SG11201703899YA - Sealing sheet and semiconductor device - Google Patents
Sealing sheet and semiconductor deviceInfo
- Publication number
- SG11201703899YA SG11201703899YA SG11201703899YA SG11201703899YA SG11201703899YA SG 11201703899Y A SG11201703899Y A SG 11201703899YA SG 11201703899Y A SG11201703899Y A SG 11201703899YA SG 11201703899Y A SG11201703899Y A SG 11201703899YA SG 11201703899Y A SG11201703899Y A SG 11201703899YA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- sealing sheet
- sealing
- sheet
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014232867 | 2014-11-17 | ||
JP2015088302A JP2016103625A (en) | 2014-11-17 | 2015-04-23 | Sealing sheet, and semiconductor device |
PCT/JP2015/080413 WO2016080164A1 (en) | 2014-11-17 | 2015-10-28 | Sealing sheet and semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201703899YA true SG11201703899YA (en) | 2017-06-29 |
Family
ID=56089676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201703899YA SG11201703899YA (en) | 2014-11-17 | 2015-10-28 | Sealing sheet and semiconductor device |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2016103625A (en) |
KR (1) | KR20170084016A (en) |
CN (1) | CN107112293A (en) |
SG (1) | SG11201703899YA (en) |
TW (1) | TW201626517A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6357289B1 (en) * | 2017-03-03 | 2018-07-11 | リンテック株式会社 | Sealing sheet and method for manufacturing semiconductor device |
CN110383465A (en) * | 2017-03-03 | 2019-10-25 | 琳得科株式会社 | The manufacturing method of diaphragm seal and semiconductor device |
WO2018159619A1 (en) * | 2017-03-03 | 2018-09-07 | リンテック株式会社 | Sealing sheet and semiconductor-device manufacturing method |
JP2019054159A (en) | 2017-09-15 | 2019-04-04 | 東芝メモリ株式会社 | Semiconductor device manufacturing method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0321628A (en) * | 1989-06-20 | 1991-01-30 | Nitto Denko Corp | Epoxy resin composition and semiconductor device using same |
JP2011148959A (en) * | 2010-01-25 | 2011-08-04 | Kyocera Chemical Corp | Resin sheet for sealing semiconductor, and resin-sealed semiconductor device |
JP5961055B2 (en) * | 2012-07-05 | 2016-08-02 | 日東電工株式会社 | Sealing resin sheet, electronic component package manufacturing method, and electronic component package |
-
2015
- 2015-04-23 JP JP2015088302A patent/JP2016103625A/en active Pending
- 2015-10-28 KR KR1020177007632A patent/KR20170084016A/en active IP Right Grant
- 2015-10-28 CN CN201580061825.7A patent/CN107112293A/en active Pending
- 2015-10-28 SG SG11201703899YA patent/SG11201703899YA/en unknown
- 2015-11-03 TW TW104136209A patent/TW201626517A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201626517A (en) | 2016-07-16 |
CN107112293A (en) | 2017-08-29 |
KR20170084016A (en) | 2017-07-19 |
JP2016103625A (en) | 2016-06-02 |
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