SG11201510599VA - System and method for defect detection and photoluminescence measurement of a sample - Google Patents
System and method for defect detection and photoluminescence measurement of a sampleInfo
- Publication number
- SG11201510599VA SG11201510599VA SG11201510599VA SG11201510599VA SG11201510599VA SG 11201510599V A SG11201510599V A SG 11201510599VA SG 11201510599V A SG11201510599V A SG 11201510599VA SG 11201510599V A SG11201510599V A SG 11201510599VA SG 11201510599V A SG11201510599V A SG 11201510599VA
- Authority
- SG
- Singapore
- Prior art keywords
- sample
- defect detection
- photoluminescence measurement
- photoluminescence
- measurement
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N21/6489—Photoluminescence of semiconductors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N2021/6495—Miscellaneous methods
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8845—Multiple wavelengths of illumination or detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
- G01N2201/06113—Coherent sources; lasers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/066—Modifiable path; multiple paths in one sample
- G01N2201/0662—Comparing measurements on two or more paths in one sample
Landscapes
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361839494P | 2013-06-26 | 2013-06-26 | |
| US14/212,496 US9354177B2 (en) | 2013-06-26 | 2014-03-14 | System and method for defect detection and photoluminescence measurement of a sample |
| PCT/US2014/044149 WO2014210195A1 (en) | 2013-06-26 | 2014-06-25 | System and method for defect detection and photoluminescence measurement of a sample |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201510599VA true SG11201510599VA (en) | 2016-01-28 |
Family
ID=52114670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201510599VA SG11201510599VA (en) | 2013-06-26 | 2014-06-25 | System and method for defect detection and photoluminescence measurement of a sample |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9354177B2 (ko) |
| EP (1) | EP3014654A4 (ko) |
| JP (4) | JP6282733B2 (ko) |
| KR (4) | KR102356942B1 (ko) |
| CN (2) | CN109540853B (ko) |
| SG (1) | SG11201510599VA (ko) |
| TW (2) | TWI603073B (ko) |
| WO (1) | WO2014210195A1 (ko) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9442076B2 (en) | 2014-12-12 | 2016-09-13 | Bell Helicopter Textron Inc. | Infrared radiometric imaging inspection of steel parts |
| WO2016121628A1 (ja) * | 2015-01-28 | 2016-08-04 | 東レエンジニアリング株式会社 | ワイドギャップ半導体基板の欠陥検査方法及び欠陥検査装置 |
| JP6296001B2 (ja) * | 2015-05-20 | 2018-03-20 | 信越半導体株式会社 | シリコンエピタキシャルウェーハの製造方法及び評価方法 |
| US9911574B2 (en) * | 2015-08-14 | 2018-03-06 | The Trustees of Princeton University, Office of Technology and Trademark Licensing | Scanning probe lithography methods utilizing an enclosed sinusoidal pattern |
| JP6531579B2 (ja) * | 2015-09-10 | 2019-06-19 | 株式会社Sumco | ウェーハ検査方法およびウェーハ検査装置 |
| US10625111B2 (en) * | 2016-01-26 | 2020-04-21 | Beaverfit Limited | Training apparatus |
| CN105842233A (zh) * | 2016-05-10 | 2016-08-10 | 山东大学 | 一种采集双波长电致化学发光光强信息的检测系统 |
| TWI586957B (zh) * | 2016-06-24 | 2017-06-11 | 諾貝爾生物有限公司 | 多通道螢光檢測系統及其方法 |
| US10371626B2 (en) * | 2016-08-17 | 2019-08-06 | Kla-Tencor Corporation | System and method for generating multi-channel tunable illumination from a broadband source |
| CN108072613B (zh) * | 2016-11-11 | 2020-09-08 | 台湾积体电路制造股份有限公司 | 光学检测装置及其检测方法 |
| KR101838818B1 (ko) * | 2016-11-30 | 2018-03-14 | 세메스 주식회사 | 형광 현미경 및 이를 포함하는 기판 검사 장치 |
| TWI646323B (zh) * | 2016-12-01 | 2019-01-01 | 友達晶材股份有限公司 | 矽晶材檢測方法及其檢測裝置 |
| KR101810078B1 (ko) * | 2016-12-22 | 2017-12-18 | 주식회사 에타맥스 | 광루미네선스와 산란광을 동시에 검출하는 결함조사 장치 |
| US10234402B2 (en) * | 2017-01-05 | 2019-03-19 | Kla-Tencor Corporation | Systems and methods for defect material classification |
| US10551320B2 (en) * | 2017-01-30 | 2020-02-04 | Kla-Tencor Corporation | Activation of wafer particle defects for spectroscopic composition analysis |
| WO2018194210A1 (ko) * | 2017-04-20 | 2018-10-25 | 한국세라믹기술원 | 자외선 포토루미네선스를 이용한 결정의 폴리타입 분석방법 |
| KR102037984B1 (ko) * | 2017-11-23 | 2019-10-29 | 주식회사 나노정밀코리아 | 다기능 광학 검사장치 |
| US20190162885A1 (en) * | 2017-11-30 | 2019-05-30 | Qualcomm Incorporated | Optical bandpass filter design |
| CN112005334A (zh) * | 2018-04-02 | 2020-11-27 | Asml荷兰有限公司 | 大型活动区高速检测器的架构 |
| KR102067972B1 (ko) | 2018-09-21 | 2020-01-20 | 주식회사 에타맥스 | 광루미네선스와 산란광의 동시 검출이 가능한 발광다이오드 검사장비 |
| US11733173B1 (en) | 2019-02-28 | 2023-08-22 | Lumina Instruments Inc. | Time domain multiplexed defect scanner |
| CN110208272B (zh) * | 2019-06-18 | 2020-06-23 | 上海精测半导体技术有限公司 | 一种表面检测装置及方法 |
| ES2925885T3 (es) * | 2019-10-02 | 2022-10-20 | Adige Spa | Procedimiento de detección de la condición de funcionamiento de un elemento óptico dispuesto a lo largo de una trayectoria de propagación de un haz de láser de una máquina para procesar un material; máquina de procesamiento por láser provista de un sistema que lleva a cabo dicho procedimiento |
| EP4100720A4 (en) * | 2020-02-07 | 2023-07-26 | Becton, Dickinson and Company | CLUSTERED WAVELENGTH DISTRIBUTION LIGHT DETECTION SYSTEMS AND METHODS OF USE THEREOF |
| CN111426446A (zh) * | 2020-04-23 | 2020-07-17 | 空气动力学国家重点实验室 | 一种多通道聚焦激光差分干涉仪 |
| TWI758923B (zh) | 2020-10-27 | 2022-03-21 | 財團法人工業技術研究院 | 雷射檢測系統 |
| JP2023010461A (ja) | 2021-07-09 | 2023-01-20 | 株式会社デンソー | ユーザ装置、基地局及び通信制御方法 |
| US20230075747A1 (en) * | 2021-09-09 | 2023-03-09 | Onto Innovation Inc. | High resolution multispectral multi-field-of-view imaging system for wafer inspection |
| KR102564487B1 (ko) * | 2021-10-08 | 2023-08-07 | 주식회사 에타맥스 | 단일 입사광 기반 광루미네선스를 이용한 실리콘카바이드 기판의 결함분류 장비 및 그를 이용한 결함분류 방법 |
| KR102602029B1 (ko) * | 2021-11-11 | 2023-11-14 | 주식회사 에타맥스 | 광루미네선스 검사와 자동광학검사를 동시에 수행하는 마이크로 led 검사장비 |
| KR102640751B1 (ko) * | 2021-11-24 | 2024-02-27 | 주식회사 에스에스솔루션 | 다이크로익 필터를 이용한 유해물질 혼합가스의 검출 장치 |
| CN117012663B (zh) * | 2023-08-24 | 2024-06-11 | 上海优睿谱半导体设备有限公司 | 晶圆缺陷检测系统及方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6201601B1 (en) | 1997-09-19 | 2001-03-13 | Kla-Tencor Corporation | Sample inspection system |
| US6534774B2 (en) * | 2000-09-08 | 2003-03-18 | Mitsubishi Materials Silicon Corporation | Method and apparatus for evaluating the quality of a semiconductor substrate |
| US6791099B2 (en) | 2001-02-14 | 2004-09-14 | Applied Materials, Inc. | Laser scanning wafer inspection using nonlinear optical phenomena |
| GB0107618D0 (en) | 2001-03-27 | 2001-05-16 | Aoti Operating Co Inc | Detection and classification of micro-defects in semi-conductors |
| JP2003028797A (ja) * | 2001-07-11 | 2003-01-29 | Hitachi Software Eng Co Ltd | 蛍光読み取り装置 |
| GB0216815D0 (en) * | 2002-07-19 | 2002-08-28 | Aoti Operating Co Inc | Detection method and apparatus |
| US7352456B2 (en) * | 2003-04-08 | 2008-04-01 | Kla-Tencor Technologies Corp. | Method and apparatus for inspecting a substrate using a plurality of inspection wavelength regimes |
| US7304310B1 (en) * | 2003-11-21 | 2007-12-04 | Kla-Tencor Technologies Corp. | Methods and systems for inspecting a specimen using light scattered in different wavelength ranges |
| TWI236773B (en) * | 2004-06-21 | 2005-07-21 | Nat Univ Chung Hsing | High-efficiency light-emitting device |
| JP3917154B2 (ja) | 2004-11-19 | 2007-05-23 | 独立行政法人 宇宙航空研究開発機構 | 半導体試料の欠陥評価方法及び装置 |
| JP4633549B2 (ja) * | 2005-06-15 | 2011-02-16 | 財団法人電力中央研究所 | フォトルミネッセンスマッピング測定装置 |
| TWI439684B (zh) * | 2005-07-06 | 2014-06-01 | Nanometrics Inc | 具自晶圓或其他工件特定材料層所發射光致發光信號優先偵測之光致發光成像 |
| US7664608B2 (en) * | 2006-07-14 | 2010-02-16 | Hitachi High-Technologies Corporation | Defect inspection method and apparatus |
| US7362426B1 (en) * | 2006-10-06 | 2008-04-22 | Wafermasters, Inc. | Raman and photoluminescence spectroscopy |
| JP4827099B2 (ja) * | 2007-01-19 | 2011-11-30 | トヨタ自動車株式会社 | 粉末蛍光体及びその製造方法、並びに粉末蛍光体を有する発光装置、表示装置及び蛍光ランプ |
| JP2010109156A (ja) | 2008-10-30 | 2010-05-13 | Oki Electric Ind Co Ltd | 半導体装置の検査方法及び検査装置 |
| US7907269B2 (en) | 2009-07-23 | 2011-03-15 | Kla-Tencor Corporation | Scattered light separation |
| US9163987B2 (en) * | 2010-08-24 | 2015-10-20 | Kla-Tencor Corporation | Defect inspection and photoluminescence measurement system |
| WO2012082501A2 (en) * | 2010-12-16 | 2012-06-21 | Kla-Tencor Corporation | Wafer inspection |
| JP5682858B2 (ja) | 2011-05-20 | 2015-03-11 | 株式会社Sumco | シリコンウェーハの評価方法および製造方法 |
| US20120326054A1 (en) * | 2011-06-22 | 2012-12-27 | Mark Anthony Meloni | In Situ Photoluminescence Characterization System and Method |
| US9279774B2 (en) | 2011-07-12 | 2016-03-08 | Kla-Tencor Corp. | Wafer inspection |
-
2014
- 2014-03-14 US US14/212,496 patent/US9354177B2/en active Active
- 2014-04-09 TW TW103113077A patent/TWI603073B/zh active
- 2014-04-09 TW TW106130946A patent/TWI664418B/zh active
- 2014-06-25 SG SG11201510599VA patent/SG11201510599VA/en unknown
- 2014-06-25 KR KR1020217027588A patent/KR102356942B1/ko active IP Right Grant
- 2014-06-25 KR KR1020167002039A patent/KR20160024968A/ko not_active IP Right Cessation
- 2014-06-25 CN CN201811188708.9A patent/CN109540853B/zh active Active
- 2014-06-25 KR KR1020207021775A patent/KR102297502B1/ko active IP Right Grant
- 2014-06-25 JP JP2016523896A patent/JP6282733B2/ja active Active
- 2014-06-25 EP EP14818432.8A patent/EP3014654A4/en not_active Withdrawn
- 2014-06-25 KR KR1020217027586A patent/KR102356943B1/ko active IP Right Grant
- 2014-06-25 CN CN201480046386.8A patent/CN105493258B/zh active Active
- 2014-06-25 WO PCT/US2014/044149 patent/WO2014210195A1/en active Application Filing
-
2016
- 2016-05-27 US US15/167,721 patent/US9772289B2/en active Active
-
2018
- 2018-01-24 JP JP2018009623A patent/JP2018105871A/ja active Pending
-
2020
- 2020-02-07 JP JP2020019461A patent/JP6870129B2/ja active Active
-
2021
- 2021-04-14 JP JP2021068274A patent/JP7160496B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160024968A (ko) | 2016-03-07 |
| US20160377548A1 (en) | 2016-12-29 |
| KR102356943B1 (ko) | 2022-02-08 |
| CN105493258A (zh) | 2016-04-13 |
| KR102356942B1 (ko) | 2022-02-08 |
| US20150001421A1 (en) | 2015-01-01 |
| JP2022186764A (ja) | 2022-12-15 |
| JP2016525214A (ja) | 2016-08-22 |
| US9354177B2 (en) | 2016-05-31 |
| JP2018105871A (ja) | 2018-07-05 |
| JP7160496B2 (ja) | 2022-10-25 |
| KR20200093690A (ko) | 2020-08-05 |
| TW201743049A (zh) | 2017-12-16 |
| EP3014654A1 (en) | 2016-05-04 |
| TWI603073B (zh) | 2017-10-21 |
| JP6870129B2 (ja) | 2021-05-12 |
| KR20210109061A (ko) | 2021-09-03 |
| JP6282733B2 (ja) | 2018-02-21 |
| JP2021114619A (ja) | 2021-08-05 |
| EP3014654A4 (en) | 2017-03-01 |
| US9772289B2 (en) | 2017-09-26 |
| KR20210109062A (ko) | 2021-09-03 |
| WO2014210195A1 (en) | 2014-12-31 |
| CN105493258B (zh) | 2018-11-09 |
| CN109540853B (zh) | 2021-04-09 |
| TWI664418B (zh) | 2019-07-01 |
| TW201510510A (zh) | 2015-03-16 |
| JP2020073935A (ja) | 2020-05-14 |
| KR102297502B1 (ko) | 2021-09-03 |
| CN109540853A (zh) | 2019-03-29 |
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