SG11201602499TA - Precision batch production method for manufacturing ferrite rods - Google Patents
Precision batch production method for manufacturing ferrite rodsInfo
- Publication number
- SG11201602499TA SG11201602499TA SG11201602499TA SG11201602499TA SG11201602499TA SG 11201602499T A SG11201602499T A SG 11201602499TA SG 11201602499T A SG11201602499T A SG 11201602499TA SG 11201602499T A SG11201602499T A SG 11201602499TA SG 11201602499T A SG11201602499T A SG 11201602499TA
- Authority
- SG
- Singapore
- Prior art keywords
- production method
- batch production
- ferrite rods
- manufacturing ferrite
- precision batch
- Prior art date
Links
- 238000010923 batch production Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 229910000859 α-Fe Inorganic materials 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/18—Phase-shifters
- H01P1/19—Phase-shifters using a ferromagnetic device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Chemically Coating (AREA)
- Coating By Spraying Or Casting (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13187538 | 2013-10-07 | ||
| PCT/EP2014/071079 WO2015052059A1 (en) | 2013-10-07 | 2014-10-01 | Precision batch production method for manufacturing ferrite rods |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201602499TA true SG11201602499TA (en) | 2016-04-28 |
Family
ID=49303841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201602499TA SG11201602499TA (en) | 2013-10-07 | 2014-10-01 | Precision batch production method for manufacturing ferrite rods |
Country Status (7)
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3920200A1 (en) | 2014-05-05 | 2021-12-08 | 3D Glass Solutions, Inc. | 2d and 3d inductors antenna and transformers fabricating photoactive substrates |
| US12165809B2 (en) | 2016-02-25 | 2024-12-10 | 3D Glass Solutions, Inc. | 3D capacitor and capacitor array fabricating photoactive substrates |
| US11264167B2 (en) | 2016-02-25 | 2022-03-01 | 3D Glass Solutions, Inc. | 3D capacitor and capacitor array fabricating photoactive substrates |
| WO2017177171A1 (en) | 2016-04-08 | 2017-10-12 | 3D Glass Solutions, Inc. | Methods of fabricating photosensitive substrates suitable for optical coupler |
| WO2017184352A1 (en) * | 2016-04-18 | 2017-10-26 | Eagantu Ltd. | A wide band radio frequency circulator |
| KR102420212B1 (ko) * | 2017-04-28 | 2022-07-13 | 3디 글래스 솔루션즈 인코포레이티드 | Ｒｆ 서큘레이터 |
| JP6995891B2 (ja) | 2017-07-07 | 2022-01-17 | スリーディー グラス ソリューションズ，インク | パッケージ光活性ガラス基板内のｒｆシステムのための２ｄ及び３ｄのｒｆ集中素子デバイス |
| KR102614826B1 (ko) | 2017-12-15 | 2023-12-19 | 3디 글래스 솔루션즈 인코포레이티드 | 결합 전송 라인 공진 rf 필터 |
| WO2019136024A1 (en) | 2018-01-04 | 2019-07-11 | 3D Glass Solutions, Inc. | Impedance matching conductive structure for high efficiency rf circuits |
| EP3643148A4 (en) | 2018-04-10 | 2021-03-31 | 3D Glass Solutions, Inc. | RF INTEGRATED POWER STATE CAPACITOR |
| EP3645476B1 (en) | 2018-05-29 | 2023-06-14 | 3D Glass Solutions, Inc. | Low insertion loss rf transmission line |
| EP3853944B1 (en) | 2018-09-17 | 2023-08-02 | 3D Glass Solutions, Inc. | High efficiency compact slotted antenna with a ground plane |
| EP3881391A4 (en) | 2018-11-14 | 2022-07-27 | Optisys, LLC | HOLLOW METALLIC WAVEGUIDES HAVING IRREGULAR HEXAGONAL CROSS-SECTIONS AND METHODS OF MAKING THEM |
| US11996600B2 (en) | 2018-11-14 | 2024-05-28 | Optisys, Inc. | Hollow metal waveguides having irregular hexagonal cross sections with specified interior angles |
| EP3884541A4 (en) | 2018-11-19 | 2022-08-24 | Optisys, LLC | IRREGULAR HEXAGONAL CROSS-SECTION HOLLOW METALLIC WAVEGUIDE FILTERS |
| WO2020139951A1 (en) | 2018-12-28 | 2020-07-02 | 3D Glass Solutions, Inc. | Heterogenous integration for rf, microwave and mm wave systems in photoactive glass substrates |
| KR102392858B1 (ko) | 2018-12-28 | 2022-05-03 | 3디 글래스 솔루션즈 인코포레이티드 | 환상형 커패시터 ｒｆ, 마이크로파, 및 ｍｍ 파 시스템들 |
| EP3935687B1 (en) | 2019-04-05 | 2023-12-13 | 3D Glass Solutions, Inc. | Glass based empty substrate integrated waveguide devices |
| CA3136642C (en) | 2019-04-18 | 2023-01-03 | 3D Glass Solutions, Inc. | High efficiency die dicing and release |
| US10727216B1 (en) | 2019-05-10 | 2020-07-28 | Sandisk Technologies Llc | Method for removing a bulk substrate from a bonded assembly of wafers |
| CN110202880B (zh) * | 2019-06-03 | 2020-05-22 | 西安交通大学 | 一种柔性微波器件及其制备方法 |
| US11908617B2 (en) | 2020-04-17 | 2024-02-20 | 3D Glass Solutions, Inc. | Broadband induction |
| US11501905B2 (en) * | 2020-08-31 | 2022-11-15 | Boston Applied Technologies, Inc. | Composition and method of making a monolithic heterostructure of multiferroic thin films |
| WO2022087027A1 (en) | 2020-10-19 | 2022-04-28 | Optisys, LLC | Broadband waveguide to dual-coaxial transition |
| KR20230098264A (ko) | 2020-10-29 | 2023-07-03 | 옵티시스 인코포레이티드 | 통합된 평형 방사 요소 |
| CN112103602B (zh) * | 2020-11-05 | 2021-03-16 | 中国电子科技集团公司第九研究所 | 一种宽带高频法拉第隔离器 |
| CN112909458B (zh) * | 2021-02-08 | 2021-09-10 | 湖南国科雷电子科技有限公司 | 一种w波段e面波导滤波器 |
| US12009596B2 (en) | 2021-05-14 | 2024-06-11 | Optisys, Inc. | Planar monolithic combiner and multiplexer for antenna arrays |
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| JPS5238163A (en) * | 1975-09-20 | 1977-03-24 | Omron Tateisi Electronics Co | Passive element |
| JPS5246787A (en) * | 1975-10-11 | 1977-04-13 | Hitachi Ltd | Coil for integrated circuit and process for production of same |
| JPH02166801A (ja) * | 1988-12-20 | 1990-06-27 | Mitsubishi Electric Corp | ファラデー旋回子用フェライト |
| JPH02188001A (ja) * | 1989-01-17 | 1990-07-24 | Uniden Corp | 円偏波対直線偏波変換器 |
| JPH06164222A (ja) | 1992-11-25 | 1994-06-10 | Murata Mfg Co Ltd | マイクロ波用磁性体及びその製造方法 |
| US5772820A (en) | 1995-08-07 | 1998-06-30 | Northrop Grumman Corporation | Process for fabricating a microwave power device |
| US5828271A (en) | 1997-03-06 | 1998-10-27 | Northrop Grumman Corporation | Planar ferrite toroid microwave phase shifter |
| US5876539A (en) | 1997-06-17 | 1999-03-02 | Northrop Grumman Corporaiton | Fabrication of ferrite toroids |
| US6060433A (en) | 1998-01-26 | 2000-05-09 | Nz Applied Technologies Corporation | Method of making a microwave device having a polycrystalline ferrite substrate |
| US6171886B1 (en) * | 1998-06-30 | 2001-01-09 | Eastman Kodak Company | Method of making integrated hybrid silicon-based micro-actuator devices |
| US6249039B1 (en) * | 1998-09-10 | 2001-06-19 | Bourns, Inc. | Integrated inductive components and method of fabricating such components |
| US6498549B1 (en) | 1998-12-07 | 2002-12-24 | Corning Applied Technologies Corporation | Dual-tuning microwave devices using ferroelectric/ferrite layers |
| US6600601B1 (en) | 1999-04-12 | 2003-07-29 | Shin-Etsu Chemical Co., Ltd. | Polarization-independent optical isolator and production method thereof |
| US6645677B1 (en) | 2000-09-18 | 2003-11-11 | Micronic Laser Systems Ab | Dual layer reticle blank and manufacturing process |
| US6673181B1 (en) * | 2001-10-29 | 2004-01-06 | Northrop Grumman Corporation | Method of manufacturing ferromagnetic toroids used in ferrite phase shifters |
| JP2003264405A (ja) | 2002-03-08 | 2003-09-19 | Opnext Japan Inc | 高周波伝送線路およびそれを用いた電子部品並びに電子装置 |
| US6952042B2 (en) | 2002-06-17 | 2005-10-04 | Honeywell International, Inc. | Microelectromechanical device with integrated conductive shield |
| US7078983B2 (en) * | 2004-06-09 | 2006-07-18 | Raytheon Company | Low-profile circulator |
| JP2005244084A (ja) * | 2004-02-27 | 2005-09-08 | Mitsubishi Electric Corp | らせん状高周波コイルとその製造方法 |
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| US7480435B2 (en) * | 2005-12-30 | 2009-01-20 | Intel Corporation | Embedded waveguide printed circuit board structure |
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| JP5815353B2 (ja) * | 2011-09-28 | 2015-11-17 | 株式会社フジクラ | コイル配線素子およびコイル配線素子の製造方法 |
| US9293245B2 (en) * | 2013-08-05 | 2016-03-22 | Qualcomm Mems Technologies, Inc. | Integration of a coil and a discontinuous magnetic core |
| CN114376452B (zh) * | 2020-07-07 | 2023-06-27 | 追觅创新科技(苏州)有限公司 | 清洁机构的脏污程度确定方法、装置及存储介质 |
-
2014
- 2014-10-01 WO PCT/EP2014/071079 patent/WO2015052059A1/en active Application Filing
- 2014-10-01 CN CN201480066647.2A patent/CN105814655B/zh not_active Expired - Fee Related
- 2014-10-01 SG SG11201602499TA patent/SG11201602499TA/en unknown
- 2014-10-01 EP EP14780474.4A patent/EP3055871A1/en not_active Withdrawn
- 2014-10-01 JP JP2016517478A patent/JP6293875B2/ja not_active Expired - Fee Related
- 2014-10-01 US US15/027,286 patent/US9825347B2/en not_active Expired - Fee Related
- 2014-10-01 KR KR1020167011943A patent/KR20160067940A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN105814655B (zh) | 2018-08-07 |
| JP2016535930A (ja) | 2016-11-17 |
| KR20160067940A (ko) | 2016-06-14 |
| JP6293875B2 (ja) | 2018-04-25 |
| WO2015052059A1 (en) | 2015-04-16 |
| CN105814655A (zh) | 2016-07-27 |
| US9825347B2 (en) | 2017-11-21 |
| EP3055871A1 (en) | 2016-08-17 |
| US20160254579A1 (en) | 2016-09-01 |
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