SG106149A1 - Insulation material for aluminum and copper metalizations - Google Patents
Insulation material for aluminum and copper metalizationsInfo
- Publication number
- SG106149A1 SG106149A1 SG200303514A SG200303514A SG106149A1 SG 106149 A1 SG106149 A1 SG 106149A1 SG 200303514 A SG200303514 A SG 200303514A SG 200303514 A SG200303514 A SG 200303514A SG 106149 A1 SG106149 A1 SG 106149A1
- Authority
- SG
- Singapore
- Prior art keywords
- metalizations
- copper
- aluminum
- insulation material
- insulation
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/32—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from aromatic diamines and aromatic dicarboxylic acids with both amino and carboxylic groups aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/22—Polybenzoxazoles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polyamides (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002128769 DE10228769A1 (de) | 2002-06-27 | 2002-06-27 | Isoliermaterial für Aluminium und Kupfermetallisierungen |
Publications (1)
Publication Number | Publication Date |
---|---|
SG106149A1 true SG106149A1 (en) | 2004-09-30 |
Family
ID=29716687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200303514A SG106149A1 (en) | 2002-06-27 | 2003-06-25 | Insulation material for aluminum and copper metalizations |
Country Status (7)
Country | Link |
---|---|
US (1) | US7244803B2 (zh) |
EP (1) | EP1375563B1 (zh) |
JP (1) | JP3779285B2 (zh) |
KR (1) | KR100573674B1 (zh) |
CN (1) | CN100577642C (zh) |
DE (2) | DE10228769A1 (zh) |
SG (1) | SG106149A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100624407B1 (ko) * | 2003-01-02 | 2006-09-18 | 삼성에스디아이 주식회사 | 디페닐안트라센 유도체 및 이를 채용한 유기 전계 발광 소자 |
TWI341554B (en) * | 2007-08-02 | 2011-05-01 | Enthone | Copper metallization of through silicon via |
CN104513391B (zh) * | 2013-09-30 | 2017-02-15 | 北京大学 | 含烯丙氧基芳香族聚酰胺树脂及其制备方法与应用 |
CN104513392B (zh) * | 2013-09-30 | 2016-09-07 | 北京大学 | 含羟基和烯丙基芳香族聚酰胺树脂及其制备方法与应用 |
KR101788093B1 (ko) * | 2014-03-19 | 2017-10-19 | 제일모직 주식회사 | 모노머, 상기 모노머를 포함하는 하드마스크 조성물 및 상기 하드마스크 조성물을 사용하는 패턴형성방법 |
US9905457B2 (en) * | 2014-12-26 | 2018-02-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | High boiling temperature solvent additives for semiconductor processing |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0765894A2 (de) * | 1995-08-31 | 1997-04-02 | Siemens Aktiengesellschaft | Herstellung von Poly-o-hydroxyamiden und Poly-o-mercaptoamiden |
DE10147927C1 (de) * | 2001-09-28 | 2003-03-06 | Infineon Technologies Ag | Poly-o-hyodroxyamide, Polybenzoxazole, elektronisches Bauteil sowie Verfahren zu ihrer Herstellung |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW502135B (en) * | 1996-05-13 | 2002-09-11 | Sumitomo Bakelite Co | Positive type photosensitive resin composition and process for preparing polybenzoxazole resin film by using the same |
US20030064568A1 (en) * | 1998-08-25 | 2003-04-03 | Benoit Giffard | Device comprising electronic components in regions of a layer of semiconducting material insulated from each other and manufacturing process for such a device |
JP2000128984A (ja) * | 1998-10-28 | 2000-05-09 | Sumitomo Bakelite Co Ltd | ポリベンゾオキサゾール前駆体及び樹脂 |
DE10011604A1 (de) * | 2000-03-10 | 2001-10-04 | Infineon Technologies Ag | Polybenzoxazol-Vorstufen |
DE10011608A1 (de) | 2000-03-10 | 2001-10-18 | Infineon Technologies Ag | Bis-o-aminophenole und o-Aminophenolcarbonsäuren |
JP2004018593A (ja) | 2002-06-13 | 2004-01-22 | Hitachi Chemical Dupont Microsystems Ltd | ポリベンゾオキサゾール前駆体、感光性樹脂組成物及び電子部品 |
DE10228770A1 (de) | 2002-06-27 | 2004-02-12 | Infineon Technologies Ag | Dielektrikum mit Sperrwirkung gegen Kupferdiffusion |
-
2002
- 2002-06-27 DE DE2002128769 patent/DE10228769A1/de not_active Withdrawn
-
2003
- 2003-06-24 EP EP03014160A patent/EP1375563B1/de not_active Expired - Fee Related
- 2003-06-24 DE DE50300404T patent/DE50300404D1/de not_active Expired - Lifetime
- 2003-06-25 SG SG200303514A patent/SG106149A1/en unknown
- 2003-06-26 KR KR1020030042132A patent/KR100573674B1/ko not_active IP Right Cessation
- 2003-06-27 US US10/609,453 patent/US7244803B2/en not_active Expired - Fee Related
- 2003-06-27 JP JP2003184081A patent/JP3779285B2/ja not_active Expired - Fee Related
- 2003-06-27 CN CN03145750A patent/CN100577642C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0765894A2 (de) * | 1995-08-31 | 1997-04-02 | Siemens Aktiengesellschaft | Herstellung von Poly-o-hydroxyamiden und Poly-o-mercaptoamiden |
DE10147927C1 (de) * | 2001-09-28 | 2003-03-06 | Infineon Technologies Ag | Poly-o-hyodroxyamide, Polybenzoxazole, elektronisches Bauteil sowie Verfahren zu ihrer Herstellung |
US20030176623A1 (en) * | 2001-09-28 | 2003-09-18 | Klaus Lowack | Poly-o-hydroxyamides, polybenzoxazoles, processes for producing poly-o-hydroxyamides, processes for producing polybenzoxazoles, dielectrics including a polybenzoxazole, electronic components including the dielectrics, and processes for manufacturing the electronic components |
Also Published As
Publication number | Publication date |
---|---|
JP2004099873A (ja) | 2004-04-02 |
JP3779285B2 (ja) | 2006-05-24 |
DE50300404D1 (de) | 2005-05-04 |
EP1375563A1 (de) | 2004-01-02 |
US7244803B2 (en) | 2007-07-17 |
CN1472195A (zh) | 2004-02-04 |
US20040082756A1 (en) | 2004-04-29 |
DE10228769A1 (de) | 2004-02-05 |
KR100573674B1 (ko) | 2006-04-25 |
KR20040002754A (ko) | 2004-01-07 |
EP1375563B1 (de) | 2005-03-30 |
CN100577642C (zh) | 2010-01-06 |
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