SG106608A1 - Method and system for coating and developing - Google Patents

Method and system for coating and developing

Info

Publication number
SG106608A1
SG106608A1 SG200102576A SG200102576A SG106608A1 SG 106608 A1 SG106608 A1 SG 106608A1 SG 200102576 A SG200102576 A SG 200102576A SG 200102576 A SG200102576 A SG 200102576A SG 106608 A1 SG106608 A1 SG 106608A1
Authority
SG
Singapore
Prior art keywords
developing
coating
Prior art date
Application number
SG200102576A
Other languages
English (en)
Inventor
Kitano Junichi
Matsuyama Yuji
Kitano Takahiro
Yaegashi Hidetami
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG106608A1 publication Critical patent/SG106608A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
SG200102576A 2000-05-10 2001-04-30 Method and system for coating and developing SG106608A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000137498A JP3648129B2 (ja) 2000-05-10 2000-05-10 塗布現像処理方法及び塗布現像処理システム

Publications (1)

Publication Number Publication Date
SG106608A1 true SG106608A1 (en) 2004-10-29

Family

ID=18645265

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200102576A SG106608A1 (en) 2000-05-10 2001-04-30 Method and system for coating and developing

Country Status (6)

Country Link
US (3) US6518199B2 (ja)
JP (1) JP3648129B2 (ja)
KR (1) KR100697939B1 (ja)
CN (1) CN1218221C (ja)
SG (1) SG106608A1 (ja)
TW (1) TWI227507B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3648129B2 (ja) * 2000-05-10 2005-05-18 東京エレクトロン株式会社 塗布現像処理方法及び塗布現像処理システム
JP2005353762A (ja) * 2004-06-09 2005-12-22 Matsushita Electric Ind Co Ltd 半導体製造装置及びパターン形成方法
US8826328B2 (en) * 2004-11-12 2014-09-02 Opentv, Inc. Communicating primary content streams and secondary content streams including targeted advertising to a remote unit
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7798764B2 (en) * 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US20060130767A1 (en) * 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
US7699021B2 (en) * 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US20060241813A1 (en) * 2005-04-22 2006-10-26 Applied Materials, Inc. Optimized cluster tool transfer process and collision avoidance design
JP4718893B2 (ja) 2005-05-13 2011-07-06 株式会社東芝 パターン形成方法
JP4762743B2 (ja) * 2006-02-09 2011-08-31 東京エレクトロン株式会社 熱処理装置
JP4657940B2 (ja) * 2006-02-10 2011-03-23 東京エレクトロン株式会社 基板の処理システム
US7877895B2 (en) 2006-06-26 2011-02-01 Tokyo Electron Limited Substrate processing apparatus
US8289496B2 (en) * 2009-01-30 2012-10-16 Semes Co., Ltd. System and method for treating substrate
KR20160045389A (ko) 2014-10-17 2016-04-27 창원대학교 산학협력단 산화주석과 아연으로 이루어진 다층구조 박막을 이용한 투명전극의 제조방법 및 그에 의한 투명전극
WO2020040178A1 (ja) * 2018-08-23 2020-02-27 東京エレクトロン株式会社 基板処理方法及び基板処理システム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0415412A2 (en) * 1989-08-30 1991-03-06 Kabushiki Kaisha Toshiba Resist pattern fabrication method
US6162591A (en) * 1998-09-01 2000-12-19 Industrial Technology Research Institute Photolithography process with gas-phase pretreatment

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JPS6439718A (en) * 1987-08-06 1989-02-10 Fuji Electric Co Ltd Manufacture of thin film
KR970003907B1 (ko) * 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
JPH0443634A (ja) * 1990-06-11 1992-02-13 Fujitsu Ltd 半導体製造装置
US5171393A (en) * 1991-07-29 1992-12-15 Moffat William A Wafer processing apparatus
JPH0669190A (ja) 1992-08-21 1994-03-11 Fujitsu Ltd フッ素系樹脂膜の形成方法
TW301037B (ja) * 1993-11-19 1997-03-21 Sony Co Ltd
JP3033009B2 (ja) * 1994-09-09 2000-04-17 東京エレクトロン株式会社 処理装置
US5620560A (en) * 1994-10-05 1997-04-15 Tokyo Electron Limited Method and apparatus for heat-treating substrate
US5511608A (en) * 1995-01-04 1996-04-30 Boyd; Trace L. Clampless vacuum heat transfer station
JPH0964176A (ja) 1995-08-21 1997-03-07 Oki Electric Ind Co Ltd 半導体素子の製造方法
JP3571471B2 (ja) 1996-09-03 2004-09-29 東京エレクトロン株式会社 処理方法，塗布現像処理システム及び処理システム
TW466579B (en) * 1996-11-01 2001-12-01 Tokyo Electron Ltd Method and apparatus for processing substrate
JP3693783B2 (ja) * 1997-03-21 2005-09-07 大日本スクリーン製造株式会社 基板処理装置
TW459266B (en) * 1997-08-27 2001-10-11 Tokyo Electron Ltd Substrate processing method
JPH1195442A (ja) 1997-09-24 1999-04-09 Sharp Corp フォトレジストパターン形成方法
US6248168B1 (en) * 1997-12-15 2001-06-19 Tokyo Electron Limited Spin coating apparatus including aging unit and solvent replacement unit
US6176932B1 (en) * 1998-02-16 2001-01-23 Anelva Corporation Thin film deposition apparatus
JP3630563B2 (ja) * 1998-07-23 2005-03-16 大日本スクリーン製造株式会社 基板熱処理方法およびその装置
TW428216B (en) * 1998-07-29 2001-04-01 Tokyo Electron Ltd Substrate process method and substrate process apparatus
JP2000056474A (ja) * 1998-08-05 2000-02-25 Tokyo Electron Ltd 基板処理方法
US6258220B1 (en) * 1998-11-30 2001-07-10 Applied Materials, Inc. Electro-chemical deposition system
JP3648129B2 (ja) * 2000-05-10 2005-05-18 東京エレクトロン株式会社 塗布現像処理方法及び塗布現像処理システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0415412A2 (en) * 1989-08-30 1991-03-06 Kabushiki Kaisha Toshiba Resist pattern fabrication method
US6162591A (en) * 1998-09-01 2000-12-19 Industrial Technology Research Institute Photolithography process with gas-phase pretreatment

Also Published As

Publication number Publication date
CN1322969A (zh) 2001-11-21
JP3648129B2 (ja) 2005-05-18
US6884298B2 (en) 2005-04-26
TWI227507B (en) 2005-02-01
CN1218221C (zh) 2005-09-07
US20020006737A1 (en) 2002-01-17
KR100697939B1 (ko) 2007-03-20
US6518199B2 (en) 2003-02-11
US20030079687A1 (en) 2003-05-01
JP2001319862A (ja) 2001-11-16
KR20010103664A (ko) 2001-11-23
US20030119333A1 (en) 2003-06-26

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