JP2018528468A - 基板に直接付着するスペーサを含む光学アセンブリ - Google Patents
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Abstract
Description
この開示は、基板に直接付着するスペーサを含む光学アセンブリ、およびそのような光学アセンブリの製造技術に関する。
撮像装置などの小さな光電子モジュールは、所望の性能を達成するために装置の光学軸に沿って積層されるレンズを含む光学アセンブリを用いることがある。いくつかの例では、製造加工の一部として、積層体を形成するウエハが互いに位置合わせされ接合される。ウエハは、たとえば膠または他の接着剤によって互いに取り付けられ得る。しかしながら、膠は、光学性能に悪影響を及ぼし得る領域に移動することがある。
この開示は、基板に直接付着するスペーサを含む光学アセンブリ、およびそのような光学アセンブリの製造技術について説明する。光学アセンブリは、たとえば、多くのアセンブリが同時に並行して製造されるウエハレベルの加工を用いて製造されてもよい。当該加工は、光学ウエハを含むウエハ積層体を提供することと、光学ウエハの表面上へ直接スペーサを成型することとを含んでいてもよい。スペーサは、たとえば、それらが接着剤を用いることなく光学ウエハに付着されるように真空注型技術を用いて成型されてもよい。
図1は、第1のスペーサ24によって互いに取り付けられて積層体を形成する、第1および第2の透明基板22A,22Bを含む光学アセンブリ20の実施例を示す図である。基板22A,22Bは、たとえば、ガラスまたはポリマーであってもよい。特定の波長または波長範囲のみの光(たとえば、赤外線または紫外線)がアセンブリ20を通過することを可能にするために、基板22A,22Bの一方または双方がそれらの表面上に1つ以上の光学フィルタを含む場合もある。
Claims (17)
- 光学アセンブリを製造するためのウエハレベルの方法であって、
互いに積層された複数のウエハを含むウエハ積層体を提供することを含み、前記複数のウエハは光学ウエハを含み、前記方法は、
次に、スペーサを前記光学ウエハの表面上へ直接成型することを含み、前記スペーサは接着剤を用いることなく前記光学ウエハの前記表面に付着する、方法。 - 真空注型によって前記スペーサを形成することを含む、請求項1に記載の方法。
- 前記真空注型は、真空注型工具によって規定される空間の中へエポキシを注入することを含む、請求項2に記載の方法。
- 前記真空注型の間に、前記エポキシの一部は、前記ウエハ積層体のそれぞれのウエハの周囲に沿って配置される、請求項3に記載の方法。
- 前記真空注型の間に、前記エポキシの一部は、前記光学ウエハの前記表面に沿ってその外周に配置される、請求項4に記載の方法。
- 前記真空注型の間に、前記エポキシの一部は、前記ウエハ積層体の表面に沿って前記光学ウエハの表面と反対側の前記ウエハ積層体の端部に配置される、請求項4に記載の方法。
- 前記真空注型の間に、前記エポキシの一部は、前記光学ウエハ前記表面に沿ってその外周に配置され、前記エポキシの一部は、前記ウエハ積層体の表面に沿って前記光学ウエハの表面の反対側の前記ウエハ積層体の端部に配置される、請求項4に記載の方法。
- 前記ウエハ積層体は、スペーサウエハを含み、前記真空注型によって形成される前記スペーサは、前記スペーサウエハのスペーサ領域と位置合わせされる、請求項1〜7のいずれか1項に記載の方法。
- 前記光学ウエハは、ガラス、ポリマーからなる群から選択される材料から構成される、請求項1〜8のいずれか1項に記載の方法。
- 前記光学ウエハは、その表面の少なくとも1つの上に受動光学素子を含む、請求項9に記載の方法。
- 前記エポキシを硬化することと、
前記ウエハ積層体を複数の光学アセンブリに分割することとを含む、請求項3〜7のいずれか1項に記載の方法。 - 光学アセンブリであって、
開口部を有する第1のスペーサによって互いに分離される第1の基板と第2の基板とを備え、前記基板は、特定の波長または波長範囲に対して透過性があり、前記光学アセンブリは、
前記基板の少なくとも一方の上のビーム成形素子と、
前記第2の基板の表面に直接取り付けられる第2のスペーサとを備え、前記第1のスペーサおよび前記第2のスペーサは前記第2の基板の反対側に存在し、前記第2のスペーサは接着剤を用いることなく前記第2の基板の前記表面に付着し、
前記第1の基板および前記第2の基板の外側の横寸法と前記第1のスペーサおよび前記第2のスペーサの外側の横寸法とは、互いに同一である、光学アセンブリ。 - 前記第2のスペーサは、前記第2の基板の前記表面上に成型される、請求項12に記載の光学アセンブリ。
- 前記第2のスペーサは、エポキシ材料を含む、請求項12に記載の光学アセンブリ。
- 前記第2のスペーサは、真空注入されたエポキシを含む、請求項12に記載の光学アセンブリ。
- 前記第1の基板および前記第2の基板は、ガラス、ポリマーからなる群から選択される材料から構成される、請求項12〜15のいずれか1項に記載の光学アセンブリ。
- 前記第1の基板および前記第2の基板の各々の上にそれぞれビーム成形素子を含む、請求項12〜16のいずれか1項に記載の光学アセンブリ。
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US201562210569P | 2015-08-27 | 2015-08-27 | |
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PCT/SG2016/050411 WO2017034483A1 (en) | 2015-08-27 | 2016-08-25 | Optical assemblies including a spacer adhering directly to a substrate |
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US10551596B2 (en) | 2016-06-29 | 2020-02-04 | Ams Sensors Singapore Pte. Ltd. | Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same |
WO2019172841A1 (en) * | 2018-03-07 | 2019-09-12 | Ams Sensors Singapore Pte. Ltd. | Optoelectronic modules and wafer-level methods for manufacturing the same |
US11996505B2 (en) | 2018-12-10 | 2024-05-28 | Ams Sensors Singapore Pte. Ltd. | Vacuum injection molding for optoelectronic modules |
GB202102011D0 (en) * | 2021-02-12 | 2021-03-31 | Ams Sensors Singapore Pte Ltd | Optoelectronic module |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000131508A (ja) * | 1998-10-26 | 2000-05-12 | Sony Corp | 対物レンズ及びその製造方法 |
CN103376527A (zh) * | 2012-04-11 | 2013-10-30 | 全视技术有限公司 | 用于晶片级照相机的透镜板及其制造方法 |
WO2014012603A1 (en) * | 2012-07-17 | 2014-01-23 | Heptagon Micro Optics Pte. Ltd. | Optical devices, in particular computational cameras, and methods for manufacturing the same |
WO2015053706A1 (en) * | 2013-10-08 | 2015-04-16 | Heptagon Micro Optics Pte. Ltd. | Partial spacers for wafer-level fabricated modules |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US193026A (en) * | 1877-07-10 | Improvement in machines for punching and shearing metal | ||
US6590157B2 (en) * | 2001-09-21 | 2003-07-08 | Eastman Kodak Company | Sealing structure for highly moisture-sensitive electronic device element and method for fabrication |
JP2009054979A (ja) * | 2007-07-27 | 2009-03-12 | Nec Electronics Corp | 電子装置および電子装置の製造方法 |
KR20090108233A (ko) * | 2008-04-11 | 2009-10-15 | 삼성전자주식회사 | 카메라 모듈의 제조 방법, 이에 의해 제작된 카메라 모듈및 상기 카메라 모듈을 포함하는 전자 시스템 |
JP4768060B2 (ja) * | 2008-09-25 | 2011-09-07 | シャープ株式会社 | 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器 |
JP4764942B2 (ja) * | 2008-09-25 | 2011-09-07 | シャープ株式会社 | 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器 |
US9075182B2 (en) * | 2011-06-03 | 2015-07-07 | VisEra Technology Company Limited | Camera module and spacer of a lens structure in the camera module |
US9063005B2 (en) | 2012-04-05 | 2015-06-23 | Heptagon Micro Optics Pte. Ltd. | Reflowable opto-electronic module |
SG11201407221TA (en) * | 2012-05-17 | 2014-12-30 | Heptagon Micro Optics Pte Ltd | Assembly of wafer stacks |
US9595553B2 (en) * | 2012-11-02 | 2017-03-14 | Heptagon Micro Optics Pte. Ltd. | Optical modules including focal length adjustment and fabrication of the optical modules |
WO2014104972A1 (en) | 2012-12-27 | 2014-07-03 | Heptagon Micro Optics Pte. Ltd. | Fabrication of optical elements and modules incorporating the same |
US9094593B2 (en) * | 2013-07-30 | 2015-07-28 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules |
US9746349B2 (en) | 2013-09-02 | 2017-08-29 | Heptagon Micro Optics Pte. Ltd. | Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element |
WO2015119571A1 (en) | 2014-02-07 | 2015-08-13 | Heptagon Micro Optics Pte. Ltd. | Stacks of arrays of beam shaping elements including stacking, self-alignment and/or self-centering features |
US10371954B2 (en) | 2014-06-10 | 2019-08-06 | Ams Sensors Singapore Pte. Ltd. | Optoelectronic modules including hybrid arrangements of beam shaping elements, and imaging devices incorporating the same |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000131508A (ja) * | 1998-10-26 | 2000-05-12 | Sony Corp | 対物レンズ及びその製造方法 |
CN103376527A (zh) * | 2012-04-11 | 2013-10-30 | 全视技术有限公司 | 用于晶片级照相机的透镜板及其制造方法 |
WO2014012603A1 (en) * | 2012-07-17 | 2014-01-23 | Heptagon Micro Optics Pte. Ltd. | Optical devices, in particular computational cameras, and methods for manufacturing the same |
WO2015053706A1 (en) * | 2013-10-08 | 2015-04-16 | Heptagon Micro Optics Pte. Ltd. | Partial spacers for wafer-level fabricated modules |
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US20180239116A1 (en) | 2018-08-23 |
EP3341974A4 (en) | 2019-03-06 |
US10663698B2 (en) | 2020-05-26 |
EP3341974B1 (en) | 2020-07-08 |
WO2017034483A1 (en) | 2017-03-02 |
JP6964071B2 (ja) | 2021-11-10 |
CN108076671B (zh) | 2022-04-22 |
KR20180044949A (ko) | 2018-05-03 |
TWI725048B (zh) | 2021-04-21 |
EP3341974A1 (en) | 2018-07-04 |
TW201721207A (zh) | 2017-06-16 |
KR102589817B1 (ko) | 2023-10-13 |
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