SG11201408125TA - Adhesive composition or underfill composition - Google Patents

Adhesive composition or underfill composition

Info

Publication number
SG11201408125TA
SG11201408125TA SG11201408125TA SG11201408125TA SG11201408125TA SG 11201408125T A SG11201408125T A SG 11201408125TA SG 11201408125T A SG11201408125T A SG 11201408125TA SG 11201408125T A SG11201408125T A SG 11201408125TA SG 11201408125T A SG11201408125T A SG 11201408125TA
Authority
SG
Singapore
Prior art keywords
formula
methyl
composition
adhesive composition
hydrogen
Prior art date
Application number
SG11201408125TA
Inventor
Takuya Ohashi
Tomoyuki Enomoto
Original Assignee
Nissan Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Ind Ltd filed Critical Nissan Chemical Ind Ltd
Publication of SG11201408125TA publication Critical patent/SG11201408125TA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/0644—Poly(1,3,5)triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K11/00—Use of ingredients of unknown constitution, e.g. undefined reaction products
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09J161/04, C09J161/18 and C09J161/20
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(i2) mwu ft iz s-5 iv x m £ titz s issaj n d9) mm IHMMi _ r4T» SI^HIB 2013# 12 fll2 0(12.12.2013) w , PO tpCT (10) WO 2013/183679 A1 (51) C08L 61/34 (2006.01) C08G14/073 (2006.01) (21) (22) (25) (26) HI®4>§f]CDl r=E. I DP • C09J179/04 (2006.01) PCT/JP2013/065611 2013 ^6^5 0(05.06.2013) (30) fiBfefix — £: 4#Jg| 2012-127829 2012 ^6^ 5 0 (05.06.2012) JP (71) ttiJiA: Hjflb^lSI^^£tt(NISSAN CHEMIC­ AL INDUSTRIES, LTD.) [JP/JP]; T 1010054 @ 7 #±t!l 1 Tokyo(JP). (72) ffi^(OHASHI, Takuya); T 9392792 6 3 5 HUbfll Toyama (JP). * H? ^.(ENOMOTO, Tomoyuki); T 9392792 a Uj R a lUrfT«H'®rffi*6 3 5 1E^ W^4EJf5EFJTl*3 Toyama (JP). (74) ftIIA: ^ $5^, ^(HANABUSA, Tsuneo cl al.); T 1010062 Ki?vflW-tH|x#!Eai£>5J-& 3TI2 #ite_ «f®3K/TK7-/^> h'J-x-r smfr ¥^PJTI^ Tokyo (JP). (8i) (^ro&i^PBy, IS ft nj f b): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) *!£H (asrofci^isy > ±T(Dmm(Dfcm% V&tf nlfb): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW), n. — V 7 (AM, AZ, BY, KG, KZ, RU, TJ, TM), 3 — • V / ^ (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). - 21 ^(3)) (54) Title: ADHESIVE COMPOSITION OR UNDERFILL COMPOSITION = (54)i ^ Mmm 0) 0\ m oo i-H cn i-H o CJ O £ u h+vi? n 140X141 (57) Abstract: [Problem] To provide novel adhesive composition a or un­ derfill composition. [Solution] An adhesive composition or underfill com­ position comprising an organic solvent and a polymer in which repeating units, excluding the terminals, solely comprise at least one structural unit represented by formula (1) (in formula (1), R 1 and R 2 independently repres­ ent a hydrogen or methyl, represents X a sulfonyl group or a divalent organic group represented by formula (2) (in formula (2), R 3 and R A independently represent a hydrogen or methyl, at least one of the hydrogens in the methyl optionally being substituted by halogen, a and m is 0 or 1), and represents Y a divalent organic group represented by formula (3) or formula (4) (in for­ mulae (3) and (4), Z represents a single bond, methylene, sulfonyl, or -O-, or a divalent organic group represented by formula (2) in which m is 0; R 5 rep­ resents hydrogen, a methyl, ethyl, or methoxy; R 6 represents a methyl, vinyl, allyl, or phenyl; and n is 0 or 1)). (57)®$: [ISffi] 4 )\, 5fc4B£i»<iisyisuiift (1) 1 1— b ft 3 t fcftSajffljS&X I4T > *- Htl] {a*. R 'RUR B05£ (2) : lit 2 ] (j£tK R iil-> L> (D'pt£< 1 , mlioxii 1 &£to ) Y liTIBie (3) Xlise (4) : Ht3] (a£tK z li JMS ^ -O-mRiZmftOZmt flutes (2) R li7K^J! 5 : L> RMiy^^US, 7'JJIsMX.It7^=JlsM&m
SG11201408125TA 2012-06-05 2013-06-05 Adhesive composition or underfill composition SG11201408125TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012127829 2012-06-05
PCT/JP2013/065611 WO2013183679A1 (en) 2012-06-05 2013-06-05 Adhesive composition or underfill composition

Publications (1)

Publication Number Publication Date
SG11201408125TA true SG11201408125TA (en) 2015-01-29

Family

ID=49712068

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408125TA SG11201408125TA (en) 2012-06-05 2013-06-05 Adhesive composition or underfill composition

Country Status (8)

Country Link
US (1) US20150184044A1 (en)
EP (1) EP2857452A4 (en)
JP (1) JP6226141B2 (en)
KR (1) KR101935035B1 (en)
CN (1) CN104302699A (en)
SG (1) SG11201408125TA (en)
TW (1) TWI617593B (en)
WO (1) WO2013183679A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015104973A1 (en) * 2014-01-07 2015-07-16 Dic株式会社 Polyarylene ether resin, production method for polyarylene ether resin, curable resin material, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-up film
JP6553980B2 (en) * 2015-08-13 2019-07-31 株式会社ダイセル Curable composition and cured product thereof
JP6764134B2 (en) * 2016-08-30 2020-09-30 日産化学株式会社 Photosensitive adhesive composition
KR20240123920A (en) 2023-02-08 2024-08-16 이아이씨티코리아 주식회사 Underfill Adhesive Composition

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5900447A (en) * 1997-05-01 1999-05-04 Edison Polymer Innovation Corporation Composition for forming high thermal conductivity polybenzoxazine-based material and method
JP3937259B2 (en) * 1998-02-17 2007-06-27 日立化成工業株式会社 Flame retardant resin composition for copper clad laminate and method for producing copper clad laminate using the same
JP2003064180A (en) * 2001-06-11 2003-03-05 Nippon Steel Chem Co Ltd Curable resin having dihydrobenzoxazine ring structure and heat-resistant cured resin
US20030023007A1 (en) * 2001-07-27 2003-01-30 Hycomp, Inc. Enhancement of thermal properties of benzoxazine polymers by use of aromatic polyamines to incorporate internal benzoxazine groups within the monomer
JP4570419B2 (en) 2004-08-20 2010-10-27 ナミックス株式会社 Liquid sealing resin composition
WO2007097305A1 (en) * 2006-02-20 2007-08-30 Sekisui Chemical Co., Ltd. Method for producing thermosetting resin, thermosetting resin, thermosetting composition containing same, molded body, cured body, and electronic device containing those
JP4887850B2 (en) 2006-03-16 2012-02-29 住友ベークライト株式会社 Liquid resin composition for underfill, semiconductor device manufacturing method using the same, and semiconductor device
JP2008291070A (en) * 2007-05-22 2008-12-04 Sekisui Chem Co Ltd Manufacturing method for thermosetting resin, and thermosetting resin
JP4931079B2 (en) 2007-12-21 2012-05-16 パナソニック株式会社 Liquid thermosetting resin composition for underfill and semiconductor device using the same
WO2011040459A1 (en) * 2009-09-30 2011-04-07 積水化学工業株式会社 Thermosetting resin having benzoxazine rings and process for production thereof
WO2011116232A1 (en) * 2010-03-19 2011-09-22 Momentive Specialty Chemicals Inc. Main-chain benzoxazine oligomer compositions, and method for the preparation thereof
JP2012021084A (en) * 2010-07-15 2012-02-02 Gun Ei Chem Ind Co Ltd Molded product obtained by heat curing thermosetting molding material
JP2012036318A (en) * 2010-08-10 2012-02-23 Gun Ei Chem Ind Co Ltd Thermosetting resin
JP2012036319A (en) * 2010-08-10 2012-02-23 Gun Ei Chem Ind Co Ltd Thermosetting resin and cured product of the same

Also Published As

Publication number Publication date
EP2857452A4 (en) 2016-01-20
EP2857452A1 (en) 2015-04-08
TWI617593B (en) 2018-03-11
WO2013183679A1 (en) 2013-12-12
US20150184044A1 (en) 2015-07-02
KR101935035B1 (en) 2019-01-04
KR20150023560A (en) 2015-03-05
TW201402653A (en) 2014-01-16
CN104302699A (en) 2015-01-21
JPWO2013183679A1 (en) 2016-02-01
JP6226141B2 (en) 2017-11-08

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