SG103332A1 - Mechanism opening and closing a die of a resin seal apparatus - Google Patents

Mechanism opening and closing a die of a resin seal apparatus

Info

Publication number
SG103332A1
SG103332A1 SG200200309A SG200200309A SG103332A1 SG 103332 A1 SG103332 A1 SG 103332A1 SG 200200309 A SG200200309 A SG 200200309A SG 200200309 A SG200200309 A SG 200200309A SG 103332 A1 SG103332 A1 SG 103332A1
Authority
SG
Singapore
Prior art keywords
die
closing
seal apparatus
resin seal
mechanism opening
Prior art date
Application number
SG200200309A
Other languages
English (en)
Inventor
Amakawa Tsuyoshi
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG103332A1 publication Critical patent/SG103332A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008—Inserting articles into the mould
    • B29C45/14016—Intermittently feeding endless articles, e.g. transfer films, to the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • B29C45/661—Mould opening, closing or clamping devices mechanical using a toggle mechanism for mould clamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG200200309A 2001-01-30 2002-01-16 Mechanism opening and closing a die of a resin seal apparatus SG103332A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001020862A JP2002231740A (ja) 2001-01-30 2001-01-30 樹脂封止装置の型開閉機構

Publications (1)

Publication Number Publication Date
SG103332A1 true SG103332A1 (en) 2004-04-29

Family

ID=18886508

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200200309A SG103332A1 (en) 2001-01-30 2002-01-16 Mechanism opening and closing a die of a resin seal apparatus

Country Status (6)

Country Link
EP (1) EP1226921A3 (zh)
JP (1) JP2002231740A (zh)
KR (1) KR100451959B1 (zh)
CN (1) CN1197695C (zh)
SG (1) SG103332A1 (zh)
TW (1) TW580423B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1689050A1 (en) * 2005-02-04 2006-08-09 Meioukasei Co., Ltd. Method and apparatus for terminal row insert molding
CN101237977B (zh) * 2005-08-04 2011-01-12 雅玛托卡阔株式会社 热硬化性树脂成型制品的制造方法及装置
CN101456241B (zh) * 2007-12-14 2013-07-17 深圳市裕鼎精密工业科技有限公司 注塑机
US8033817B2 (en) 2009-08-26 2011-10-11 National Sun Yat-Sen University Of Kaohsiung Multi-rod mechanism for linearly actuating for opening and closing a mold device
CN102009441B (zh) * 2009-09-04 2013-08-14 国立中山大学 多连杆直线带动模具开闭机构
JP6430143B2 (ja) * 2014-04-30 2018-11-28 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法並びに成形製品の製造方法
CN104589590A (zh) * 2014-12-31 2015-05-06 苏州市博奥塑胶电子有限公司 一种注塑机用升降注塑模具
CN104966795B (zh) * 2015-07-03 2017-06-13 苏州昌飞自动化设备厂 圆柱电池封装机的下模机构
CN104934617B (zh) * 2015-07-03 2017-03-08 苏州昌飞自动化设备厂 圆柱电池封装机的下模封装组件

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4755124A (en) * 1985-02-13 1988-07-05 Mitsubishi Denki Kabushiki Kaisha Plastic molding device for a semiconductor element
EP0655323B1 (en) * 1989-11-24 2000-04-19 Fico B.V. Single strip moulding apparatus with means for exerting pressure
DE4032659A1 (de) * 1990-10-15 1992-04-16 Kautex Maschinenbau Gmbh Verfahren und vorrichtung zur herstellung von hohlkoerpern aus thermoplastischen kunststoff
JPH07135232A (ja) * 1993-11-11 1995-05-23 Toshiba Corp 半導体モールド装置
US5478517A (en) * 1994-02-28 1995-12-26 Gennum Corporation Method for molding IC chips
JP3561003B2 (ja) * 1994-06-21 2004-09-02 ローム株式会社 フープ状リードフレームの搬送・位置決め方法、およびその装置
JPH09164530A (ja) * 1995-12-13 1997-06-24 Tsukuba Seiko Kk 封止成形装置
KR100239384B1 (ko) * 1997-08-14 2000-01-15 김규현 반도체 패키지 제조용 몰딩프레스의 몰드다이 결합구조
KR20010058866A (ko) * 1999-12-30 2001-07-06 박종섭 반도체 몰딩 장비의 프레스부 구동장치
JP3423912B2 (ja) * 2000-02-10 2003-07-07 Ｔｏｗａ株式会社 電子部品、電子部品の樹脂封止方法、及び樹脂封止装置

Also Published As

Publication number Publication date
EP1226921A3 (en) 2002-08-21
KR100451959B1 (ko) 2004-10-08
EP1226921A2 (en) 2002-07-31
CN1197695C (zh) 2005-04-20
KR20020063810A (ko) 2002-08-05
JP2002231740A (ja) 2002-08-16
TW580423B (en) 2004-03-21
CN1369365A (zh) 2002-09-18

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