SG111313A1 - Lithographic apparatus and device manufacturing method - Google Patents
Lithographic apparatus and device manufacturing methodInfo
- Publication number
- SG111313A1 SG111313A1 SG200407085A SG200407085A SG111313A1 SG 111313 A1 SG111313 A1 SG 111313A1 SG 200407085 A SG200407085 A SG 200407085A SG 200407085 A SG200407085 A SG 200407085A SG 111313 A1 SG111313 A1 SG 111313A1
- Authority
- SG
- Singapore
- Prior art keywords
- device manufacturing
- lithographic apparatus
- lithographic
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Epidemiology (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Public Health (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03078504 | 2003-11-05 | ||
US10/735,848 US7019820B2 (en) | 2003-12-16 | 2003-12-16 | Lithographic apparatus and device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG111313A1 true SG111313A1 (en) | 2005-05-30 |
Family
ID=34702341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200407085A SG111313A1 (en) | 2003-11-05 | 2004-11-02 | Lithographic apparatus and device manufacturing method |
Country Status (8)
Country | Link |
---|---|
US (1) | US7027132B2 (ja) |
EP (2) | EP2267535A1 (ja) |
JP (2) | JP4446860B2 (ja) |
KR (1) | KR100656580B1 (ja) |
CN (2) | CN1614513B (ja) |
DE (1) | DE602004032100D1 (ja) |
SG (1) | SG111313A1 (ja) |
TW (1) | TWI284254B (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006261156A (ja) * | 2005-03-15 | 2006-09-28 | Canon Inc | 原版保持装置およびそれを用いた露光装置 |
US7649611B2 (en) | 2005-12-30 | 2010-01-19 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7593096B2 (en) * | 2006-05-15 | 2009-09-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8705010B2 (en) | 2007-07-13 | 2014-04-22 | Mapper Lithography Ip B.V. | Lithography system, method of clamping and wafer table |
TWI514090B (zh) | 2007-07-13 | 2015-12-21 | Mapper Lithography Ip Bv | 微影系統及用於支撐晶圓的晶圓台 |
NL2006674A (en) * | 2010-08-02 | 2012-02-06 | Asml Holding Nv | Reticle cooling in a lithographic apparatus. |
NL2007768A (en) | 2010-12-14 | 2012-06-18 | Asml Netherlands Bv | Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder. |
NL2008630A (en) | 2011-04-27 | 2012-10-30 | Asml Netherlands Bv | Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder. |
NL2008845A (en) * | 2011-05-24 | 2012-11-27 | Asml Netherlands Bv | Lithographic apparatus and component. |
NL2009858A (en) | 2011-12-27 | 2013-07-01 | Asml Netherlands Bv | Substrate holder, lithographic apparatus, and device manufacturing method. |
CN109375474A (zh) | 2012-02-03 | 2019-02-22 | Asml荷兰有限公司 | 衬底支架、光刻装置、器件制造方法和制造衬底保持器的方法 |
US10937684B2 (en) | 2012-11-28 | 2021-03-02 | Kyocera Corporation | Placement member and method of manufacturing the same |
EP3073521B1 (en) * | 2013-11-22 | 2022-04-20 | Kyocera Corporation | Electrostatic chuck |
EP3210080B1 (en) * | 2014-10-23 | 2020-12-09 | ASML Netherlands B.V. | Support table for a lithographic apparatus, method of loading a substrate, lithographic apparatus and device manufacturing method |
WO2017054991A1 (en) * | 2015-09-28 | 2017-04-06 | Asml Netherlands B.V. | A substrate holder, a lithographic apparatus and method of manufacturing devices |
EP3391149B1 (en) * | 2015-12-15 | 2020-01-01 | ASML Netherlands B.V. | A substrate holder, a lithographic apparatus and method of manufacturing devices |
KR102617773B1 (ko) * | 2017-06-01 | 2023-12-22 | 에이에스엠엘 네델란즈 비.브이. | 입자 제거 장치 및 관련 시스템 |
EP3714329A1 (en) * | 2017-11-20 | 2020-09-30 | ASML Netherlands B.V. | Substrate holder, substrate support and method of clamping a substrate to a clamping system |
WO2019187785A1 (ja) * | 2018-03-26 | 2019-10-03 | 日本碍子株式会社 | 静電チャックヒータ |
KR102607809B1 (ko) * | 2021-06-25 | 2023-11-29 | 세메스 주식회사 | 지지 유닛, 이를 포함하는 베이크 장치 및 기판 처리 장치 |
WO2023016738A1 (en) * | 2021-08-12 | 2023-02-16 | Asml Netherlands B.V. | Electrostatic holder, object table and lithographic apparatus |
EP4134748A1 (en) * | 2021-08-12 | 2023-02-15 | ASML Netherlands B.V. | Electrostatic holder, object table and lithographic apparatus |
WO2023134989A1 (en) * | 2022-01-13 | 2023-07-20 | Asml Netherlands B.V. | A system for use in a lithographic apparatus |
EP4227738A1 (en) * | 2022-02-14 | 2023-08-16 | ASML Netherlands B.V. | Clamp |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2680338B2 (ja) * | 1988-03-31 | 1997-11-19 | 株式会社東芝 | 静電チャック装置 |
US5166856A (en) * | 1991-01-31 | 1992-11-24 | International Business Machines Corporation | Electrostatic chuck with diamond coating |
US5885469B1 (en) * | 1996-11-05 | 2000-08-08 | Applied Materials Inc | Topographical structure of an electrostatic chuck and method of fabricating same |
US5883778A (en) * | 1994-02-28 | 1999-03-16 | Applied Materials, Inc. | Electrostatic chuck with fluid flow regulator |
JPH09172055A (ja) | 1995-12-19 | 1997-06-30 | Fujitsu Ltd | 静電チャック及びウエハの吸着方法 |
JP3814359B2 (ja) * | 1996-03-12 | 2006-08-30 | キヤノン株式会社 | X線投影露光装置及びデバイス製造方法 |
JPH1092738A (ja) * | 1996-09-18 | 1998-04-10 | Canon Inc | 基板保持装置およびこれを用いた露光装置 |
US6033478A (en) | 1996-11-05 | 2000-03-07 | Applied Materials, Inc. | Wafer support with improved temperature control |
US6217655B1 (en) * | 1997-01-31 | 2001-04-17 | Applied Materials, Inc. | Stand-off pad for supporting a wafer on a substrate support chuck |
US5841624A (en) * | 1997-06-09 | 1998-11-24 | Applied Materials, Inc. | Cover layer for a substrate support chuck and method of fabricating same |
WO1999028957A1 (fr) * | 1997-11-28 | 1999-06-10 | Nikon Corporation | Appareil de maintien de substrat et appareil d'exposition l'utilisant |
WO1999031716A1 (fr) * | 1997-12-16 | 1999-06-24 | Nikon Corporation | Aligneur, methode d'exposition et procede de fabrication de ce dispositif |
US6232615B1 (en) * | 1998-03-31 | 2001-05-15 | Asm Lithography B.V. | Lithographic projection apparatus with improved substrate holder |
EP0947884B1 (en) | 1998-03-31 | 2004-03-10 | ASML Netherlands B.V. | Lithographic projection apparatus with substrate holder |
JP3983387B2 (ja) * | 1998-09-29 | 2007-09-26 | 日本碍子株式会社 | 静電チャック |
US6333775B1 (en) * | 1999-01-13 | 2001-12-25 | Euv Llc | Extreme-UV lithography vacuum chamber zone seal |
JP2001148340A (ja) * | 1999-11-19 | 2001-05-29 | Advantest Corp | 荷電粒子ビーム露光方法及び装置 |
US6570752B2 (en) * | 1999-12-28 | 2003-05-27 | Nikon Corporation | Wafer chucks and the like including substrate-adhesion detection and adhesion correction |
JP2001332609A (ja) | 2000-03-13 | 2001-11-30 | Nikon Corp | 基板保持装置及び露光装置 |
US6556281B1 (en) * | 2000-05-23 | 2003-04-29 | Asml Us, Inc. | Flexible piezoelectric chuck and method of using the same |
JP2002076104A (ja) * | 2000-09-04 | 2002-03-15 | Nikon Corp | 静電吸着装置、その製造方法及び露光装置 |
US6628503B2 (en) * | 2001-03-13 | 2003-09-30 | Nikon Corporation | Gas cooled electrostatic pin chuck for vacuum applications |
JP2003229347A (ja) * | 2002-01-31 | 2003-08-15 | Canon Inc | 半導体製造装置 |
JP2003257834A (ja) * | 2002-03-04 | 2003-09-12 | Toshiba Corp | 半導体装置の製造方法及び半導体装置の製造装置 |
US6905984B2 (en) * | 2003-10-10 | 2005-06-14 | Axcelis Technologies, Inc. | MEMS based contact conductivity electrostatic chuck |
US6897945B1 (en) * | 2003-12-15 | 2005-05-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
-
2004
- 2004-10-25 DE DE602004032100T patent/DE602004032100D1/de active Active
- 2004-10-25 EP EP10179219A patent/EP2267535A1/en not_active Withdrawn
- 2004-10-25 EP EP04077936A patent/EP1530089B1/en active Active
- 2004-11-02 SG SG200407085A patent/SG111313A1/en unknown
- 2004-11-04 JP JP2004319980A patent/JP4446860B2/ja active Active
- 2004-11-04 CN CN200410090372.4A patent/CN1614513B/zh active Active
- 2004-11-04 TW TW093133670A patent/TWI284254B/zh active
- 2004-11-04 US US10/980,834 patent/US7027132B2/en not_active Expired - Lifetime
- 2004-11-04 CN CN201010108621A patent/CN101846887A/zh active Pending
- 2004-11-04 KR KR1020040089337A patent/KR100656580B1/ko active IP Right Grant
-
2009
- 2009-08-19 JP JP2009190091A patent/JP2010010695A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1530089A1 (en) | 2005-05-11 |
DE602004032100D1 (de) | 2011-05-19 |
KR20050043672A (ko) | 2005-05-11 |
EP2267535A1 (en) | 2010-12-29 |
EP1530089B1 (en) | 2011-04-06 |
CN101846887A (zh) | 2010-09-29 |
US20050195382A1 (en) | 2005-09-08 |
KR100656580B1 (ko) | 2006-12-11 |
CN1614513A (zh) | 2005-05-11 |
CN1614513B (zh) | 2010-04-28 |
TWI284254B (en) | 2007-07-21 |
JP2005142566A (ja) | 2005-06-02 |
JP4446860B2 (ja) | 2010-04-07 |
US7027132B2 (en) | 2006-04-11 |
JP2010010695A (ja) | 2010-01-14 |
TW200527154A (en) | 2005-08-16 |
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