JP6964071B2 - ウエハ積層体、および、光学アセンブリを製造するためのウエハレベルの方法 - Google Patents
ウエハ積層体、および、光学アセンブリを製造するためのウエハレベルの方法 Download PDFInfo
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- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1701—Component parts, details or accessories; Auxiliary operations using a particular environment during moulding, e.g. moisture-free or dust-free
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
- G02B6/325—Optical coupling means having lens focusing means positioned between opposed fibre ends comprising a transparent member, e.g. window, protective plate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29L2011/00—Optical elements, e.g. lenses, prisms
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
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Description
この開示は、基板に直接付着するスペーサを含む光学アセンブリ、およびそのような光学アセンブリの製造技術に関する。
撮像装置などの小さな光電子モジュールは、所望の性能を達成するために装置の光学軸に沿って積層されるレンズを含む光学アセンブリを用いることがある。いくつかの例では、製造加工の一部として、積層体を形成するウエハが互いに位置合わせされ接合される。ウエハは、たとえば膠または他の接着剤によって互いに取り付けられ得る。しかしながら、膠は、光学性能に悪影響を及ぼし得る領域に移動することがある。
この開示は、基板に直接付着するスペーサを含む光学アセンブリ、およびそのような光学アセンブリの製造技術について説明する。光学アセンブリは、たとえば、多くのアセンブリが同時に並行して製造されるウエハレベルの加工を用いて製造されてもよい。当該加工は、光学ウエハを含むウエハ積層体を提供することと、光学ウエハの表面上へ直接スペーサを成型することとを含んでいてもよい。スペーサは、たとえば、それらが接着剤を用いることなく光学ウエハに付着されるように真空注型技術を用いて成型されてもよい。
図1は、第1のスペーサ24によって互いに取り付けられて積層体を形成する、第1および第2の透明基板22A,22Bを含む光学アセンブリ20の実施例を示す図である。基板22A,22Bは、たとえば、ガラスまたはポリマーであってもよい。特定の波長または波長範囲のみの光(たとえば、赤外線または紫外線)がアセンブリ20を通過することを可能にするために、基板22A,22Bの一方または双方がそれらの表面上に1つ以上の光学フィルタを含む場合もある。
Claims (8)
- 光学アセンブリを製造するためのウエハレベルの方法であって、
第1の光学ウエハ、第2の光学ウエハ、および、前記第1の光学ウエハと前記第2の光学ウエハとの間に積層されたスペーサウエハを含むウエハ積層体を提供することを含み、 次に、スペーサを、接着剤を用いることなく前記第1の光学ウエハの主表面に付着させるように、前記第1の光学ウエハの前記主表面上へ、真空注型によって直接成型することを含み、
前記真空注型は、真空注型工具によって規定される空間の中へエポキシを注入することを含み、
前記真空注型の間に、前記エポキシの一部は、前記ウエハ積層体の、前記第1の光学ウエハ、前記第2の光学ウエハおよび前記スペーサウエハのそれぞれの周囲に沿って配置され、前記エポキシの他の一部は、前記第1の光学ウエハの前記主表面上にその周辺に沿って配置され、前記エポキシのさらに他の一部は、前記第2の光学ウエハの、前記第1の光学ウエハに面する側の主表面とは反対側の主表面に沿って配置される、方法。 - 前記真空注型によって形成される前記スペーサは、前記スペーサウエハのスペーサ領域と位置合わせされる、請求項1に記載の方法。
- 前記第1および第2の光学ウエハは、ガラス、ポリマーからなる群から選択される材料から構成される、請求項1または2に記載の方法。
- 前記第1および第2の光学ウエハは、その表面の少なくとも1つの上に受動光学素子を含む、請求項3に記載の方法。
- 前記エポキシを硬化することと、
前記ウエハ積層体を複数の光学アセンブリに分割することとを含む、請求項1に記載の方法。 - ウエハ積層体であって、
開口部を有する第1のスペーサによって互いに分離される第1の基板と第2の基板とを備え、前記第1および第2の基板は、特定の波長または波長範囲に対して透過性があり、前記第1および第2の基板は積層体を構成し、
前記光学アセンブリはさらに、
前記第1および第2の基板の少なくとも一方の上のビーム成形素子と、
前記第2の基板の、前記第1のスペーサに面する主表面とは反対側の主表面に直接取り付けられる第2のスペーサとを備え、前記第2のスペーサは接着剤を用いることなく前記第2の基板の前記主表面に付着し、
前記第2のスペーサはエポキシを含み、
前記ウエハ積層体の、前記第1の基板、前記第2の基板および前記第1のスペーサのそれぞれの周囲に沿って、また、前記第2の基板の前記主表面上にその周辺に沿って、さらに、前記第1の基板の、前記第2の基板に面する側の主表面とは反対側の主表面に沿って、エポキシが配置され、
前記第1の基板および前記第2の基板の外側の横寸法と前記第1のスペーサおよび前記第2のスペーサの外側の横寸法とは、互いに同一である、ウエハ積層体。 - 前記第1の基板および前記第2の基板は、ガラス、ポリマーからなる群から選択される材料から構成される、請求項6に記載のウエハ積層体。
- 前記第1の基板および前記第2の基板の各々の上にそれぞれビーム成形素子を含む、請求項6に記載のウエハ積層体。
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Application Number | Priority Date | Filing Date | Title |
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US201562210569P | 2015-08-27 | 2015-08-27 | |
US62/210,569 | 2015-08-27 | ||
PCT/SG2016/050411 WO2017034483A1 (en) | 2015-08-27 | 2016-08-25 | Optical assemblies including a spacer adhering directly to a substrate |
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JP6964071B2 true JP6964071B2 (ja) | 2021-11-10 |
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US (1) | US10663698B2 (ja) |
EP (1) | EP3341974B1 (ja) |
JP (1) | JP6964071B2 (ja) |
KR (1) | KR102589817B1 (ja) |
CN (1) | CN108076671B (ja) |
TW (1) | TWI725048B (ja) |
WO (1) | WO2017034483A1 (ja) |
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US10551596B2 (en) | 2016-06-29 | 2020-02-04 | Ams Sensors Singapore Pte. Ltd. | Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same |
US20210041650A1 (en) * | 2018-03-07 | 2021-02-11 | Ams Sensors Singapore Pte. Ltd. | Optoelectronic modules and wafer-level methods for manufacturing the same |
WO2020122813A1 (en) | 2018-12-10 | 2020-06-18 | Ams Sensors Singapore Pte. Ltd. | Vacuum injection molding for optoelectronic modules |
GB202102011D0 (en) * | 2021-02-12 | 2021-03-31 | Ams Sensors Singapore Pte Ltd | Optoelectronic module |
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JP4768060B2 (ja) * | 2008-09-25 | 2011-09-07 | シャープ株式会社 | 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器 |
JP4764942B2 (ja) * | 2008-09-25 | 2011-09-07 | シャープ株式会社 | 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器 |
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WO2015053706A1 (en) * | 2013-10-08 | 2015-04-16 | Heptagon Micro Optics Pte. Ltd. | Partial spacers for wafer-level fabricated modules |
WO2015119571A1 (en) | 2014-02-07 | 2015-08-13 | Heptagon Micro Optics Pte. Ltd. | Stacks of arrays of beam shaping elements including stacking, self-alignment and/or self-centering features |
WO2015191001A1 (en) | 2014-06-10 | 2015-12-17 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules including hybrid arrangements of beam shaping elements, and imaging devices incorporating the same |
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- 2016-08-25 KR KR1020187008199A patent/KR102589817B1/ko active IP Right Grant
- 2016-08-25 US US15/755,221 patent/US10663698B2/en active Active
- 2016-08-25 JP JP2018510712A patent/JP6964071B2/ja active Active
- 2016-08-25 EP EP16839719.8A patent/EP3341974B1/en active Active
- 2016-08-25 CN CN201680055045.6A patent/CN108076671B/zh active Active
- 2016-08-25 WO PCT/SG2016/050411 patent/WO2017034483A1/en active Application Filing
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JP2018528468A (ja) | 2018-09-27 |
CN108076671B (zh) | 2022-04-22 |
KR102589817B1 (ko) | 2023-10-13 |
EP3341974A1 (en) | 2018-07-04 |
TWI725048B (zh) | 2021-04-21 |
TW201721207A (zh) | 2017-06-16 |
US10663698B2 (en) | 2020-05-26 |
EP3341974A4 (en) | 2019-03-06 |
CN108076671A (zh) | 2018-05-25 |
KR20180044949A (ko) | 2018-05-03 |
WO2017034483A1 (en) | 2017-03-02 |
US20180239116A1 (en) | 2018-08-23 |
EP3341974B1 (en) | 2020-07-08 |
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