SG11201509591VA - Silver coating material and method for manufacturing same - Google Patents

Silver coating material and method for manufacturing same

Info

Publication number
SG11201509591VA
SG11201509591VA SG11201509591VA SG11201509591VA SG11201509591VA SG 11201509591V A SG11201509591V A SG 11201509591VA SG 11201509591V A SG11201509591V A SG 11201509591VA SG 11201509591V A SG11201509591V A SG 11201509591VA SG 11201509591V A SG11201509591V A SG 11201509591VA
Authority
SG
Singapore
Prior art keywords
coating material
silver coating
manufacturing same
silver
manufacturing
Prior art date
Application number
SG11201509591VA
Other languages
English (en)
Inventor
Akihiro Aiba
Hirofumi Takahashi
Takashi Ouchi
Satoru Endo
Ryu Murakami
Satoshi Miyazawa
Masahiko Odashima
Hiroyuki Tokuda
Original Assignee
Jx Nippon Mining & Metals Corp
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp, Alps Electric Co Ltd filed Critical Jx Nippon Mining & Metals Corp
Publication of SG11201509591VA publication Critical patent/SG11201509591VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/025—Composite material having copper as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H01H2011/046—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion by plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Contacts (AREA)
  • Manufacture Of Switches (AREA)
SG11201509591VA 2013-11-11 2014-11-10 Silver coating material and method for manufacturing same SG11201509591VA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013233244 2013-11-11
JP2013264021 2013-12-20
PCT/JP2014/079705 WO2015068835A1 (ja) 2013-11-11 2014-11-10 銀被覆材及びその製造方法

Publications (1)

Publication Number Publication Date
SG11201509591VA true SG11201509591VA (en) 2015-12-30

Family

ID=53041608

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201509591VA SG11201509591VA (en) 2013-11-11 2014-11-10 Silver coating material and method for manufacturing same

Country Status (8)

Country Link
EP (1) EP3070726B1 (ko)
JP (1) JP6162817B2 (ko)
KR (1) KR101751167B1 (ko)
CN (1) CN105247642B (ko)
MY (1) MY178336A (ko)
SG (1) SG11201509591VA (ko)
TW (1) TWI651744B (ko)
WO (1) WO2015068835A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6579425B2 (ja) * 2015-06-16 2019-09-25 富士電機機器制御株式会社 基板用スイッチ
JP7359046B2 (ja) * 2020-03-11 2023-10-11 株式会社オートネットワーク技術研究所 金属材、接続端子、および金属材の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2915623B2 (ja) * 1991-06-25 1999-07-05 古河電気工業株式会社 電気接点材料とその製造方法
JP3874621B2 (ja) * 2001-03-30 2007-01-31 株式会社神戸製鋼所 嵌合型接続端子用Ｓｎめっき銅合金材料及び嵌合型接続端子
JP3772240B2 (ja) * 2003-06-11 2006-05-10 東洋精箔株式会社 押しボタンスイッチに用いる電気接点用ばね材およびその製造方法
JP4728571B2 (ja) * 2003-10-31 2011-07-20 古河電気工業株式会社 可動接点用銀被覆ステンレス条の製造方法
JP4367457B2 (ja) * 2006-07-06 2009-11-18 パナソニック電工株式会社 銀膜、銀膜の製造方法、ｌｅｄ実装用基板、及びｌｅｄ実装用基板の製造方法
CN102667989B (zh) * 2010-02-12 2016-05-04 古河电气工业株式会社 可动接点部件用银包覆复合材料、其制造方法以及可动接点部件
JP2012049041A (ja) 2010-08-27 2012-03-08 Furukawa Electric Co Ltd:The 可動接点部品用銀被覆材およびその製造方法

Also Published As

Publication number Publication date
TWI651744B (zh) 2019-02-21
WO2015068835A1 (ja) 2015-05-14
JP6162817B2 (ja) 2017-07-19
MY178336A (en) 2020-10-08
EP3070726A1 (en) 2016-09-21
EP3070726A4 (en) 2017-08-02
JPWO2015068835A1 (ja) 2017-03-09
TW201523668A (zh) 2015-06-16
KR20160007650A (ko) 2016-01-20
KR101751167B1 (ko) 2017-06-27
CN105247642B (zh) 2017-08-18
EP3070726B1 (en) 2019-05-15
CN105247642A (zh) 2016-01-13

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