Nanowires-based transparent conductors
JP5062721B2 (ja) 2006-06-27 2012-10-31 国立大学法人京都大学 ナノサイズワイヤーの製造方法
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
JP2009094033A (ja) * 2007-10-12 2009-04-30 Konica Minolta Holdings Inc 透明導電材料その製造方法及びそれを用いた透明導電素子
JP5289859B2 (ja) * 2008-08-13 2013-09-11 日本写真印刷株式会社 導電性パターン被覆体の製造方法および導電性パターン被覆体
CN102789131A (zh) * 2008-08-22 2012-11-21 日立化成工业株式会社 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板
JP5561714B2 (ja) * 2009-10-13 2014-07-30 日本写真印刷株式会社 ディスプレイ電極用透明導電膜
EP2579276A4 (en) * 2010-05-28 2014-02-19 Shinetsu Polymer Co TRANSPARENT CONDUCTIVE FILM AND CONDUCTIVE SUBSTRATE USING THE SAME
KR20140014292A (ko) 2011-06-24 2014-02-05 가부시키가이샤 구라레 도전막 형성 방법, 도전막, 절연화 방법 및 절연막
JPWO2013094477A1 (ja) * 2011-12-19 2015-04-27 パナソニックＩｐマネジメント株式会社 透明導電膜、透明導電膜付き基材及びその製造方法
KR20140109965A (ko) * 2011-12-21 2014-09-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 은 나노와이어-기반 투명 전기 전도성 코팅의 레이저 패턴화
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KR102148154B1 (ko) * 2013-01-22 2020-08-26 주식회사 동진쎄미켐 투명 전도성 막 코팅 조성물, 투명 전도성 막 및 투명 전도성 막의 제조 방법
CN105122387B (zh) 2013-02-21 2019-01-11 恩耐公司 非烧蚀性激光图案化
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KR102026165B1 (ko) * 2013-04-26 2019-09-27 쇼와 덴코 가부시키가이샤 도전 패턴의 제조방법 및 도전 패턴 형성 기판
TWI518756B (zh) * 2013-08-16 2016-01-21 財團法人工業技術研究院 圖案化的導電薄膜及其製造方法與應用
US11274223B2 (en) * 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
US20150209897A1 (en) * 2014-01-27 2015-07-30 Carestream Health, Inc. Polarized laser for patterning of silver nanowire transparent conductive films

Also Published As

Publication number Publication date
KR20170060094A (ko) 2017-05-31
CN107257942A (zh) 2017-10-17
US20170251553A1 (en) 2017-08-31
WO2016046061A1 (en) 2016-03-31
TWI689951B (zh) 2020-04-01
IL251209A0 (en) 2017-05-29
TW201618124A (zh) 2016-05-16
US10201082B2 (en) 2019-02-05
JP2017535930A (ja) 2017-11-30
CA2961842A1 (en) 2016-03-31
EP3197962A1 (en) 2017-08-02

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