SG111314A1 - Lithographic apparatus and device manufacturing method - Google Patents
Lithographic apparatus and device manufacturing methodInfo
- Publication number
- SG111314A1 SG111314A1 SG200407087A SG200407087A SG111314A1 SG 111314 A1 SG111314 A1 SG 111314A1 SG 200407087 A SG200407087 A SG 200407087A SG 200407087 A SG200407087 A SG 200407087A SG 111314 A1 SG111314 A1 SG 111314A1
- Authority
- SG
- Singapore
- Prior art keywords
- device manufacturing
- lithographic apparatus
- lithographic
- manufacturing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03078504 | 2003-11-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG111314A1 true SG111314A1 (en) | 2005-05-30 |
Family
ID=34626394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200407087A SG111314A1 (en) | 2003-11-05 | 2004-11-02 | Lithographic apparatus and device manufacturing method |
Country Status (8)
Country | Link |
---|---|
US (1) | US7307696B2 (ja) |
EP (1) | EP1530088B1 (ja) |
JP (1) | JP4451280B2 (ja) |
KR (1) | KR100700372B1 (ja) |
CN (1) | CN100504607C (ja) |
DE (1) | DE602004008009T2 (ja) |
SG (1) | SG111314A1 (ja) |
TW (1) | TW200527153A (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100382275C (zh) * | 2004-10-29 | 2008-04-16 | 东京毅力科创株式会社 | 基板载置台、基板处理装置及基板的温度控制方法 |
US7834974B2 (en) | 2005-06-28 | 2010-11-16 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7593096B2 (en) | 2006-05-15 | 2009-09-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7978308B2 (en) * | 2006-05-15 | 2011-07-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP2054771B1 (en) * | 2006-07-28 | 2017-08-30 | Mapper Lithography IP B.V. | Lithography system, method of heat dissipation and frame |
JP5866323B2 (ja) * | 2007-07-13 | 2016-02-17 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | リソグラフィシステム、クランプ方法及びウェーハテーブル |
TWI450047B (zh) * | 2007-07-13 | 2014-08-21 | Mapper Lithography Ip Bv | 微影系統、夾緊方法及晶圓台 |
US8705010B2 (en) | 2007-07-13 | 2014-04-22 | Mapper Lithography Ip B.V. | Lithography system, method of clamping and wafer table |
KR20110052697A (ko) * | 2008-08-08 | 2011-05-18 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 및 디바이스 제조 방법 |
NL2008845A (en) * | 2011-05-24 | 2012-11-27 | Asml Netherlands Bv | Lithographic apparatus and component. |
NL2008980A (en) | 2011-07-11 | 2013-01-14 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
JP5778093B2 (ja) * | 2011-08-10 | 2015-09-16 | エーエスエムエル ネザーランズ ビー.ブイ. | 基板テーブルアセンブリ、液浸リソグラフィ装置及びデバイス製造方法 |
NL2009189A (en) | 2011-08-17 | 2013-02-19 | Asml Netherlands Bv | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method. |
US10937684B2 (en) | 2012-11-28 | 2021-03-02 | Kyocera Corporation | Placement member and method of manufacturing the same |
WO2015032588A1 (en) * | 2013-09-06 | 2015-03-12 | Asml Netherlands B.V. | Methodology to generate guiding templates for directed self-assembly |
CN105683839B (zh) | 2013-09-27 | 2017-08-08 | Asml荷兰有限公司 | 用于光刻设备的支撑台、光刻设备以及器件制造方法 |
EP3073521B1 (en) | 2013-11-22 | 2022-04-20 | Kyocera Corporation | Electrostatic chuck |
WO2015165653A1 (en) * | 2014-04-30 | 2015-11-05 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
CN107077078B (zh) | 2014-10-23 | 2019-04-09 | Asml荷兰有限公司 | 用于光刻设备的支撑台、加载衬底的方法、光刻设备和器件制造方法 |
NL2017357A (en) * | 2015-09-28 | 2017-09-01 | Asml Netherlands Bv | A Substrate Holder, a Lithographic Apparatus and Method of Manufacturing Devices |
CN111474826A (zh) * | 2015-12-15 | 2020-07-31 | Asml荷兰有限公司 | 衬底保持器、光刻设备及制造器件的方法 |
CN111448647B (zh) * | 2018-03-26 | 2023-08-01 | 日本碍子株式会社 | 静电卡盘加热器 |
EP3903152A1 (en) * | 2018-12-28 | 2021-11-03 | ASML Netherlands B.V. | Substrate holder for use in a lithographic apparatus and a method of manufacturing a substrate holder |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09172055A (ja) * | 1995-12-19 | 1997-06-30 | Fujitsu Ltd | 静電チャック及びウエハの吸着方法 |
JP3814359B2 (ja) * | 1996-03-12 | 2006-08-30 | キヤノン株式会社 | X線投影露光装置及びデバイス製造方法 |
US5835334A (en) * | 1996-09-30 | 1998-11-10 | Lam Research | Variable high temperature chuck for high density plasma chemical vapor deposition |
US6033478A (en) * | 1996-11-05 | 2000-03-07 | Applied Materials, Inc. | Wafer support with improved temperature control |
US5997963A (en) * | 1998-05-05 | 1999-12-07 | Ultratech Stepper, Inc. | Microchamber |
JP2000091220A (ja) * | 1998-09-08 | 2000-03-31 | Nikon Corp | 投影露光装置及び投影露光方法 |
JP3983387B2 (ja) * | 1998-09-29 | 2007-09-26 | 日本碍子株式会社 | 静電チャック |
US6570752B2 (en) * | 1999-12-28 | 2003-05-27 | Nikon Corporation | Wafer chucks and the like including substrate-adhesion detection and adhesion correction |
TW473792B (en) * | 2000-01-20 | 2002-01-21 | Ngk Insulators Ltd | Electrostatic chuck |
WO2001056074A1 (fr) * | 2000-01-28 | 2001-08-02 | Hitachi Tokyo Electronics Co., Ltd. | Support de tranche, systeme d'exposition et procede de fabrication de dispositif a semiconducteur |
JP2001332609A (ja) * | 2000-03-13 | 2001-11-30 | Nikon Corp | 基板保持装置及び露光装置 |
JP4312394B2 (ja) * | 2001-01-29 | 2009-08-12 | 日本碍子株式会社 | 静電チャックおよび基板処理装置 |
US6628503B2 (en) * | 2001-03-13 | 2003-09-30 | Nikon Corporation | Gas cooled electrostatic pin chuck for vacuum applications |
JP4288694B2 (ja) * | 2001-12-20 | 2009-07-01 | 株式会社ニコン | 基板保持装置、露光装置及びデバイス製造方法 |
US6905984B2 (en) * | 2003-10-10 | 2005-06-14 | Axcelis Technologies, Inc. | MEMS based contact conductivity electrostatic chuck |
-
2004
- 2004-10-25 EP EP04077933A patent/EP1530088B1/en not_active Expired - Lifetime
- 2004-10-25 DE DE602004008009T patent/DE602004008009T2/de not_active Expired - Lifetime
- 2004-11-02 SG SG200407087A patent/SG111314A1/en unknown
- 2004-11-04 TW TW093133668A patent/TW200527153A/zh not_active IP Right Cessation
- 2004-11-04 KR KR1020040089338A patent/KR100700372B1/ko not_active IP Right Cessation
- 2004-11-04 US US10/980,833 patent/US7307696B2/en not_active Expired - Fee Related
- 2004-11-04 CN CNB2004100903705A patent/CN100504607C/zh not_active Expired - Fee Related
- 2004-11-05 JP JP2004321463A patent/JP4451280B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1530088B1 (en) | 2007-08-08 |
JP4451280B2 (ja) | 2010-04-14 |
KR20050043673A (ko) | 2005-05-11 |
CN1614511A (zh) | 2005-05-11 |
JP2005142570A (ja) | 2005-06-02 |
US7307696B2 (en) | 2007-12-11 |
TW200527153A (en) | 2005-08-16 |
US20050122503A1 (en) | 2005-06-09 |
EP1530088A1 (en) | 2005-05-11 |
KR100700372B1 (ko) | 2007-03-27 |
CN100504607C (zh) | 2009-06-24 |
TWI331703B (ja) | 2010-10-11 |
DE602004008009T2 (de) | 2008-04-30 |
DE602004008009D1 (de) | 2007-09-20 |
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