SG11201405535PA - Apparatus and method to reduce particles in advance anneal process - Google Patents

Apparatus and method to reduce particles in advance anneal process

Info

Publication number
SG11201405535PA
SG11201405535PA SG11201405535PA SG11201405535PA SG11201405535PA SG 11201405535P A SG11201405535P A SG 11201405535PA SG 11201405535P A SG11201405535P A SG 11201405535PA SG 11201405535P A SG11201405535P A SG 11201405535PA SG 11201405535P A SG11201405535P A SG 11201405535PA
Authority
SG
Singapore
Prior art keywords
advance
anneal process
reduce particles
particles
reduce
Prior art date
Application number
SG11201405535PA
Other languages
English (en)
Inventor
Amikam Sade
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201405535PA publication Critical patent/SG11201405535PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Recrystallisation Techniques (AREA)
  • Laser Beam Processing (AREA)
SG11201405535PA 2012-04-18 2013-03-22 Apparatus and method to reduce particles in advance anneal process SG11201405535PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261635136P 2012-04-18 2012-04-18
PCT/US2013/033441 WO2013158335A1 (en) 2012-04-18 2013-03-22 Apparatus and method to reduce particles in advance anneal process

Publications (1)

Publication Number Publication Date
SG11201405535PA true SG11201405535PA (en) 2014-11-27

Family

ID=49380495

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201405535PA SG11201405535PA (en) 2012-04-18 2013-03-22 Apparatus and method to reduce particles in advance anneal process

Country Status (7)

Country Link
US (1) US9214346B2 (enrdf_load_stackoverflow)
JP (2) JP2015521368A (enrdf_load_stackoverflow)
KR (1) KR102108939B1 (enrdf_load_stackoverflow)
CN (2) CN107579022B (enrdf_load_stackoverflow)
SG (1) SG11201405535PA (enrdf_load_stackoverflow)
TW (1) TWI622099B (enrdf_load_stackoverflow)
WO (1) WO2013158335A1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201517133A (zh) * 2013-10-07 2015-05-01 Applied Materials Inc 使用熱佈植與奈秒退火致使銦鋁鎵氮化物材料系統中摻雜劑的高活化
CN109427541A (zh) * 2017-08-29 2019-03-05 中芯国际集成电路制造(北京)有限公司 半导体器件的形成方法
CA3088725A1 (en) * 2018-01-19 2019-07-25 Ncc Nano, Llc Method for curing solder paste on a thermally fragile substrate
JP7108185B2 (ja) * 2018-11-22 2022-07-28 富士通株式会社 最適化装置および最適化装置の制御方法
WO2024042364A1 (en) * 2022-08-24 2024-02-29 Rockley Photonics Limited Wearable module

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JPH0444309A (ja) * 1990-06-12 1992-02-14 Seiko Epson Corp 投影露光方法及び半導体装置の製造方法
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JPH09260257A (ja) * 1996-03-26 1997-10-03 Canon Inc レンズ汚染を防止した投影露光装置およびそれを用いた半導体デバイス製造プロセス
US5793836A (en) * 1996-09-06 1998-08-11 International Business Machines Corporation X-ray mask pellicle
TW445545B (en) * 1999-03-10 2001-07-11 Mitsubishi Electric Corp Laser heat treatment method, laser heat treatment apparatus and semiconductor device
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Also Published As

Publication number Publication date
JP6526855B6 (ja) 2019-06-26
WO2013158335A1 (en) 2013-10-24
JP6526855B2 (ja) 2019-06-05
US9214346B2 (en) 2015-12-15
KR102108939B1 (ko) 2020-05-12
US20130280923A1 (en) 2013-10-24
TWI622099B (zh) 2018-04-21
KR20150003769A (ko) 2015-01-09
JP2018117134A (ja) 2018-07-26
CN104160489A (zh) 2014-11-19
CN107579022B (zh) 2021-03-16
CN107579022A (zh) 2018-01-12
TW201344798A (zh) 2013-11-01
JP2015521368A (ja) 2015-07-27

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