SG10202004110TA - Nonvolatile memory device, storage device, and operating method of nonvolatile memory device - Google Patents
Nonvolatile memory device, storage device, and operating method of nonvolatile memory deviceInfo
- Publication number
- SG10202004110TA SG10202004110TA SG10202004110TA SG10202004110TA SG10202004110TA SG 10202004110T A SG10202004110T A SG 10202004110TA SG 10202004110T A SG10202004110T A SG 10202004110TA SG 10202004110T A SG10202004110T A SG 10202004110TA SG 10202004110T A SG10202004110T A SG 10202004110TA
- Authority
- SG
- Singapore
- Prior art keywords
- nonvolatile memory
- memory device
- operating method
- storage device
- storage
- Prior art date
Links
- 238000011017 operating method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F12/00—Accessing, addressing or allocating within memory systems or architectures
- G06F12/02—Addressing or allocation; Relocation
- G06F12/08—Addressing or allocation; Relocation in hierarchically structured memory systems, e.g. virtual memory systems
- G06F12/0802—Addressing of a memory level in which the access to the desired data or data block requires associative addressing means, e.g. caches
- G06F12/0877—Cache access modes
- G06F12/0882—Page mode
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5621—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge storage in a floating gate
- G11C11/5628—Programming or writing circuits; Data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0441—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing multiple floating gate devices, e.g. separate read-and-write FAMOS transistors with connected floating gates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/24—Bit-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3418—Disturbance prevention or evaluation; Refreshing of disturbed memory data
- G11C16/3427—Circuits or methods to prevent or reduce disturbance of the state of a memory cell when neighbouring cells are read or written
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3436—Arrangements for verifying correct programming or erasure
- G11C16/3454—Arrangements for verifying correct programming or for detecting overprogrammed cells
- G11C16/3459—Circuits or methods to verify correct programming of nonvolatile memory cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1051—Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
- G11C7/1057—Data output buffers, e.g. comprising level conversion circuits, circuits for adapting load
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1078—Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
- G11C7/1084—Data input buffers, e.g. comprising level conversion circuits, circuits for adapting load
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/22—Read-write [R-W] timing or clocking circuits; Read-write [R-W] control signal generators or management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C2211/56—Indexing scheme relating to G11C11/56 and sub-groups for features not covered by these groups
- G11C2211/562—Multilevel memory programming aspects
- G11C2211/5621—Multilevel programming verification
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Read Only Memory (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190104615A KR20210025162A (en) | 2019-08-26 | 2019-08-26 | Nonvolatile memory device, storage device, and operating method of nonvolatile memory device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202004110TA true SG10202004110TA (en) | 2021-03-30 |
Family
ID=74680019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202004110TA SG10202004110TA (en) | 2019-08-26 | 2020-05-05 | Nonvolatile memory device, storage device, and operating method of nonvolatile memory device |
Country Status (4)
Country | Link |
---|---|
US (1) | US11043274B2 (en) |
KR (1) | KR20210025162A (en) |
CN (1) | CN112435701A (en) |
SG (1) | SG10202004110TA (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10714166B2 (en) * | 2018-08-13 | 2020-07-14 | Micron Technology, Inc. | Apparatus and methods for decoding memory access addresses for access operations |
US11069415B2 (en) * | 2018-10-05 | 2021-07-20 | Samsung Electronics Co., Ltd. | Memory device including charge pump circuit |
US11158379B2 (en) * | 2019-08-26 | 2021-10-26 | Samsung Electronics Co., Ltd. | Nonvolatile memory device, storage device, and operating method of nonvolatile memory device |
US11985825B2 (en) | 2020-06-25 | 2024-05-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | 3D memory array contact structures |
US11532343B2 (en) * | 2020-06-26 | 2022-12-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory array including dummy regions |
US11716856B2 (en) | 2021-03-05 | 2023-08-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Three-dimensional memory device and method |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5376789B2 (en) | 2007-10-03 | 2013-12-25 | 株式会社東芝 | Nonvolatile semiconductor memory device and control method of nonvolatile semiconductor memory device |
KR101226685B1 (en) | 2007-11-08 | 2013-01-25 | 삼성전자주식회사 | Vertical type semiconductor device and Method of manufacturing the same |
KR101691092B1 (en) | 2010-08-26 | 2016-12-30 | 삼성전자주식회사 | Nonvolatile memory device, operating method thereof and memory system including the same |
US8553466B2 (en) | 2010-03-04 | 2013-10-08 | Samsung Electronics Co., Ltd. | Non-volatile memory device, erasing method thereof, and memory system including the same |
US9536970B2 (en) | 2010-03-26 | 2017-01-03 | Samsung Electronics Co., Ltd. | Three-dimensional semiconductor memory devices and methods of fabricating the same |
KR101682666B1 (en) | 2010-08-11 | 2016-12-07 | 삼성전자주식회사 | Nonvolatile memory devicwe, channel boosting method thereof, programming method thereof, and memory system having the same |
KR20120133232A (en) | 2011-05-31 | 2012-12-10 | 에스케이하이닉스 주식회사 | Flash memory device |
KR101891164B1 (en) | 2012-04-17 | 2018-08-23 | 삼성전자주식회사 | Flash memory device including program scheduler |
US9524773B2 (en) * | 2013-09-14 | 2016-12-20 | Peter Wung Lee | Multi-task concurrent/pipeline NAND operations on all planes |
JP2015176620A (en) | 2014-03-14 | 2015-10-05 | 株式会社東芝 | semiconductor memory device |
KR102179270B1 (en) * | 2014-07-23 | 2020-11-18 | 삼성전자주식회사 | Nonvolatile memory device and operating method thereof |
US9449987B1 (en) | 2015-08-21 | 2016-09-20 | Sandisk Technologies Llc | Three dimensional memory device with epitaxial semiconductor pedestal for peripheral transistors |
KR102435524B1 (en) * | 2015-10-21 | 2022-08-23 | 삼성전자주식회사 | Semiconductor memory device |
KR102289598B1 (en) | 2017-06-26 | 2021-08-18 | 삼성전자주식회사 | Non-volatile memory device and memory system including the same and program method thereof |
KR102462503B1 (en) * | 2017-11-27 | 2022-11-02 | 삼성전자주식회사 | Nonvolatile memory device having vertical structure and memory system including the same |
KR102261816B1 (en) | 2017-12-05 | 2021-06-07 | 삼성전자주식회사 | Non-volatile memory device improving data reliability and Operating method thereof |
-
2019
- 2019-08-26 KR KR1020190104615A patent/KR20210025162A/en active Search and Examination
-
2020
- 2020-04-17 US US16/851,622 patent/US11043274B2/en active Active
- 2020-05-05 SG SG10202004110TA patent/SG10202004110TA/en unknown
- 2020-08-07 CN CN202010788417.4A patent/CN112435701A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20210065805A1 (en) | 2021-03-04 |
KR20210025162A (en) | 2021-03-09 |
US11043274B2 (en) | 2021-06-22 |
CN112435701A (en) | 2021-03-02 |
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