SG11201608771WA - Method and device for plasma treatment of substrates - Google Patents

Method and device for plasma treatment of substrates

Info

Publication number
SG11201608771WA
SG11201608771WA SG11201608771WA SG11201608771WA SG11201608771WA SG 11201608771W A SG11201608771W A SG 11201608771WA SG 11201608771W A SG11201608771W A SG 11201608771WA SG 11201608771W A SG11201608771W A SG 11201608771WA SG 11201608771W A SG11201608771W A SG 11201608771WA
Authority
SG
Singapore
Prior art keywords
substrates
plasma treatment
plasma
treatment
Prior art date
Application number
SG11201608771WA
Other languages
English (en)
Inventor
Thomas Glinsner
Christoph Flötgen
Johann Bernauer
Thomas Wagenleitner
Thomas Wieser
Florian Schmid
Thomas Plach
Roman Anzengruber
Alexander Nones
Uwe Kriebisch
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201608771WA publication Critical patent/SG11201608771WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
SG11201608771WA 2014-05-09 2014-05-09 Method and device for plasma treatment of substrates SG11201608771WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/059524 WO2015169385A1 (de) 2014-05-09 2014-05-09 Verfahren und vorrichtung zur plasmabehandlung von substraten

Publications (1)

Publication Number Publication Date
SG11201608771WA true SG11201608771WA (en) 2016-11-29

Family

ID=50693671

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201608771WA SG11201608771WA (en) 2014-05-09 2014-05-09 Method and device for plasma treatment of substrates

Country Status (8)

Country Link
US (1) US10707059B2 (zh)
EP (1) EP3140850B1 (zh)
JP (1) JP6470313B2 (zh)
KR (1) KR102161873B1 (zh)
CN (1) CN107078013B (zh)
SG (1) SG11201608771WA (zh)
TW (1) TWI677006B (zh)
WO (1) WO2015169385A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102024568B1 (ko) * 2018-02-13 2019-09-24 한국기초과학지원연구원 환형 면방전 플라즈마 장치를 이용한 점상 식각 모듈 및 점상 식각 모듈의 식각 프로파일을 제어하는 방법
JP6966402B2 (ja) 2018-09-11 2021-11-17 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法および基板処理装置の電極
DE102020209801A1 (de) 2020-08-04 2022-02-10 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Regelung der Temperatur eines Substrats oder eines Bauteils, insbesondere einer zu beschichtenden Oberfläche des Substrats oder des Bauteils
DE102020124022A1 (de) 2020-09-15 2022-03-17 centrotherm international AG Werkstückträger, System und Betriebsverfahren für PECVD

Family Cites Families (25)

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Publication number Priority date Publication date Assignee Title
JPS6012734A (ja) * 1983-07-01 1985-01-23 Hitachi Ltd プラズマ処理装置
JPS62130277A (ja) * 1985-08-09 1987-06-12 Toa Nenryo Kogyo Kk アモルフアスシリコン薄膜製造方法および装置
JPS63188943A (ja) * 1987-01-30 1988-08-04 Nec Corp プラズマｃｖｄ装置
US4885074A (en) * 1987-02-24 1989-12-05 International Business Machines Corporation Plasma reactor having segmented electrodes
JPH01108382A (ja) * 1987-10-21 1989-04-25 Nec Corp プラズマ気相成長装置
US5055964A (en) 1990-09-07 1991-10-08 International Business Machines Corporation Electrostatic chuck having tapered electrodes
JPH04317325A (ja) * 1991-04-17 1992-11-09 Nec Corp 半導体装置の製造装置
AU2003195A (en) * 1994-06-21 1996-01-04 Boc Group, Inc., The Improved power distribution for multiple electrode plasma systems using quarter wavelength transmission lines
KR100252210B1 (ko) * 1996-12-24 2000-04-15 윤종용 반도체장치 제조용 건식식각장치
JPH10289881A (ja) * 1997-04-15 1998-10-27 Kokusai Electric Co Ltd プラズマｃｖｄ装置
KR100271767B1 (ko) * 1998-06-09 2001-02-01 윤종용 플라즈마를 이용하는 반도체장치 제조설비
JP2002009043A (ja) 2000-06-23 2002-01-11 Hitachi Ltd エッチング装置及びそれを用いた半導体装置の製造方法
US6741446B2 (en) 2001-03-30 2004-05-25 Lam Research Corporation Vacuum plasma processor and method of operating same
DE10152101A1 (de) 2001-10-23 2003-05-22 Infineon Technologies Ag Elektrostatische Wafer-Haltevorrichtung
US20060278339A1 (en) * 2005-06-13 2006-12-14 Lam Research Corporation, A Delaware Corporation Etch rate uniformity using the independent movement of electrode pieces
JP2007184476A (ja) 2006-01-10 2007-07-19 Hitachi Kokusai Electric Inc 基板処理装置
KR100823302B1 (ko) * 2006-12-08 2008-04-17 주식회사 테스 플라즈마 처리 장치
US20080202689A1 (en) * 2006-12-08 2008-08-28 Tes Co., Ltd. Plasma processing apparatus
KR100978754B1 (ko) 2008-04-03 2010-08-30 주식회사 테스 플라즈마 처리 장치
US20080277064A1 (en) * 2006-12-08 2008-11-13 Tes Co., Ltd. Plasma processing apparatus
KR20080053167A (ko) * 2006-12-08 2008-06-12 주식회사 테스 플라즈마 처리 장치
US8485128B2 (en) 2010-06-30 2013-07-16 Lam Research Corporation Movable ground ring for a plasma processing chamber
US20120164834A1 (en) 2010-12-22 2012-06-28 Kevin Jennings Variable-Density Plasma Processing of Semiconductor Substrates
JP6120527B2 (ja) * 2012-11-05 2017-04-26 東京エレクトロン株式会社 プラズマ処理方法
JP6389528B2 (ja) * 2014-01-28 2018-09-12 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 第１の基板を剥離させるための装置と方法

Also Published As

Publication number Publication date
US20170047203A1 (en) 2017-02-16
JP2017520080A (ja) 2017-07-20
US10707059B2 (en) 2020-07-07
WO2015169385A1 (de) 2015-11-12
TW201543532A (zh) 2015-11-16
CN107078013A (zh) 2017-08-18
KR102161873B1 (ko) 2020-10-06
CN107078013B (zh) 2019-06-21
EP3140850A1 (de) 2017-03-15
KR20170002396A (ko) 2017-01-06
JP6470313B2 (ja) 2019-02-13
TWI677006B (zh) 2019-11-11
EP3140850B1 (de) 2019-10-16

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