SG10201912594XA - Sealing composition and semiconductor device - Google Patents

Sealing composition and semiconductor device

Info

Publication number
SG10201912594XA
SG10201912594XA SG10201912594XA SG10201912594XA SG10201912594XA SG 10201912594X A SG10201912594X A SG 10201912594XA SG 10201912594X A SG10201912594X A SG 10201912594XA SG 10201912594X A SG10201912594X A SG 10201912594XA SG 10201912594X A SG10201912594X A SG 10201912594XA
Authority
SG
Singapore
Prior art keywords
semiconductor device
sealing composition
sealing
composition
semiconductor
Prior art date
Application number
SG10201912594XA
Other languages
English (en)
Inventor
Dongchul Kang
Takahiro Horie
Kenta Ishibashi
Naoki Namai
Kazuhide Sekiguchi
Keichi Hori
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG10201912594XA publication Critical patent/SG10201912594XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
SG10201912594XA 2016-05-30 2017-05-29 Sealing composition and semiconductor device SG10201912594XA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016107026 2016-05-30
JP2016107025 2016-05-30
JP2016107024 2016-05-30

Publications (1)

Publication Number Publication Date
SG10201912594XA true SG10201912594XA (en) 2020-02-27

Family

ID=60478609

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201810671QA SG11201810671QA (en) 2016-05-30 2017-05-29 Sealing composition and semiconductor device
SG10201912594XA SG10201912594XA (en) 2016-05-30 2017-05-29 Sealing composition and semiconductor device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201810671QA SG11201810671QA (en) 2016-05-30 2017-05-29 Sealing composition and semiconductor device

Country Status (10)

Country Link
US (1) US11854919B2 (zh)
EP (1) EP3456781A4 (zh)
JP (2) JP6717376B2 (zh)
KR (1) KR102153807B1 (zh)
CN (1) CN109219637B (zh)
MY (1) MY196517A (zh)
PH (1) PH12018502527A1 (zh)
SG (2) SG11201810671QA (zh)
TW (1) TWI733821B (zh)
WO (1) WO2017209047A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109219637B (zh) * 2016-05-30 2021-05-25 昭和电工材料株式会社 密封组合物及半导体装置
JP7476529B2 (ja) 2019-12-09 2024-05-01 住友ベークライト株式会社 樹脂シートおよび金属ベース基板
JPWO2022149601A1 (zh) * 2021-01-08 2022-07-14

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58174434A (ja) * 1982-04-08 1983-10-13 Sumitomo Bakelite Co Ltd エポキシ樹脂系成形材料
JP2501149B2 (ja) * 1991-07-17 1996-05-29 東レ株式会社 半導体封止用エポキシ樹脂組成物
US7109288B2 (en) 2001-05-18 2006-09-19 Hitachi, Ltd. Cured thermosetting resin product
JP4046491B2 (ja) * 2001-07-24 2008-02-13 タテホ化学工業株式会社 複酸化物被覆酸化マグネシウムの製造方法
JP4337411B2 (ja) 2003-06-09 2009-09-30 東亞合成株式会社 無機陰イオン交換体およびそれを用いた電子部品封止用エポキシ樹脂組成物
CN1934190B (zh) * 2004-03-30 2010-11-24 住友电木株式会社 半导体密封用环氧树脂组合物及半导体装置
JP2006257309A (ja) * 2005-03-17 2006-09-28 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4577070B2 (ja) * 2005-03-31 2010-11-10 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
TWI402288B (zh) * 2005-05-10 2013-07-21 Nippon Steel & Sumikin Chem Co Epoxy resin composition and hardened material
JP2007009166A (ja) * 2005-06-03 2007-01-18 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP5124808B2 (ja) * 2005-08-05 2013-01-23 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
WO2008044579A1 (en) * 2006-10-06 2008-04-17 Sumitomo Bakelite Company Limited Epoxy resin composition for sealing of semiconductor and semiconductor device
JP2008208176A (ja) * 2007-02-23 2008-09-11 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JP5126223B2 (ja) * 2007-04-26 2013-01-23 東亞合成株式会社 ハイドロタルサイト化合物およびその製造方法、無機イオン捕捉剤、組成物、電子部品封止用樹脂組成物
JP5070972B2 (ja) * 2007-07-26 2012-11-14 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
KR101678256B1 (ko) * 2009-10-09 2016-11-21 스미토모 베이클리트 컴퍼니 리미티드 반도체 장치
JP5507477B2 (ja) * 2011-01-20 2014-05-28 パナソニック株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP6183061B2 (ja) * 2013-08-27 2017-08-23 日立化成株式会社 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
EP3067391A4 (en) * 2013-11-08 2017-06-21 Ajinomoto Co., Inc. Hydrotalcite-containing sealing resin composition and sealing sheet
CN109219637B (zh) * 2016-05-30 2021-05-25 昭和电工材料株式会社 密封组合物及半导体装置

Also Published As

Publication number Publication date
CN109219637B (zh) 2021-05-25
US20200335409A1 (en) 2020-10-22
EP3456781A1 (en) 2019-03-20
JP2020164871A (ja) 2020-10-08
PH12018502527A1 (en) 2019-10-21
JPWO2017209047A1 (ja) 2018-12-20
WO2017209047A1 (ja) 2017-12-07
US11854919B2 (en) 2023-12-26
JP6717376B2 (ja) 2020-07-01
TW201809131A (zh) 2018-03-16
KR102153807B1 (ko) 2020-09-08
MY196517A (en) 2023-04-18
SG11201810671QA (en) 2018-12-28
JP6988952B2 (ja) 2022-01-05
CN109219637A (zh) 2019-01-15
EP3456781A4 (en) 2020-02-19
TWI733821B (zh) 2021-07-21
KR20190005934A (ko) 2019-01-16

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