SG106149A1 - Insulation material for aluminum and copper metalizations - Google Patents

Insulation material for aluminum and copper metalizations

Info

Publication number
SG106149A1
SG106149A1 SG200303514A SG200303514A SG106149A1 SG 106149 A1 SG106149 A1 SG 106149A1 SG 200303514 A SG200303514 A SG 200303514A SG 200303514 A SG200303514 A SG 200303514A SG 106149 A1 SG106149 A1 SG 106149A1
Authority
SG
Singapore
Prior art keywords
metalizations
copper
aluminum
insulation material
insulation
Prior art date
Application number
SG200303514A
Other languages
English (en)
Inventor
Sezi Recai
Walter Andreas
Maltenberger Anna
Lowack Klaus
Halik Marcus
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of SG106149A1 publication Critical patent/SG106149A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/32—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from aromatic diamines and aromatic dicarboxylic acids with both amino and carboxylic groups aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Organic Insulating Materials (AREA)
  • Polyamides (AREA)
SG200303514A 2002-06-27 2003-06-25 Insulation material for aluminum and copper metalizations SG106149A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2002128769 DE10228769A1 (de) 2002-06-27 2002-06-27 Isoliermaterial für Aluminium und Kupfermetallisierungen

Publications (1)

Publication Number Publication Date
SG106149A1 true SG106149A1 (en) 2004-09-30

Family

ID=29716687

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200303514A SG106149A1 (en) 2002-06-27 2003-06-25 Insulation material for aluminum and copper metalizations

Country Status (7)

Country Link
US (1) US7244803B2 (ko)
EP (1) EP1375563B1 (ko)
JP (1) JP3779285B2 (ko)
KR (1) KR100573674B1 (ko)
CN (1) CN100577642C (ko)
DE (2) DE10228769A1 (ko)
SG (1) SG106149A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100624407B1 (ko) * 2003-01-02 2006-09-18 삼성에스디아이 주식회사 디페닐안트라센 유도체 및 이를 채용한 유기 전계 발광 소자
TWI341554B (en) * 2007-08-02 2011-05-01 Enthone Copper metallization of through silicon via
CN104513391B (zh) * 2013-09-30 2017-02-15 北京大学 含烯丙氧基芳香族聚酰胺树脂及其制备方法与应用
CN104513392B (zh) * 2013-09-30 2016-09-07 北京大学 含羟基和烯丙基芳香族聚酰胺树脂及其制备方法与应用
KR101788093B1 (ko) * 2014-03-19 2017-10-19 제일모직 주식회사 모노머, 상기 모노머를 포함하는 하드마스크 조성물 및 상기 하드마스크 조성물을 사용하는 패턴형성방법
US9905457B2 (en) * 2014-12-26 2018-02-27 Taiwan Semiconductor Manufacturing Company, Ltd. High boiling temperature solvent additives for semiconductor processing

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0765894A2 (de) * 1995-08-31 1997-04-02 Siemens Aktiengesellschaft Herstellung von Poly-o-hydroxyamiden und Poly-o-mercaptoamiden
DE10147927C1 (de) * 2001-09-28 2003-03-06 Infineon Technologies Ag Poly-o-hyodroxyamide, Polybenzoxazole, elektronisches Bauteil sowie Verfahren zu ihrer Herstellung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW502135B (en) * 1996-05-13 2002-09-11 Sumitomo Bakelite Co Positive type photosensitive resin composition and process for preparing polybenzoxazole resin film by using the same
US20030064568A1 (en) * 1998-08-25 2003-04-03 Benoit Giffard Device comprising electronic components in regions of a layer of semiconducting material insulated from each other and manufacturing process for such a device
JP2000128984A (ja) * 1998-10-28 2000-05-09 Sumitomo Bakelite Co Ltd ポリベンゾオキサゾール前駆体及び樹脂
DE10011608A1 (de) * 2000-03-10 2001-10-18 Infineon Technologies Ag Bis-o-aminophenole und o-Aminophenolcarbonsäuren
DE10011604A1 (de) * 2000-03-10 2001-10-04 Infineon Technologies Ag Polybenzoxazol-Vorstufen
JP2004018593A (ja) 2002-06-13 2004-01-22 Hitachi Chemical Dupont Microsystems Ltd ポリベンゾオキサゾール前駆体、感光性樹脂組成物及び電子部品
DE10228770A1 (de) * 2002-06-27 2004-02-12 Infineon Technologies Ag Dielektrikum mit Sperrwirkung gegen Kupferdiffusion

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0765894A2 (de) * 1995-08-31 1997-04-02 Siemens Aktiengesellschaft Herstellung von Poly-o-hydroxyamiden und Poly-o-mercaptoamiden
DE10147927C1 (de) * 2001-09-28 2003-03-06 Infineon Technologies Ag Poly-o-hyodroxyamide, Polybenzoxazole, elektronisches Bauteil sowie Verfahren zu ihrer Herstellung
US20030176623A1 (en) * 2001-09-28 2003-09-18 Klaus Lowack Poly-o-hydroxyamides, polybenzoxazoles, processes for producing poly-o-hydroxyamides, processes for producing polybenzoxazoles, dielectrics including a polybenzoxazole, electronic components including the dielectrics, and processes for manufacturing the electronic components

Also Published As

Publication number Publication date
KR20040002754A (ko) 2004-01-07
JP2004099873A (ja) 2004-04-02
US7244803B2 (en) 2007-07-17
DE50300404D1 (de) 2005-05-04
EP1375563A1 (de) 2004-01-02
EP1375563B1 (de) 2005-03-30
US20040082756A1 (en) 2004-04-29
JP3779285B2 (ja) 2006-05-24
CN1472195A (zh) 2004-02-04
KR100573674B1 (ko) 2006-04-25
DE10228769A1 (de) 2004-02-05
CN100577642C (zh) 2010-01-06

Similar Documents

Publication Publication Date Title
EP1578597A4 (en) COVERING FOR INSULATION AND OTHER APPLICATIONS
AU2003216453A8 (en) Insulating material
IL156107A0 (en) Low dielectric materials and methods for making same
EP1643180A4 (en) THERMAL INSULATION MATERIAL AND EQUIPMENT USING THE SAME
TW537436U (en) Three-phase variable heat conducting structure
GB0601627D0 (en) Composite copper material
HK1056906A1 (en) Thermosiphon
AU2003288566A8 (en) Deformable-mirror cooling
GB0208808D0 (en) Cooling electrical equipment
GB2395664B (en) Thermal compress
SG106149A1 (en) Insulation material for aluminum and copper metalizations
AU2003269098A1 (en) Insulating material
SG122789A1 (en) Monomers for insulation materials in aluminum and copper technologies
EP1492906B8 (en) Transfer and insulation device for electrolysis
GB0207555D0 (en) Interlocking insulation
GB2407797B (en) Heat insulating material
AU2003289174A8 (en) Cold insulation bag
GB0201205D0 (en) Insulating material
GB0213405D0 (en) Thermal insulation material
GB2395254B (en) Cooling apparatus
AU2003201736A8 (en) Materials and methods for forming hybrid organic-inorganic dielectric materials
AU2003268952A1 (en) Aluminium dross cooling method and installation
PL358976A1 (en) Electric box
GB0211291D0 (en) "Insu-corr" aluminium and corrugated insulation material
TW577260U (en) Electric noodlemaker