SG111313A1 - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method

Info

Publication number
SG111313A1
SG111313A1 SG200407085A SG200407085A SG111313A1 SG 111313 A1 SG111313 A1 SG 111313A1 SG 200407085 A SG200407085 A SG 200407085A SG 200407085 A SG200407085 A SG 200407085A SG 111313 A1 SG111313 A1 SG 111313A1
Authority
SG
Singapore
Prior art keywords
device manufacturing
lithographic apparatus
lithographic
manufacturing
Prior art date
Application number
SG200407085A
Other languages
English (en)
Inventor
Joost Jeroen Ottens
Koen Jacobus Johannes Mar Zaal
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/735,848 external-priority patent/US7019820B2/en
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG111313A1 publication Critical patent/SG111313A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200407085A 2003-11-05 2004-11-02 Lithographic apparatus and device manufacturing method SG111313A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03078504 2003-11-05
US10/735,848 US7019820B2 (en) 2003-12-16 2003-12-16 Lithographic apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
SG111313A1 true SG111313A1 (en) 2005-05-30

Family

ID=34702341

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200407085A SG111313A1 (en) 2003-11-05 2004-11-02 Lithographic apparatus and device manufacturing method

Country Status (8)

Country Link
US (1) US7027132B2 (ja)
EP (2) EP2267535A1 (ja)
JP (2) JP4446860B2 (ja)
KR (1) KR100656580B1 (ja)
CN (2) CN1614513B (ja)
DE (1) DE602004032100D1 (ja)
SG (1) SG111313A1 (ja)
TW (1) TWI284254B (ja)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261156A (ja) * 2005-03-15 2006-09-28 Canon Inc 原版保持装置およびそれを用いた露光装置
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7593096B2 (en) * 2006-05-15 2009-09-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8705010B2 (en) 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI514090B (zh) 2007-07-13 2015-12-21 Mapper Lithography Ip Bv 微影系統及用於支撐晶圓的晶圓台
NL2006674A (en) * 2010-08-02 2012-02-06 Asml Holding Nv Reticle cooling in a lithographic apparatus.
NL2007768A (en) 2010-12-14 2012-06-18 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
NL2008630A (en) 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
NL2008845A (en) * 2011-05-24 2012-11-27 Asml Netherlands Bv Lithographic apparatus and component.
NL2009858A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Substrate holder, lithographic apparatus, and device manufacturing method.
CN109375474A (zh) 2012-02-03 2019-02-22 Asml荷兰有限公司 衬底支架、光刻装置、器件制造方法和制造衬底保持器的方法
US10937684B2 (en) 2012-11-28 2021-03-02 Kyocera Corporation Placement member and method of manufacturing the same
EP3073521B1 (en) * 2013-11-22 2022-04-20 Kyocera Corporation Electrostatic chuck
EP3210080B1 (en) * 2014-10-23 2020-12-09 ASML Netherlands B.V. Support table for a lithographic apparatus, method of loading a substrate, lithographic apparatus and device manufacturing method
WO2017054991A1 (en) * 2015-09-28 2017-04-06 Asml Netherlands B.V. A substrate holder, a lithographic apparatus and method of manufacturing devices
EP3391149B1 (en) * 2015-12-15 2020-01-01 ASML Netherlands B.V. A substrate holder, a lithographic apparatus and method of manufacturing devices
KR102617773B1 (ko) * 2017-06-01 2023-12-22 에이에스엠엘 네델란즈 비.브이. 입자 제거 장치 및 관련 시스템
EP3714329A1 (en) * 2017-11-20 2020-09-30 ASML Netherlands B.V. Substrate holder, substrate support and method of clamping a substrate to a clamping system
WO2019187785A1 (ja) * 2018-03-26 2019-10-03 日本碍子株式会社 静電チャックヒータ
KR102607809B1 (ko) * 2021-06-25 2023-11-29 세메스 주식회사 지지 유닛, 이를 포함하는 베이크 장치 및 기판 처리 장치
WO2023016738A1 (en) * 2021-08-12 2023-02-16 Asml Netherlands B.V. Electrostatic holder, object table and lithographic apparatus
EP4134748A1 (en) * 2021-08-12 2023-02-15 ASML Netherlands B.V. Electrostatic holder, object table and lithographic apparatus
WO2023134989A1 (en) * 2022-01-13 2023-07-20 Asml Netherlands B.V. A system for use in a lithographic apparatus
EP4227738A1 (en) * 2022-02-14 2023-08-16 ASML Netherlands B.V. Clamp

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JP2680338B2 (ja) * 1988-03-31 1997-11-19 株式会社東芝 静電チャック装置
US5166856A (en) * 1991-01-31 1992-11-24 International Business Machines Corporation Electrostatic chuck with diamond coating
US5885469B1 (en) * 1996-11-05 2000-08-08 Applied Materials Inc Topographical structure of an electrostatic chuck and method of fabricating same
US5883778A (en) * 1994-02-28 1999-03-16 Applied Materials, Inc. Electrostatic chuck with fluid flow regulator
JPH09172055A (ja) 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
JP3814359B2 (ja) * 1996-03-12 2006-08-30 キヤノン株式会社 Ｘ線投影露光装置及びデバイス製造方法
JPH1092738A (ja) * 1996-09-18 1998-04-10 Canon Inc 基板保持装置およびこれを用いた露光装置
US6033478A (en) 1996-11-05 2000-03-07 Applied Materials, Inc. Wafer support with improved temperature control
US6217655B1 (en) * 1997-01-31 2001-04-17 Applied Materials, Inc. Stand-off pad for supporting a wafer on a substrate support chuck
US5841624A (en) * 1997-06-09 1998-11-24 Applied Materials, Inc. Cover layer for a substrate support chuck and method of fabricating same
WO1999028957A1 (fr) * 1997-11-28 1999-06-10 Nikon Corporation Appareil de maintien de substrat et appareil d'exposition l'utilisant
WO1999031716A1 (fr) * 1997-12-16 1999-06-24 Nikon Corporation Aligneur, methode d'exposition et procede de fabrication de ce dispositif
US6232615B1 (en) * 1998-03-31 2001-05-15 Asm Lithography B.V. Lithographic projection apparatus with improved substrate holder
EP0947884B1 (en) 1998-03-31 2004-03-10 ASML Netherlands B.V. Lithographic projection apparatus with substrate holder
JP3983387B2 (ja) * 1998-09-29 2007-09-26 日本碍子株式会社 静電チャック
US6333775B1 (en) * 1999-01-13 2001-12-25 Euv Llc Extreme-UV lithography vacuum chamber zone seal
JP2001148340A (ja) * 1999-11-19 2001-05-29 Advantest Corp 荷電粒子ビーム露光方法及び装置
US6570752B2 (en) * 1999-12-28 2003-05-27 Nikon Corporation Wafer chucks and the like including substrate-adhesion detection and adhesion correction
JP2001332609A (ja) 2000-03-13 2001-11-30 Nikon Corp 基板保持装置及び露光装置
US6556281B1 (en) * 2000-05-23 2003-04-29 Asml Us, Inc. Flexible piezoelectric chuck and method of using the same
JP2002076104A (ja) * 2000-09-04 2002-03-15 Nikon Corp 静電吸着装置、その製造方法及び露光装置
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
JP2003229347A (ja) * 2002-01-31 2003-08-15 Canon Inc 半導体製造装置
JP2003257834A (ja) * 2002-03-04 2003-09-12 Toshiba Corp 半導体装置の製造方法及び半導体装置の製造装置
US6905984B2 (en) * 2003-10-10 2005-06-14 Axcelis Technologies, Inc. MEMS based contact conductivity electrostatic chuck
US6897945B1 (en) * 2003-12-15 2005-05-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
EP1530089A1 (en) 2005-05-11
DE602004032100D1 (de) 2011-05-19
KR20050043672A (ko) 2005-05-11
EP2267535A1 (en) 2010-12-29
EP1530089B1 (en) 2011-04-06
CN101846887A (zh) 2010-09-29
US20050195382A1 (en) 2005-09-08
KR100656580B1 (ko) 2006-12-11
CN1614513A (zh) 2005-05-11
CN1614513B (zh) 2010-04-28
TWI284254B (en) 2007-07-21
JP2005142566A (ja) 2005-06-02
JP4446860B2 (ja) 2010-04-07
US7027132B2 (en) 2006-04-11
JP2010010695A (ja) 2010-01-14
TW200527154A (en) 2005-08-16

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