SG11201504456YA - Fabrication of optical elements and modules incorporating the same - Google Patents

Fabrication of optical elements and modules incorporating the same

Info

Publication number
SG11201504456YA
SG11201504456YA SG11201504456YA SG11201504456YA SG11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA SG 11201504456Y A SG11201504456Y A SG 11201504456YA
Authority
SG
Singapore
Prior art keywords
fabrication
same
optical elements
modules incorporating
incorporating
Prior art date
Application number
SG11201504456YA
Other languages
English (en)
Inventor
Simon Gubser
Hakan Karpuz
Original Assignee
Heptagon Micro Optics Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Micro Optics Pte Ltd filed Critical Heptagon Micro Optics Pte Ltd
Publication of SG11201504456YA publication Critical patent/SG11201504456YA/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/005—Diaphragms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1847—Manufacturing methods
    • G02B5/1852—Manufacturing methods using mechanical means, e.g. ruling with diamond tool, moulding

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Ophthalmology & Optometry (AREA)
  • Health & Medical Sciences (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lens Barrels (AREA)
  • General Engineering & Computer Science (AREA)
SG11201504456YA 2012-12-27 2013-12-10 Fabrication of optical elements and modules incorporating the same SG11201504456YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261746347P 2012-12-27 2012-12-27
PCT/SG2013/000525 WO2014104972A1 (en) 2012-12-27 2013-12-10 Fabrication of optical elements and modules incorporating the same

Publications (1)

Publication Number Publication Date
SG11201504456YA true SG11201504456YA (en) 2015-07-30

Family

ID=51016160

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201504456YA SG11201504456YA (en) 2012-12-27 2013-12-10 Fabrication of optical elements and modules incorporating the same

Country Status (8)

Country Link
US (2) US9478681B2 (zh)
EP (1) EP2939053B1 (zh)
JP (1) JP6253666B2 (zh)
KR (1) KR102135492B1 (zh)
CN (1) CN104937445B (zh)
SG (1) SG11201504456YA (zh)
TW (2) TWI655783B (zh)
WO (1) WO2014104972A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9094593B2 (en) 2013-07-30 2015-07-28 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
US9543354B2 (en) 2013-07-30 2017-01-10 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
JP6964071B2 (ja) 2015-08-27 2021-11-10 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドHeptagon Micro Optics Pte. Ltd. ウエハ積層体、および、光学アセンブリを製造するためのウエハレベルの方法
US10551596B2 (en) 2016-06-29 2020-02-04 Ams Sensors Singapore Pte. Ltd. Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same
TWI762532B (zh) * 2016-12-01 2022-05-01 新加坡商海特根微光學公司 光電模組和光電成形模具及用於製造該光電模組及該光電成形模具的製程
DE112019006131T5 (de) 2018-12-10 2021-08-26 Ams Sensors Singapore Pte. Ltd. Vakuum-spritzgiessen für optoelektronische module

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US5655189A (en) * 1994-05-27 1997-08-05 Kyocera Corporation Image device having thermally stable light emitting/receiving arrays and opposing lenses
EP1443344A1 (en) 2003-01-29 2004-08-04 Heptagon Oy Manufacturing micro-structured elements
CN1950724A (zh) * 2004-05-12 2007-04-18 松下电器产业株式会社 光学元件及其制造方法
KR100636349B1 (ko) * 2004-09-24 2006-10-19 엘지전자 주식회사 마이크로렌즈 배열 시트 및 그 제작방법
DE102006010729A1 (de) * 2005-12-09 2007-06-14 Osram Opto Semiconductors Gmbh Optisches Element, Herstellungsverfahren hierfür und Verbund-Bauteil mit einem optischen Element
US20110031510A1 (en) * 2007-11-27 2011-02-10 Heptagon Oy Encapsulated lens stack
EP2223173B1 (en) * 2007-12-19 2013-09-04 Heptagon Micro Optics Pte. Ltd. Camera device and manufacturing methods therefor
TWI505703B (zh) * 2007-12-19 2015-10-21 Heptagon Micro Optics Pte Ltd 光學模組，晶圓等級的封裝及其製造方法
TW200937642A (en) * 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
EP2273289B1 (en) * 2008-04-28 2015-01-21 Konica Minolta Opto, Inc. Method for producing wafer lens assembly
WO2010050290A1 (ja) * 2008-10-31 2010-05-06 コニカミノルタオプト株式会社 ウエハレンズの製造方法及びウエハレンズ
JP5352392B2 (ja) * 2009-09-14 2013-11-27 富士フイルム株式会社 ウェハレベルレンズアレイの製造方法、ウェハレベルレンズアレイ、レンズモジュール及び撮像ユニット
JP2011062879A (ja) * 2009-09-16 2011-03-31 Fujifilm Corp ウェハレベルレンズアレイの成形方法、ウェハレベルレンズアレイ、レンズモジュール及び撮像ユニット
JP5401227B2 (ja) 2009-09-16 2014-01-29 富士フイルム株式会社 ウェハレベルレンズアレイの製造方法、ウェハレベルレンズアレイ、レンズモジュール及び撮像ユニット
CN102668082B (zh) * 2009-10-20 2015-09-30 Flir系统贸易比利时有限公司 用于光学元件的聚焦补偿及其应用
JP2011128355A (ja) * 2009-12-17 2011-06-30 Sony Corp 撮像レンズ及び撮像レンズを用いたカメラモジュール並びに撮像レンズの製造方法及びカメラモジュールの製造方法
WO2011091529A1 (en) 2010-02-01 2011-08-04 Dbm Reflex Enterprises Inc. Thick lens molded with embedded layers of the same resin using a two step injection molding process.
US20140002902A1 (en) * 2011-01-25 2014-01-02 Heptagon Micro Optics Pte. Ltd. Manufacturing a Plurality of Optical Elements
CN103392141B (zh) * 2011-03-01 2014-09-17 富士胶片株式会社 透镜模块的制造方法及透镜模块
TW201241482A (en) * 2011-04-08 2012-10-16 E Pin Optical Industry Co Ltd Optical lens with insert soma and optical lens module thereof
TWI480615B (zh) * 2011-06-30 2015-04-11 Lg Innotek Co Ltd 鏡頭單元及其製造方法與具有其之攝影模組
US8848286B2 (en) * 2012-04-11 2014-09-30 Omni Version Technology, Inc. Lens plate for wafer-level camera and method of manufacturing same
US9634051B2 (en) * 2012-07-17 2017-04-25 Heptagon Micro Optics Pte. Ltd. Optical devices, in particular computational cameras, and methods for manufacturing the same

Also Published As

Publication number Publication date
JP6253666B2 (ja) 2017-12-27
US20140183585A1 (en) 2014-07-03
US20170010450A1 (en) 2017-01-12
TWI622177B (zh) 2018-04-21
CN104937445B (zh) 2017-10-24
KR20150103090A (ko) 2015-09-09
KR102135492B1 (ko) 2020-07-20
EP2939053A4 (en) 2016-08-31
JP2016506326A (ja) 2016-03-03
US10126530B2 (en) 2018-11-13
EP2939053A1 (en) 2015-11-04
TWI655783B (zh) 2019-04-01
TW201432918A (zh) 2014-08-16
TW201820643A (zh) 2018-06-01
WO2014104972A1 (en) 2014-07-03
CN104937445A (zh) 2015-09-23
EP2939053B1 (en) 2019-03-20
US9478681B2 (en) 2016-10-25

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