SG10202101800TA - Substrate support and plasma processing apparatus - Google Patents
Substrate support and plasma processing apparatusInfo
- Publication number
- SG10202101800TA SG10202101800TA SG10202101800TA SG10202101800TA SG 10202101800T A SG10202101800T A SG 10202101800TA SG 10202101800T A SG10202101800T A SG 10202101800TA SG 10202101800T A SG10202101800T A SG 10202101800TA
- Authority
- SG
- Singapore
- Prior art keywords
- electrode
- region
- plasma processing
- processing apparatus
- electrical bias
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32146—Amplitude modulation, includes pulsing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2007—Holding mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020054019A JP7450427B2 (ja) | 2020-03-25 | 2020-03-25 | 基板支持器及びプラズマ処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10202101800TA true SG10202101800TA (en) | 2021-10-28 |
Family
ID=77808922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10202101800T SG10202101800TA (en) | 2020-03-25 | 2021-02-23 | Substrate support and plasma processing apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US11935729B2 (https=) |
| JP (5) | JP7450427B2 (https=) |
| KR (3) | KR102864932B1 (https=) |
| CN (1) | CN113451095A (https=) |
| SG (1) | SG10202101800TA (https=) |
| TW (3) | TWI857215B (https=) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7344821B2 (ja) * | 2020-03-17 | 2023-09-14 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7450427B2 (ja) | 2020-03-25 | 2024-03-15 | 東京エレクトロン株式会社 | 基板支持器及びプラズマ処理装置 |
| JP7462803B2 (ja) * | 2021-01-29 | 2024-04-05 | 東京エレクトロン株式会社 | プラズマ処理装置及びソース高周波電力のソース周波数を制御する方法 |
| US12400845B2 (en) * | 2021-11-29 | 2025-08-26 | Applied Materials, Inc. | Ion energy control on electrodes in a plasma reactor |
| JP7740979B2 (ja) * | 2021-12-13 | 2025-09-17 | 東京エレクトロン株式会社 | プラズマ処理装置及び電位制御方法 |
| JP7823461B2 (ja) * | 2022-03-29 | 2026-03-04 | 住友大阪セメント株式会社 | 静電チャック装置 |
| KR20250011133A (ko) * | 2022-05-19 | 2025-01-21 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 장치 |
| JP2024022859A (ja) * | 2022-08-08 | 2024-02-21 | 東京エレクトロン株式会社 | プラズマ処理装置及び静電チャック |
| KR20250051704A (ko) | 2022-08-16 | 2025-04-17 | 도쿄엘렉트론가부시키가이샤 | 플라스마 처리 장치 및 정전 척 |
| JP2024094874A (ja) * | 2022-12-28 | 2024-07-10 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP2024105999A (ja) * | 2023-01-26 | 2024-08-07 | 東京エレクトロン株式会社 | 基板処理装置及び基板支持部 |
| JP7768914B2 (ja) * | 2023-01-31 | 2025-11-12 | 東京エレクトロン株式会社 | プラズマ処理装置、静電チャック及びプラズマ処理方法 |
| CN120642034A (zh) * | 2023-02-14 | 2025-09-12 | 东京毅力科创株式会社 | 等离子体处理装置 |
| KR102903412B1 (ko) * | 2023-03-27 | 2025-12-24 | 토토 가부시키가이샤 | 정전 척 |
| CN121359625A (zh) * | 2023-06-27 | 2026-01-16 | 东京毅力科创株式会社 | 等离子体处理装置和电位控制方法 |
| JP2025004870A (ja) | 2023-06-27 | 2025-01-16 | 東京エレクトロン株式会社 | 基板支持器及びプラズマ処理装置 |
| US20250201538A1 (en) * | 2023-12-18 | 2025-06-19 | Applied Materials, Inc. | Esc design with enhanced tunability for wafer far edge plasma profile control |
| WO2025169740A1 (ja) * | 2024-02-05 | 2025-08-14 | 東京エレクトロン株式会社 | プラズマ処理装置、電源システム、制御方法、及びプログラム |
| WO2025187456A1 (ja) * | 2024-03-07 | 2025-09-12 | 東京エレクトロン株式会社 | プラズマ処理装置、バイアス電源システム、及びプラズマ処理方法 |
| TW202604195A (zh) * | 2024-03-07 | 2026-01-16 | 日商東京威力科創股份有限公司 | 電漿處理裝置、偏壓電源系統、及電漿處理方法 |
| JP7765772B1 (ja) * | 2024-05-13 | 2025-11-07 | 東京エレクトロン株式会社 | プラズマ処理装置及び基板支持器 |
| WO2025238994A1 (ja) * | 2024-05-13 | 2025-11-20 | 東京エレクトロン株式会社 | プラズマ処理装置及び基板支持器 |
| WO2026004597A1 (ja) * | 2024-06-25 | 2026-01-02 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| WO2026042553A1 (ja) * | 2024-08-19 | 2026-02-26 | 東京エレクトロン株式会社 | プラズマ処理装置及び電源システム |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6081414A (en) * | 1998-05-01 | 2000-06-27 | Applied Materials, Inc. | Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system |
| KR20000001982A (ko) * | 1998-06-16 | 2000-01-15 | 김영환 | 반도체 웨이퍼 식각장비의 듀얼바이어스정전척 |
| JP2000183038A (ja) | 1998-12-14 | 2000-06-30 | Hitachi Ltd | プラズマ処理装置 |
| JP4436575B2 (ja) | 2001-01-31 | 2010-03-24 | 京セラ株式会社 | ウエハ支持部材及びその製造方法 |
| JP2003124298A (ja) * | 2001-10-17 | 2003-04-25 | Anelva Corp | プラズマ支援ウェハー処理反応容器の二重静電チャックウェハーステージ |
| US20040261946A1 (en) * | 2003-04-24 | 2004-12-30 | Tokyo Electron Limited | Plasma processing apparatus, focus ring, and susceptor |
| JP4547182B2 (ja) | 2003-04-24 | 2010-09-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP4566789B2 (ja) | 2005-03-07 | 2010-10-20 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法およびプラズマ処理装置 |
| JP4833890B2 (ja) | 2007-03-12 | 2011-12-07 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ分布補正方法 |
| JP5160802B2 (ja) | 2007-03-27 | 2013-03-13 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US20100018648A1 (en) | 2008-07-23 | 2010-01-28 | Applied Marterials, Inc. | Workpiece support for a plasma reactor with controlled apportionment of rf power to a process kit ring |
| JP5371466B2 (ja) | 2009-02-12 | 2013-12-18 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法 |
| JP5496568B2 (ja) * | 2009-08-04 | 2014-05-21 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP5960384B2 (ja) * | 2009-10-26 | 2016-08-02 | 新光電気工業株式会社 | 静電チャック用基板及び静電チャック |
| JP2011228436A (ja) | 2010-04-19 | 2011-11-10 | Hitachi High-Technologies Corp | プラズマ処理装置およびプラズマ処理方法 |
| JP5896595B2 (ja) * | 2010-10-20 | 2016-03-30 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | ２層ｒｆ構造のウエハ保持体 |
| KR101413898B1 (ko) | 2012-11-06 | 2014-06-30 | 엔지케이 인슐레이터 엘티디 | 서셉터 |
| JP6552346B2 (ja) * | 2015-09-04 | 2019-07-31 | 東京エレクトロン株式会社 | 基板処理装置 |
| US10685862B2 (en) | 2016-01-22 | 2020-06-16 | Applied Materials, Inc. | Controlling the RF amplitude of an edge ring of a capacitively coupled plasma process device |
| US10665433B2 (en) | 2016-09-19 | 2020-05-26 | Varian Semiconductor Equipment Associates, Inc. | Extreme edge uniformity control |
| JP6869034B2 (ja) | 2017-01-17 | 2021-05-12 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US10763081B2 (en) | 2017-07-10 | 2020-09-01 | Applied Materials, Inc. | Apparatus and methods for manipulating radio frequency power at an edge ring in plasma process device |
| JP7045152B2 (ja) | 2017-08-18 | 2022-03-31 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| US10510575B2 (en) | 2017-09-20 | 2019-12-17 | Applied Materials, Inc. | Substrate support with multiple embedded electrodes |
| CN110770891B (zh) | 2017-10-30 | 2023-04-07 | 日本碍子株式会社 | 静电卡盘及其制法 |
| WO2019088204A1 (ja) | 2017-11-06 | 2019-05-09 | 日本碍子株式会社 | 静電チャックアセンブリ、静電チャック及びフォーカスリング |
| US11848177B2 (en) | 2018-02-23 | 2023-12-19 | Lam Research Corporation | Multi-plate electrostatic chucks with ceramic baseplates |
| JP7061922B2 (ja) | 2018-04-27 | 2022-05-02 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| KR102600003B1 (ko) | 2018-10-30 | 2023-11-09 | 삼성전자주식회사 | 반도체 공정 챔버 및 반도체 소자의 제조 방법 |
| US11289310B2 (en) * | 2018-11-21 | 2022-03-29 | Applied Materials, Inc. | Circuits for edge ring control in shaped DC pulsed plasma process device |
| US11562887B2 (en) | 2018-12-10 | 2023-01-24 | Tokyo Electron Limited | Plasma processing apparatus and etching method |
| US11955314B2 (en) | 2019-01-09 | 2024-04-09 | Tokyo Electron Limited | Plasma processing apparatus |
| JP7271330B2 (ja) | 2019-06-18 | 2023-05-11 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
| JP7474651B2 (ja) | 2019-09-09 | 2024-04-25 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP7411463B2 (ja) | 2020-03-17 | 2024-01-11 | 東京エレクトロン株式会社 | 検査方法及び検査装置 |
| US11551916B2 (en) * | 2020-03-20 | 2023-01-10 | Applied Materials, Inc. | Sheath and temperature control of a process kit in a substrate processing chamber |
| JP7450427B2 (ja) | 2020-03-25 | 2024-03-15 | 東京エレクトロン株式会社 | 基板支持器及びプラズマ処理装置 |
| JP7458287B2 (ja) | 2020-10-06 | 2024-03-29 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP7638930B2 (ja) | 2021-05-31 | 2025-03-04 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| KR20230023571A (ko) | 2021-08-10 | 2023-02-17 | 도쿄엘렉트론가부시키가이샤 | 플라스마 처리 장치 및 플라스마 처리 방법 |
-
2020
- 2020-03-25 JP JP2020054019A patent/JP7450427B2/ja active Active
-
2021
- 2021-02-23 SG SG10202101800T patent/SG10202101800TA/en unknown
- 2021-02-26 TW TW110106942A patent/TWI857215B/zh active
- 2021-02-26 TW TW114113710A patent/TW202531486A/zh unknown
- 2021-02-26 TW TW113130245A patent/TWI887081B/zh active
- 2021-03-01 CN CN202110226313.9A patent/CN113451095A/zh active Pending
- 2021-03-02 KR KR1020210027728A patent/KR102864932B1/ko active Active
- 2021-03-02 US US17/190,178 patent/US11935729B2/en active Active
-
2023
- 2023-11-15 JP JP2023194441A patent/JP7538935B2/ja active Active
- 2023-11-15 JP JP2023194450A patent/JP7519525B2/ja active Active
-
2024
- 2024-02-20 US US18/582,329 patent/US12293903B2/en active Active
- 2024-02-20 US US18/582,163 patent/US20240194457A1/en not_active Abandoned
- 2024-07-10 KR KR1020240091189A patent/KR102719832B1/ko active Active
- 2024-08-09 JP JP2024134088A patent/JP7763304B2/ja active Active
- 2024-12-23 US US18/999,446 patent/US20250132136A1/en active Pending
-
2025
- 2025-08-08 KR KR1020250109697A patent/KR20250127005A/ko active Pending
- 2025-10-15 JP JP2025173456A patent/JP2025188223A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240113731A (ko) | 2024-07-23 |
| TWI857215B (zh) | 2024-10-01 |
| KR102864932B1 (ko) | 2025-09-26 |
| JP2024012608A (ja) | 2024-01-30 |
| US11935729B2 (en) | 2024-03-19 |
| JP2021158134A (ja) | 2021-10-07 |
| TWI887081B (zh) | 2025-06-11 |
| JP7450427B2 (ja) | 2024-03-15 |
| KR20250127005A (ko) | 2025-08-26 |
| TW202449977A (zh) | 2024-12-16 |
| US20240194457A1 (en) | 2024-06-13 |
| KR102719832B1 (ko) | 2024-10-22 |
| TW202531486A (zh) | 2025-08-01 |
| JP7538935B2 (ja) | 2024-08-22 |
| US20210305025A1 (en) | 2021-09-30 |
| JP2025188223A (ja) | 2025-12-25 |
| US20240194458A1 (en) | 2024-06-13 |
| JP7763304B2 (ja) | 2025-10-31 |
| US20250132136A1 (en) | 2025-04-24 |
| JP2024012609A (ja) | 2024-01-30 |
| CN113451095A (zh) | 2021-09-28 |
| TW202205513A (zh) | 2022-02-01 |
| JP2024160333A (ja) | 2024-11-13 |
| KR20210119879A (ko) | 2021-10-06 |
| JP7519525B2 (ja) | 2024-07-19 |
| US12293903B2 (en) | 2025-05-06 |
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