SG10202002453XA - Substrate support with real time force and film stress control - Google Patents
Substrate support with real time force and film stress controlInfo
- Publication number
- SG10202002453XA SG10202002453XA SG10202002453XA SG10202002453XA SG10202002453XA SG 10202002453X A SG10202002453X A SG 10202002453XA SG 10202002453X A SG10202002453X A SG 10202002453XA SG 10202002453X A SG10202002453X A SG 10202002453XA SG 10202002453X A SG10202002453X A SG 10202002453XA
- Authority
- SG
- Singapore
- Prior art keywords
- real time
- substrate support
- stress control
- film stress
- time force
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/3299—Feedback systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/266—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light by interferometric means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/268—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light using optical fibres
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L11/00—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00
- G01L11/02—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00 by optical means
- G01L11/025—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00 by optical means using a pressure-sensitive optical fibre
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/852,485 US10879046B2 (en) | 2015-09-11 | 2015-09-11 | Substrate support with real time force and film stress control |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202002453XA true SG10202002453XA (en) | 2020-05-28 |
Family
ID=58237095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202002453XA SG10202002453XA (en) | 2015-09-11 | 2016-08-01 | Substrate support with real time force and film stress control |
Country Status (7)
Country | Link |
---|---|
US (3) | US10879046B2 (zh) |
JP (3) | JP6878413B2 (zh) |
KR (1) | KR20180041248A (zh) |
CN (3) | CN117976601A (zh) |
SG (1) | SG10202002453XA (zh) |
TW (3) | TWI729429B (zh) |
WO (1) | WO2017044201A1 (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102113453B1 (ko) * | 2016-06-03 | 2020-05-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 거리 모니터링 |
JP6457468B2 (ja) * | 2016-12-08 | 2019-01-23 | ファナック株式会社 | バリ取り装置 |
US10460916B2 (en) * | 2017-05-15 | 2019-10-29 | Applied Materials, Inc. | Real time monitoring with closed loop chucking force control |
US10704142B2 (en) * | 2017-07-27 | 2020-07-07 | Applied Materials, Inc. | Quick disconnect resistance temperature detector assembly for rotating pedestal |
US11114327B2 (en) * | 2017-08-29 | 2021-09-07 | Applied Materials, Inc. | ESC substrate support with chucking force control |
KR20190029365A (ko) * | 2017-09-12 | 2019-03-20 | 삼성전자주식회사 | 리프트 핀 조립체, 이를 갖는 기판 지지 유닛 및 기판 처리 장치 |
CN111989770A (zh) * | 2018-03-23 | 2020-11-24 | 应用材料公司 | 隔离的背侧氦输送系统 |
US10971352B2 (en) * | 2018-07-16 | 2021-04-06 | Taiwan Semiconductor Manufacturing Co., Ltd | Cleaning method and apparatus |
US10927461B2 (en) * | 2018-08-31 | 2021-02-23 | Applied Materials, Inc. | Gas diffuser support structure for reduced particle generation |
CN109129410B (zh) * | 2018-09-30 | 2021-07-27 | 重庆大学 | 夹爪为光纤Fabry-Perot干涉仪且可夹持力自传感的微夹钳 |
CN109231152B (zh) * | 2018-09-30 | 2020-06-16 | 重庆大学 | 利用光纤Fabry-Perot干涉仪测量夹持力和夹爪位移的微夹钳 |
JP7209515B2 (ja) * | 2018-11-27 | 2023-01-20 | 東京エレクトロン株式会社 | 基板保持機構および成膜装置 |
US20200234991A1 (en) * | 2019-01-21 | 2020-07-23 | Applied Materials, Inc. | Substrate carrier |
US11415463B2 (en) * | 2019-06-04 | 2022-08-16 | Applied Materials, Inc. | Contactless workpiece temperature sensor |
WO2022173720A1 (en) * | 2021-02-09 | 2022-08-18 | Fuse Energy Technologies Corp. | Adjustable probe for plasma diagnostics |
US11851761B2 (en) * | 2021-04-16 | 2023-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor processing tool |
CN116476193B (zh) * | 2023-03-24 | 2024-01-05 | 上海数造机电科技股份有限公司 | 基于静电吸附的陶瓷3d打印构建平台、方法及系统 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2616118B2 (ja) * | 1990-03-22 | 1997-06-04 | ソニー株式会社 | 低温処理方法及び低温処理装置 |
JP3042786B2 (ja) * | 1990-07-03 | 2000-05-22 | 株式会社日立製作所 | 真空内被処理物の温度測定方法並びに温度制御方法及び装置 |
JPH04193951A (ja) * | 1990-11-28 | 1992-07-14 | Tokyo Electron Ltd | 保持装置 |
JPH05129421A (ja) | 1991-11-07 | 1993-05-25 | Fujitsu Ltd | 静電チヤツク |
JPH06163674A (ja) | 1992-11-18 | 1994-06-10 | Hitachi Ltd | 試料保持装置のモニタ方法 |
JP3272137B2 (ja) | 1994-01-27 | 2002-04-08 | シチズン時計株式会社 | 液晶表示装置 |
JP3488334B2 (ja) | 1996-04-15 | 2004-01-19 | 京セラ株式会社 | 静電チャック |
JP2000031252A (ja) * | 1998-07-08 | 2000-01-28 | Mitsubishi Electric Corp | 静電チャックを備えた半導体製造装置および静電チャックからのウエハ離脱方法 |
JP4236329B2 (ja) * | 1999-04-15 | 2009-03-11 | 日本碍子株式会社 | プラズマ処理装置 |
JP4754757B2 (ja) * | 2000-03-30 | 2011-08-24 | 東京エレクトロン株式会社 | 基板のプラズマ処理を調節するための方法、プラズマ処理システム、及び、電極組体 |
JP2002009140A (ja) * | 2000-06-22 | 2002-01-11 | Mitsubishi Electric Corp | 静電チャック装置 |
US20020186934A1 (en) * | 2001-06-07 | 2002-12-12 | Hug Norman L. | Optical termination |
US6898064B1 (en) * | 2001-08-29 | 2005-05-24 | Lsi Logic Corporation | System and method for optimizing the electrostatic removal of a workpiece from a chuck |
KR20040000104A (ko) | 2002-06-24 | 2004-01-03 | 삼성전자주식회사 | 웨이퍼 감지 센서의 정렬장치 |
US6938505B2 (en) * | 2002-08-13 | 2005-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chamber wafer detection |
US7110122B2 (en) * | 2004-07-21 | 2006-09-19 | Hewlett-Packard Development Company, L.P. | Interferometer calibration methods and apparatus |
US7292428B2 (en) | 2005-04-26 | 2007-11-06 | Applied Materials, Inc. | Electrostatic chuck with smart lift-pin mechanism for a plasma reactor |
WO2007149733A2 (en) * | 2006-06-19 | 2007-12-27 | Baker Hughes Incorporated | Isolated sensor housing |
US7750818B2 (en) * | 2006-11-29 | 2010-07-06 | Adp Engineering Co., Ltd. | System and method for introducing a substrate into a process chamber |
KR101350145B1 (ko) | 2006-11-29 | 2014-01-09 | 엘아이지에이디피 주식회사 | 리프트 핀을 이용한 기판 유무 판별장치 및 이를 이용한기판 반입방법과 검사방법 |
US20090034581A1 (en) * | 2007-08-02 | 2009-02-05 | Tokyo Electron Limited | Method for hot plate substrate monitoring and control |
JP5484981B2 (ja) * | 2010-03-25 | 2014-05-07 | 東京エレクトロン株式会社 | 基板載置台及び基板処理装置 |
JP5871453B2 (ja) | 2010-05-20 | 2016-03-01 | 東京エレクトロン株式会社 | プラズマ処理装置,基板保持機構,基板位置ずれ検出方法 |
JP2011258756A (ja) | 2010-06-09 | 2011-12-22 | Ntn Corp | リフタユニットおよびパターン修正装置 |
EP2676106B1 (en) * | 2011-02-18 | 2015-05-06 | Parker-Hannifin Corporation | Optical sensor and mounting interface |
US9196514B2 (en) * | 2013-09-06 | 2015-11-24 | Applied Materials, Inc. | Electrostatic chuck with variable pixilated heating |
US9558981B2 (en) | 2013-11-19 | 2017-01-31 | Applied Materials, Inc. | Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods |
-
2015
- 2015-09-11 US US14/852,485 patent/US10879046B2/en active Active
-
2016
- 2016-08-01 WO PCT/US2016/044989 patent/WO2017044201A1/en active Application Filing
- 2016-08-01 SG SG10202002453XA patent/SG10202002453XA/en unknown
- 2016-08-01 KR KR1020187010116A patent/KR20180041248A/ko active IP Right Grant
- 2016-08-01 JP JP2018512877A patent/JP6878413B2/ja active Active
- 2016-08-18 TW TW108123514A patent/TWI729429B/zh active
- 2016-08-18 TW TW109115802A patent/TW202036780A/zh unknown
- 2016-08-18 TW TW105126313A patent/TWI670792B/zh active
- 2016-09-09 CN CN202410003143.1A patent/CN117976601A/zh active Pending
- 2016-09-09 CN CN201621048176.5U patent/CN206610799U/zh active Active
- 2016-09-09 CN CN201610815239.3A patent/CN107039325B/zh active Active
-
2020
- 2020-11-11 US US17/095,577 patent/US11676802B2/en active Active
-
2021
- 2021-04-28 JP JP2021075947A patent/JP7112565B2/ja active Active
-
2022
- 2022-07-22 JP JP2022116938A patent/JP7443430B2/ja active Active
-
2023
- 2023-04-19 US US18/302,854 patent/US11915913B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2021121030A (ja) | 2021-08-19 |
JP2018530150A (ja) | 2018-10-11 |
JP6878413B2 (ja) | 2021-05-26 |
JP7112565B2 (ja) | 2022-08-03 |
TWI670792B (zh) | 2019-09-01 |
CN117976601A (zh) | 2024-05-03 |
CN206610799U (zh) | 2017-11-03 |
US20230253188A1 (en) | 2023-08-10 |
WO2017044201A1 (en) | 2017-03-16 |
JP7443430B2 (ja) | 2024-03-05 |
TW201711132A (zh) | 2017-03-16 |
KR20180041248A (ko) | 2018-04-23 |
TW201944532A (zh) | 2019-11-16 |
US10879046B2 (en) | 2020-12-29 |
TWI729429B (zh) | 2021-06-01 |
US11915913B2 (en) | 2024-02-27 |
TW202036780A (zh) | 2020-10-01 |
US20210066038A1 (en) | 2021-03-04 |
JP2022159321A (ja) | 2022-10-17 |
CN107039325A (zh) | 2017-08-11 |
US11676802B2 (en) | 2023-06-13 |
US20170076915A1 (en) | 2017-03-16 |
CN107039325B (zh) | 2024-01-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10202002453XA (en) | Substrate support with real time force and film stress control | |
EP3393132A4 (en) | DISPLAY METHOD AND DISPLAY DEVICE | |
EP3297288A4 (en) | Display method and display device | |
EP3367366A4 (en) | Display control method and display control device | |
EP3269138A4 (en) | Display device and controlling method thereof | |
EP3309774A4 (en) | Display device and display method | |
EP3306944A4 (en) | Display method and display device | |
EP3316592A4 (en) | Display device and control method therefor | |
EP3251109A4 (en) | Injection simulation device and method | |
EP3196941A4 (en) | Array substrate and display device thereof | |
EP3323516A4 (en) | COATING METHOD AND COATING DEVICE | |
EP3208704A4 (en) | Application control method and device | |
EP3300382A4 (en) | Display device and control method therefor | |
EP3385942A4 (en) | DISPLAY CONTROL DEVICE, AND DISPLAY CONTROL METHOD | |
HK1221325A1 (zh) | 顯示裝置及顯示裝置的控制方法 | |
EP3306598A4 (en) | DISPLAY METHOD AND DISPLAY DEVICE | |
EP3343939A4 (en) | DISPLAY DEVICE AND CONTROL METHOD THEREFOR | |
EP3385827A4 (en) | DEVICE AND METHOD FOR DISPLAY CONTROL | |
EP3290461A4 (en) | Polyimide resin and film using same | |
EP3543150A4 (en) | SPACE VEHICLE AND CONTROL DEVICE | |
EP3362880A4 (en) | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | |
EP3196692A4 (en) | Array substrate and display device | |
EP3098700A4 (en) | Display control method and display control device | |
EP3171358A4 (en) | Display control device and display control method | |
TWI561900B (en) | Optical film and display assembly applying the same |