SG11201406632SA - Epoxy resin composition and cured product - Google Patents

Epoxy resin composition and cured product

Info

Publication number
SG11201406632SA
SG11201406632SA SG11201406632SA SG11201406632SA SG11201406632SA SG 11201406632S A SG11201406632S A SG 11201406632SA SG 11201406632S A SG11201406632S A SG 11201406632SA SG 11201406632S A SG11201406632S A SG 11201406632SA SG 11201406632S A SG11201406632S A SG 11201406632SA
Authority
SG
Singapore
Prior art keywords
resin composition
epoxy resin
cured product
cured
product
Prior art date
Application number
SG11201406632SA
Other languages
English (en)
Inventor
Hisashi Yamada
Masaki Omura
Eijiro Aoyagi
Kazuhiko Nakahara
Masashi Kaji
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of SG11201406632SA publication Critical patent/SG11201406632SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C08G59/3272—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG11201406632SA 2012-04-16 2012-04-16 Epoxy resin composition and cured product SG11201406632SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/060211 WO2013157061A1 (ja) 2012-04-16 2012-04-16 エポキシ樹脂組成物及び硬化物

Publications (1)

Publication Number Publication Date
SG11201406632SA true SG11201406632SA (en) 2014-11-27

Family

ID=49383052

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201406632SA SG11201406632SA (en) 2012-04-16 2012-04-16 Epoxy resin composition and cured product

Country Status (4)

Country Link
KR (1) KR20150008108A (zh)
CN (1) CN104245775B (zh)
SG (1) SG11201406632SA (zh)
WO (1) WO2013157061A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6113454B2 (ja) * 2012-10-11 2017-04-12 新日鉄住金化学株式会社 エポキシ樹脂組成物及び硬化物
CN105305364A (zh) * 2015-10-20 2016-02-03 宁波东昊电缆附件有限公司 110kV直通接头铜外壳
KR102112866B1 (ko) * 2017-11-09 2020-05-19 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
WO2020196604A1 (ja) 2019-03-27 2020-10-01 日鉄ケミカル＆マテリアル株式会社 ナフトール樹脂、エポキシ樹脂、エポキシ樹脂組成物およびその硬化物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3268498B2 (ja) * 1990-05-01 2002-03-25 東都化成株式会社 リン含有難燃性エポキシ樹脂
JP3146320B2 (ja) * 1991-11-18 2001-03-12 東都化成株式会社 エポキシ樹脂組成物
JP3318871B2 (ja) * 1992-01-22 2002-08-26 東都化成株式会社 エポキシ樹脂組成物
JP3579800B2 (ja) * 1994-12-14 2004-10-20 東都化成株式会社 低誘電性エポキシ樹脂組成物
JP3533973B2 (ja) * 1998-01-27 2004-06-07 東都化成株式会社 リン含有エポキシ樹脂組成物
JP2000336146A (ja) * 1999-05-26 2000-12-05 Takeda Chem Ind Ltd 難燃性エポキシ樹脂組成物
JP3875210B2 (ja) * 2003-04-22 2007-01-31 エア・ウォーター株式会社 熱硬化性樹脂組成物及びその用途
EP2195364A1 (en) * 2007-09-28 2010-06-16 Dow Global Technologies Inc. Epoxy resin formulations
JP2010053293A (ja) * 2008-08-29 2010-03-11 Nippon Kayaku Co Ltd エポキシ樹脂組成物
JP5547386B2 (ja) * 2008-09-25 2014-07-09 パナソニック株式会社 プリプレグ用エポキシ樹脂組成物、プリプレグ、および多層プリント配線板
JP2010077262A (ja) * 2008-09-25 2010-04-08 Panasonic Electric Works Co Ltd エポキシ樹脂組成物、プリプレグ、樹脂付き金属箔、樹脂シート、積層板、および多層板
JP5320130B2 (ja) * 2009-03-31 2013-10-23 新日鉄住金化学株式会社 多価ヒドロキシ樹脂、エポキシ樹脂、それらの製造方法、エポキシ樹脂組成物及びその硬化物
JP5720118B2 (ja) * 2009-06-01 2015-05-20 三菱レイヨン株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
JP5570380B2 (ja) * 2010-10-07 2014-08-13 新日鉄住金化学株式会社 エポキシ樹脂組成物及び硬化物

Also Published As

Publication number Publication date
KR20150008108A (ko) 2015-01-21
CN104245775B (zh) 2016-08-17
WO2013157061A1 (ja) 2013-10-24
CN104245775A (zh) 2014-12-24

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