SG11201606516RA - Probe unit - Google Patents

Probe unit

Info

Publication number
SG11201606516RA
SG11201606516RA SG11201606516RA SG11201606516RA SG11201606516RA SG 11201606516R A SG11201606516R A SG 11201606516RA SG 11201606516R A SG11201606516R A SG 11201606516RA SG 11201606516R A SG11201606516R A SG 11201606516RA SG 11201606516R A SG11201606516R A SG 11201606516RA
Authority
SG
Singapore
Prior art keywords
probe unit
probe
unit
Prior art date
Application number
SG11201606516RA
Other languages
English (en)
Inventor
Yoshio Yamada
Kohei Hironaka
Kazuya Souma
Masahiro Takahashi
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of SG11201606516RA publication Critical patent/SG11201606516RA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
SG11201606516RA 2014-02-13 2015-02-12 Probe unit SG11201606516RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014025957 2014-02-13
PCT/JP2015/053867 WO2015122472A1 (ja) 2014-02-13 2015-02-12 プローブユニット

Publications (1)

Publication Number Publication Date
SG11201606516RA true SG11201606516RA (en) 2016-09-29

Family

ID=53800212

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201606516RA SG11201606516RA (en) 2014-02-13 2015-02-12 Probe unit

Country Status (4)

Country Link
JP (1) JP6367249B2 (ja)
SG (1) SG11201606516RA (ja)
TW (1) TWI554762B (ja)
WO (1) WO2015122472A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6610322B2 (ja) * 2016-02-15 2019-11-27 オムロン株式会社 プローブピンおよびそれを用いた検査装置
KR101920824B1 (ko) * 2017-02-02 2018-11-21 리노공업주식회사 검사용 프로브 및 소켓
JP6872960B2 (ja) * 2017-04-21 2021-05-19 株式会社日本マイクロニクス 電気的接続装置
JP7021874B2 (ja) * 2017-06-28 2022-02-17 株式会社ヨコオ コンタクトプローブ及び検査治具
JP7032167B2 (ja) * 2018-02-09 2022-03-08 日置電機株式会社 プローブピン、プローブユニットおよび検査装置
JP2020034352A (ja) * 2018-08-28 2020-03-05 オムロン株式会社 プローブピン用ハウジング、検査治具、検査ユニットおよび検査装置
JP7070699B2 (ja) * 2018-11-13 2022-05-18 株式会社村田製作所 プローブ
JP6840298B2 (ja) * 2019-03-13 2021-03-10 日本発條株式会社 コンタクトプローブおよび信号伝送方法
TW202326149A (zh) * 2021-12-21 2023-07-01 日商友華股份有限公司 探針頭

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW372867B (en) * 1996-11-26 1999-11-01 Surgical Laaser Techno Japan Co Ltd A novel surgical instrument an endoscopic instrument
US7256593B2 (en) * 2005-06-10 2007-08-14 Delaware Capital Formation, Inc. Electrical contact probe with compliant internal interconnect
JP4831614B2 (ja) * 2006-08-15 2011-12-07 株式会社ヨコオ ケルビン検査用治具
WO2010061888A1 (ja) * 2008-11-26 2010-06-03 日本発條株式会社 プローブユニット用ベース部材およびプローブユニット
TWI401438B (zh) * 2009-11-20 2013-07-11 Advanced Semiconductor Eng 垂直式探針卡
JP2012112709A (ja) * 2010-11-22 2012-06-14 Unitechno Inc ケルビンコンタクトプローブおよびそれを備えたケルビン検査治具
JP2012181115A (ja) * 2011-03-01 2012-09-20 Nhk Spring Co Ltd コンタクトプローブおよびプローブユニット

Also Published As

Publication number Publication date
WO2015122472A1 (ja) 2015-08-20
JP6367249B2 (ja) 2018-08-01
TW201531712A (zh) 2015-08-16
TWI554762B (zh) 2016-10-21
JPWO2015122472A1 (ja) 2017-03-30

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