SG11201406110XA - Polyamide acid and resin composition containing same - Google Patents
Polyamide acid and resin composition containing sameInfo
- Publication number
- SG11201406110XA SG11201406110XA SG11201406110XA SG11201406110XA SG11201406110XA SG 11201406110X A SG11201406110X A SG 11201406110XA SG 11201406110X A SG11201406110X A SG 11201406110XA SG 11201406110X A SG11201406110X A SG 11201406110XA SG 11201406110X A SG11201406110X A SG 11201406110XA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- composition containing
- containing same
- polyamide acid
- polyamide
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2150/00—Compositions for coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Paints Or Removers (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012076500 | 2012-03-29 | ||
PCT/JP2013/059165 WO2013146967A1 (fr) | 2012-03-29 | 2013-03-28 | Polyamide acide et composition de résine le contenant |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201406110XA true SG11201406110XA (en) | 2014-11-27 |
Family
ID=49260215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201406110XA SG11201406110XA (en) | 2012-03-29 | 2013-03-28 | Polyamide acid and resin composition containing same |
Country Status (9)
Country | Link |
---|---|
US (2) | US20150045502A1 (fr) |
EP (1) | EP2832769A4 (fr) |
JP (1) | JP5472540B1 (fr) |
KR (1) | KR101924829B1 (fr) |
CN (1) | CN104204037B (fr) |
PH (1) | PH12014502161B1 (fr) |
SG (1) | SG11201406110XA (fr) |
TW (1) | TWI572640B (fr) |
WO (1) | WO2013146967A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101916647B1 (ko) * | 2015-12-11 | 2018-11-07 | 도레이 카부시키가이샤 | 수지 조성물, 수지의 제조 방법, 수지막의 제조 방법 및 전자 디바이스의 제조 방법 |
CN109891375B (zh) * | 2016-11-01 | 2022-04-12 | 东丽株式会社 | 触摸面板、触摸面板的制造方法 |
CN111051432B (zh) * | 2017-09-07 | 2023-04-04 | 东丽株式会社 | 树脂组合物、树脂膜的制造方法及电子设备的制造方法 |
KR102591368B1 (ko) * | 2018-03-16 | 2023-10-19 | 삼성전자주식회사 | 올리고머, 올리고머를 포함하는 조성물, 조성물로부터 제조되는 성형품, 성형품의 제조 방법, 및 성형품을 포함하는 표시 장치 |
KR102107574B1 (ko) * | 2019-05-24 | 2020-05-07 | 에스케이씨코오롱피아이 주식회사 | 디스플레이 기판 제조용 폴리아믹산 조성물 및 이를 이용하여 디스플레이용 기판을 제조하는 방법 |
CN113474156B (zh) * | 2019-02-26 | 2022-04-29 | 东丽株式会社 | 聚酰胺酸树脂组合物、聚酰亚胺树脂膜及其制造方法、层叠体、以及电子器件及其制造方法 |
CN116426130B (zh) * | 2023-03-13 | 2024-01-23 | 北京清大际光科技发展有限公司 | 一种碳纳米角改性聚酰亚胺树脂及其应用 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4963645A (en) | 1987-08-25 | 1990-10-16 | Ube Industries, Ltd. | Terminal-modified imide oligomer and solution composition of the same |
JPS6454029A (en) * | 1987-08-25 | 1989-03-01 | Ube Industries | Terminal-modified imide oligomer and its solution composition |
US5389625A (en) | 1989-10-28 | 1995-02-14 | Kyoto Pharmaceutical Industries, Ltd. | Cephalosporin compounds |
GB9101205D0 (en) * | 1990-02-14 | 1991-02-27 | Ici Plc | Incorporation of desired groups into polymers,the polymers so produced and composition containing them |
JPH06102667A (ja) | 1991-08-13 | 1994-04-15 | Toray Ind Inc | 感光性ポリイミド前駆体組成物およびその製造方法 |
JP2001335619A (ja) * | 1999-12-28 | 2001-12-04 | Kanegafuchi Chem Ind Co Ltd | エポキシ変性ポリイミドおよび、これを用いた感光性組成物、カバーレイフィルム、ソルダーレジスト、プリント配線板 |
US6605353B2 (en) * | 1999-12-28 | 2003-08-12 | Kaneka Corporation | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide |
TWI287028B (en) * | 2002-05-17 | 2007-09-21 | Hitachi Chem Dupont Microsys | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment |
KR101330911B1 (ko) * | 2006-01-30 | 2013-11-18 | 제이에스알 가부시끼가이샤 | 액정 배향제, 배향막 및 액정 표시 소자 |
JP5359273B2 (ja) * | 2006-07-25 | 2013-12-04 | 宇部興産株式会社 | 末端変性多分岐ポリイミド、金属メッキ被覆末端変性多分岐ポリイミド及びこれらの製造方法 |
JP5251508B2 (ja) | 2006-07-27 | 2013-07-31 | 宇部興産株式会社 | 耐熱性フィルム金属箔積層体、およびその製造方法 |
JP5068628B2 (ja) | 2007-10-26 | 2012-11-07 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、感光性樹脂組成物フィルム、およびそれらを用いたカバーレイ |
-
2013
- 2013-03-28 KR KR1020147027761A patent/KR101924829B1/ko active IP Right Grant
- 2013-03-28 US US14/387,609 patent/US20150045502A1/en not_active Abandoned
- 2013-03-28 TW TW102111160A patent/TWI572640B/zh not_active IP Right Cessation
- 2013-03-28 JP JP2013524670A patent/JP5472540B1/ja active Active
- 2013-03-28 WO PCT/JP2013/059165 patent/WO2013146967A1/fr active Application Filing
- 2013-03-28 EP EP13770178.5A patent/EP2832769A4/fr not_active Withdrawn
- 2013-03-28 CN CN201380016898.5A patent/CN104204037B/zh active Active
- 2013-03-28 SG SG11201406110XA patent/SG11201406110XA/en unknown
-
2014
- 2014-09-26 PH PH12014502161A patent/PH12014502161B1/en unknown
-
2016
- 2016-08-01 US US15/225,569 patent/US9822281B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI572640B (zh) | 2017-03-01 |
WO2013146967A1 (fr) | 2013-10-03 |
US20160340547A1 (en) | 2016-11-24 |
CN104204037A (zh) | 2014-12-10 |
KR101924829B1 (ko) | 2018-12-04 |
PH12014502161A1 (en) | 2014-12-10 |
JPWO2013146967A1 (ja) | 2015-12-14 |
PH12014502161B1 (en) | 2014-12-10 |
EP2832769A1 (fr) | 2015-02-04 |
EP2832769A4 (fr) | 2015-09-16 |
US9822281B2 (en) | 2017-11-21 |
JP5472540B1 (ja) | 2014-04-16 |
TW201348297A (zh) | 2013-12-01 |
US20150045502A1 (en) | 2015-02-12 |
CN104204037B (zh) | 2016-08-24 |
KR20140138834A (ko) | 2014-12-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI563023B (en) | Polyamide moulding compounds and their application | |
EP2927281A4 (fr) | Composition de résine et ses utilisations | |
SG11201500481RA (en) | Resin composition | |
EP2902446A4 (fr) | Composition de résine de polyimide | |
EP2842998A4 (fr) | Composition de résine et son utilisation | |
ZA201209144B (en) | Polyamide resin composition | |
EP2857428A4 (fr) | Composition de résine époxy | |
EP2896657A4 (fr) | Résine polyamide | |
EP2896656A4 (fr) | Composition de résine de polyamide et article moulé correspondant | |
GB201312508D0 (en) | Resin composition and composite structure containing resin | |
EP2832795A4 (fr) | Composition de résine | |
EP2902445A4 (fr) | Composition de résine de polyamide | |
ZA201208569B (en) | Polyamide resin composition | |
EP2921526A4 (fr) | Composition de résine thermodurcissable | |
ZA201208571B (en) | Polyamide resin composition | |
EP2829574A4 (fr) | Composition de résine à diffusibilité lumineuse | |
EP2868699A4 (fr) | Composition de résines | |
SG11201406110XA (en) | Polyamide acid and resin composition containing same | |
EP2915848A4 (fr) | Composition de résine thermodurcissable et ses utilisations | |
EP2886609A4 (fr) | Composition de résine de polyéther polyamide | |
EP2687555A4 (fr) | Polyamide et composition de polyamide | |
SG10201601778PA (en) | Polyamide resin composition | |
EP2835400A4 (fr) | Composition de résine | |
EP2910606A4 (fr) | Composition de résine thermodurcissable | |
EP2719724A4 (fr) | Composition de résine et élément d'étanchéité |