SG109476A1 - Process for manufacturing prepreg - Google Patents

Process for manufacturing prepreg

Info

Publication number
SG109476A1
SG109476A1 SG200106783A SG200106783A SG109476A1 SG 109476 A1 SG109476 A1 SG 109476A1 SG 200106783 A SG200106783 A SG 200106783A SG 200106783 A SG200106783 A SG 200106783A SG 109476 A1 SG109476 A1 SG 109476A1
Authority
SG
Singapore
Prior art keywords
manufacturing prepreg
prepreg
manufacturing
Prior art date
Application number
SG200106783A
Other languages
English (en)
Inventor
Yamaji Takashi
Komatsu Mamoru
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG109476A1 publication Critical patent/SG109476A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/40—Shaping or impregnating by compression not applied
    • B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/245—Differential crosslinking of one polymer with one crosslinking type, e.g. surface crosslinking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SG200106783A 2001-03-13 2001-11-02 Process for manufacturing prepreg SG109476A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001070123A JP3499837B2 (ja) 2001-03-13 2001-03-13 プリプレグの製造方法

Publications (1)

Publication Number Publication Date
SG109476A1 true SG109476A1 (en) 2005-03-30

Family

ID=18928048

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200106783A SG109476A1 (en) 2001-03-13 2001-11-02 Process for manufacturing prepreg

Country Status (8)

Country Link
US (1) US6555174B2 (ja)
EP (1) EP1241208B1 (ja)
JP (1) JP3499837B2 (ja)
KR (1) KR20020073247A (ja)
CN (1) CN100404240C (ja)
DE (1) DE60110200T2 (ja)
SG (1) SG109476A1 (ja)
TW (1) TW577809B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2890968B1 (fr) * 2005-09-16 2010-08-13 Gerard Sekrane Procede de fabrication d'un element structural comprenant un materiau composite a matrice organique
CN101321813B (zh) * 2005-12-01 2012-07-04 住友电木株式会社 预成型料、预成型料的制造方法、基板及半导体装置
US7507466B2 (en) 2006-02-22 2009-03-24 General Electric Company Manufacture of CMC articles having small complex features
KR100856326B1 (ko) * 2006-07-19 2008-09-03 삼성전기주식회사 레이저 리프트 오프를 이용한 유전체 박막을 갖는 박막 커패시터 내장된 인쇄회로기판 제조방법, 및 이로부터 제조된 박막 커패시터 내장된 인쇄회로기판
JP2008244189A (ja) * 2007-03-28 2008-10-09 Sumitomo Bakelite Co Ltd 回路基板および半導体装置
JP5217511B2 (ja) * 2008-03-04 2013-06-19 日立化成株式会社 プリプレグの製造方法及びプリプレグの製造装置
TWI414421B (zh) * 2009-10-21 2013-11-11 Chung Shan Inst Of Science 半連續性纖維預浸材料、其製造方法及利用其製造之複合材料
EP2325221A1 (en) * 2009-11-24 2011-05-25 Cytec Surface Specialties Austria GmbH Aqueous epoxy resin dispersions
JP5152432B2 (ja) * 2010-11-18 2013-02-27 住友ベークライト株式会社 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置
JP5115645B2 (ja) * 2010-11-18 2013-01-09 住友ベークライト株式会社 絶縁性基板、金属張積層板、プリント配線板、及び半導体装置
US9446989B2 (en) 2012-12-28 2016-09-20 United Technologies Corporation Carbon fiber-reinforced article and method therefor
JP5376075B2 (ja) * 2013-01-21 2013-12-25 日立化成株式会社 プリプレグの製造方法及びプリプレグの製造装置
US9526185B2 (en) * 2014-04-08 2016-12-20 Finisar Corporation Hybrid PCB with multi-unreinforced laminate
KR20160054861A (ko) * 2014-11-07 2016-05-17 삼성전기주식회사 프리프레그 및 이의 제조방법
TWI720404B (zh) 2018-01-16 2021-03-01 日商三菱化學股份有限公司 預浸材及纖維強化複合材料

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4024305A (en) * 1975-06-04 1977-05-17 International Business Machines Corporation Method for producing a resin rich epoxy prepreg and laminate
US4670080A (en) * 1984-04-10 1987-06-02 President Engineering Corp. Process and apparatus for producing metal-laminated base material for printed circuit boards
US5470647A (en) * 1992-05-15 1995-11-28 Isovolta Osterreichische Isolierstoffwerke Aktiengesellschaft Prepregs comprising a fibrous base with a first coating of C-stage thermosetting resin and an outer second coating of B-stage thermosetting resin and a method of making the same
US5871819A (en) * 1996-09-10 1999-02-16 International Business Machines Corporation Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing
US5928970A (en) * 1996-09-10 1999-07-27 International Business Machines Corp. Dustfree prepreg and method for making an article based thereon
EP1073320A2 (en) * 1999-07-29 2001-01-31 Mitsubishi Gas Chemical Company, Inc. Glass fabric material/thermosetting resin copper-clad laminate having a high-elasticity

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63168438A (ja) * 1986-12-30 1988-07-12 Yokohama Rubber Co Ltd:The プリプレグ
JP2680722B2 (ja) 1990-07-16 1997-11-19 三菱重工業株式会社 圧縮機
JP2611584B2 (ja) 1990-10-04 1997-05-21 日立化成工業株式会社 プリプレグの製造方法
JP3307440B2 (ja) 1992-12-01 2002-07-24 三菱瓦斯化学株式会社 プリプレグの製造法
US5582872A (en) * 1994-03-28 1996-12-10 Current Inc. Electrostatic dissipative laminate and method for making
JPH09227699A (ja) 1996-02-26 1997-09-02 Matsushita Electric Works Ltd プリプレグの製造方法
JP3151402B2 (ja) * 1996-03-15 2001-04-03 松下電工株式会社 金属箔張り積層板製造用プリプレグ
JP3362386B2 (ja) 1997-05-27 2003-01-07 松下電工株式会社 樹脂含浸基材及びその製造方法、積層板及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4024305A (en) * 1975-06-04 1977-05-17 International Business Machines Corporation Method for producing a resin rich epoxy prepreg and laminate
US4670080A (en) * 1984-04-10 1987-06-02 President Engineering Corp. Process and apparatus for producing metal-laminated base material for printed circuit boards
US5470647A (en) * 1992-05-15 1995-11-28 Isovolta Osterreichische Isolierstoffwerke Aktiengesellschaft Prepregs comprising a fibrous base with a first coating of C-stage thermosetting resin and an outer second coating of B-stage thermosetting resin and a method of making the same
US5871819A (en) * 1996-09-10 1999-02-16 International Business Machines Corporation Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing
US5928970A (en) * 1996-09-10 1999-07-27 International Business Machines Corp. Dustfree prepreg and method for making an article based thereon
EP1073320A2 (en) * 1999-07-29 2001-01-31 Mitsubishi Gas Chemical Company, Inc. Glass fabric material/thermosetting resin copper-clad laminate having a high-elasticity

Also Published As

Publication number Publication date
TW577809B (en) 2004-03-01
CN1374189A (zh) 2002-10-16
EP1241208B1 (en) 2005-04-20
DE60110200T2 (de) 2006-03-09
DE60110200D1 (de) 2005-05-25
JP2002265647A (ja) 2002-09-18
US20020168475A1 (en) 2002-11-14
EP1241208A1 (en) 2002-09-18
CN100404240C (zh) 2008-07-23
KR20020073247A (ko) 2002-09-23
JP3499837B2 (ja) 2004-02-23
US6555174B2 (en) 2003-04-29

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