SG11201610075XA - Purge device, purge system, purge method, and control method in purge system - Google Patents

Purge device, purge system, purge method, and control method in purge system

Info

Publication number
SG11201610075XA
SG11201610075XA SG11201610075XA SG11201610075XA SG11201610075XA SG 11201610075X A SG11201610075X A SG 11201610075XA SG 11201610075X A SG11201610075X A SG 11201610075XA SG 11201610075X A SG11201610075X A SG 11201610075XA SG 11201610075X A SG11201610075X A SG 11201610075XA
Authority
SG
Singapore
Prior art keywords
purge
control method
purge system
control
purge device
Prior art date
Application number
SG11201610075XA
Other languages
English (en)
Inventor
Masanao Murata
Takashi Yamaji
Shinji Onishi
Original Assignee
Murata Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Machinery Ltd filed Critical Murata Machinery Ltd
Publication of SG11201610075XA publication Critical patent/SG11201610075XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
SG11201610075XA 2014-06-16 2015-04-22 Purge device, purge system, purge method, and control method in purge system SG11201610075XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014123371 2014-06-16
PCT/JP2015/062225 WO2015194255A1 (ja) 2014-06-16 2015-04-22 パージ装置、パージシステム、パージ方法及びパージシステムにおける制御方法

Publications (1)

Publication Number Publication Date
SG11201610075XA true SG11201610075XA (en) 2017-01-27

Family

ID=54935252

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610075XA SG11201610075XA (en) 2014-06-16 2015-04-22 Purge device, purge system, purge method, and control method in purge system

Country Status (9)

Country Link
US (1) US9997387B2 (de)
EP (1) EP3157048B1 (de)
JP (1) JP6217855B2 (de)
KR (1) KR101903441B1 (de)
CN (1) CN106415812B (de)
IL (1) IL249214B (de)
SG (1) SG11201610075XA (de)
TW (1) TWI647017B (de)
WO (1) WO2015194255A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9875921B2 (en) * 2015-05-07 2018-01-23 Fabmatics Gmbh Flexible purge management system
JP6414525B2 (ja) * 2015-09-02 2018-10-31 株式会社ダイフク 保管設備
US10583983B2 (en) * 2016-03-31 2020-03-10 Daifuku Co., Ltd. Container storage facility
JP6572854B2 (ja) * 2016-09-09 2019-09-11 株式会社ダイフク 容器収納設備
JP6610476B2 (ja) * 2016-09-09 2019-11-27 株式会社ダイフク 容器収納設備
JP6623988B2 (ja) * 2016-09-09 2019-12-25 株式会社ダイフク 容器収納設備
EP3584827B1 (de) * 2017-02-20 2022-02-16 Murata Machinery, Ltd. Spülstapelvorrichtung
JP6856015B2 (ja) * 2017-12-20 2021-04-14 株式会社ダイフク 保管設備
JP2019206051A (ja) * 2018-05-29 2019-12-05 川崎重工業株式会社 掃気装置及びそれを備えるロボットシステム並びに掃気方法
CN108782330A (zh) * 2018-06-22 2018-11-13 宿松县乡园禽业贸易有限责任公司 一种卤蛋的高效清洗装置
JP7090513B2 (ja) * 2018-09-06 2022-06-24 東京エレクトロン株式会社 基板処理装置及びパージ方法
KR20200083375A (ko) 2018-12-28 2020-07-08 톈진 씨엔로 사이언스 앤 테크놀로지 컴퍼니. 리미티드 에어컨 저장시스템 및 그 제어방법
JP7414570B2 (ja) 2020-02-14 2024-01-16 キヤノン株式会社 保持装置、およびリソグラフィ装置
CN117581348A (zh) * 2021-06-08 2024-02-20 恩特格里斯公司 晶片容器及清洁系统
CN117882182A (zh) * 2021-10-21 2024-04-12 村田机械株式会社 吹扫系统

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
JPH11168135A (ja) * 1997-12-03 1999-06-22 Toshiba Corp 基板保管装置および基板保管方法
JP2000332095A (ja) 1999-05-20 2000-11-30 Dan Sangyo Kk 基板保管装置及び基板保管方法
JP3902583B2 (ja) * 2003-09-25 2007-04-11 Ｔｄｋ株式会社 可搬式密閉容器内部のパージシステムおよびパージ方法
WO2007107983A2 (en) 2006-03-17 2007-09-27 Shlomo Shmuelov Storage and purge system for semiconductor wafers
JP4670808B2 (ja) * 2006-12-22 2011-04-13 ムラテックオートメーション株式会社 コンテナの搬送システム及び測定用コンテナ
JP4692584B2 (ja) * 2008-07-03 2011-06-01 村田機械株式会社 パージ装置
TWI357474B (en) * 2008-10-14 2012-02-01 Gudeng Prec Industral Co Ltd Gas filling socket, gas filling socket set, and ga
JP5236518B2 (ja) * 2009-02-03 2013-07-17 株式会社ダン・タクマ 保管システムおよび保管方法
WO2012035693A1 (ja) * 2010-09-13 2012-03-22 ムラテックオートメーション株式会社 自動倉庫及び物品搬出方法
EP2717306B1 (de) * 2011-05-25 2020-09-16 Murata Machinery, Ltd. Ladeportvorrichtung, trägersystem und behältertransportverfahren
JP5598728B2 (ja) 2011-12-22 2014-10-01 株式会社ダイフク 不活性ガス注入装置
JP5709011B2 (ja) * 2011-12-26 2015-04-30 株式会社ダイフク 物品保管設備
JP5557061B2 (ja) * 2012-01-04 2014-07-23 株式会社ダイフク 物品保管設備
JP5716968B2 (ja) * 2012-01-04 2015-05-13 株式会社ダイフク 物品保管設備
JP5598734B2 (ja) * 2012-01-06 2014-10-01 株式会社ダイフク 物品保管設備
EP2889235B1 (de) * 2012-08-21 2020-08-05 Murata Machinery, Ltd. Magazinvorrichtung mit entlüftungsfunktionalität, magazineinheit und verfahren zur zufuhr eines reinigungsgases
US9695509B2 (en) * 2012-10-23 2017-07-04 Hitachi Kokusai Electric Inc. Substrate processing apparatus, purging apparatus, method of manufacturing semiconductor device, and recording medium
WO2014141563A1 (ja) * 2013-03-15 2014-09-18 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、基板収納器搬送方法及びプログラム
JP6044467B2 (ja) * 2013-06-26 2016-12-14 株式会社ダイフク 保管システム
JP5884780B2 (ja) * 2013-06-26 2016-03-15 株式会社ダイフク 保管設備
JP5874691B2 (ja) * 2013-06-26 2016-03-02 株式会社ダイフク 不活性気体供給設備
JP6403431B2 (ja) * 2013-06-28 2018-10-10 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、流量監視方法及び半導体装置の製造方法並びに流量監視プログラム
US9607873B2 (en) * 2014-02-07 2017-03-28 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and operation method thereof
JP6132036B2 (ja) * 2014-02-07 2017-05-24 村田機械株式会社 パージ装置及びパージ方法
WO2015166710A1 (ja) * 2014-04-28 2015-11-05 村田機械株式会社 パージ装置及びパージ方法
KR101865091B1 (ko) * 2014-06-16 2018-06-07 무라다기카이가부시끼가이샤 퍼지 스토커 및 퍼지 방법
JP6217598B2 (ja) * 2014-11-12 2017-10-25 株式会社ダイフク 物品収納設備
JP6451453B2 (ja) * 2015-03-31 2019-01-16 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP6409716B2 (ja) * 2015-09-02 2018-10-24 株式会社ダイフク 保管棚
JP6610475B2 (ja) * 2016-09-09 2019-11-27 株式会社ダイフク 容器保管設備
JP6623988B2 (ja) * 2016-09-09 2019-12-25 株式会社ダイフク 容器収納設備
JP6572854B2 (ja) * 2016-09-09 2019-09-11 株式会社ダイフク 容器収納設備

Also Published As

Publication number Publication date
IL249214B (en) 2020-06-30
JP6217855B2 (ja) 2017-10-25
CN106415812B (zh) 2019-01-11
TWI647017B (zh) 2019-01-11
JPWO2015194255A1 (ja) 2017-04-20
US20170133254A1 (en) 2017-05-11
WO2015194255A1 (ja) 2015-12-23
KR101903441B1 (ko) 2018-10-02
TW201607631A (zh) 2016-03-01
US9997387B2 (en) 2018-06-12
EP3157048A1 (de) 2017-04-19
IL249214A0 (en) 2017-01-31
EP3157048B1 (de) 2021-03-24
KR20170015996A (ko) 2017-02-10
CN106415812A (zh) 2017-02-15
EP3157048A4 (de) 2018-03-14

Similar Documents

Publication Publication Date Title
IL249214A0 (en) A purification device, a purification system, a purification method, and a control method in a purification system
SG11201606480XA (en) System, device and methods for brainwave-based technologies
EP3116166A4 (de) Steuerungssystem, steuerungsvorrichtung und steuerungsverfahren
IL251781B (en) Device and method for improving posture
HK1244388A1 (zh) 方法、裝置和系統
SG11201701316RA (en) Air-conditioning control device, air-conditioning control method, and air-conditioning control program
GB2538480B (en) Vehicle control device, transport system, vehicle control method, and program
HK1219304A1 (zh) 種製冷控制方法、裝置及系統
HK1218451A1 (zh) 種自定義應用程序功能的方法、裝置以及系統
HK1213703A1 (zh) 登陸控制系統、方法和裝置
EP2882180A4 (de) Steuerungsverfahren, steuerungseinrichtung und steuerungsvorrichtung
EP3119130A4 (de) Beschränkungssteuerungsvorrichtung, beschränkungssteuerungssystem und beschränkungssteuerungsverfahren
PT3232555T (pt) Sistema, dispositivo e método de controlo distribuído de submódulo
PT3210417T (pt) Método e aparelho para adquirir informações de sistema
PT3116823T (pt) Dispositivo para distribuição de bebidas, sistema de controlo e processo para distribuição de uma bebida
EP3193510A4 (de) Steuerungsvorrichtung, system und steuerungsverfahren dafür
GB201417624D0 (en) Apparatus, system and method
EP3166262A4 (de) Steuerungsvorrichtung, steuerungssystem, steuerungsverfahren und steuerungsprogramm
GB201701378D0 (en) Display device, display correction device, display correction system, and display correction method
GB2547173B (en) Blade-mounted sensor apparatus, systems, and methods
SG11201500568TA (en) Method for controlling information device, method for providing information, and program
GB2527630B (en) Ranging method, ranging device, location device and location method
GB2532524B (en) Ranging method, ranging device, location device and location method
SG11201608505VA (en) Power-control-network system, control device, and control program
EP3098716A4 (de) Steuerungssystem, steuerungsvorrichtung, personenvorrichtung und steuerungsverfahren