SG10201909786QA - Sound transducer assembly with a mems sound transducer - Google Patents
Sound transducer assembly with a mems sound transducerInfo
- Publication number
- SG10201909786QA SG10201909786QA SG10201909786QA SG10201909786QA SG 10201909786Q A SG10201909786Q A SG 10201909786QA SG 10201909786Q A SG10201909786Q A SG 10201909786QA SG 10201909786Q A SG10201909786Q A SG 10201909786QA
- Authority
- SG
- Singapore
- Prior art keywords
- sound transducer
- substrate
- mems
- mems sound
- sound converter
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 5
- 238000001228 spectrum Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/24—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2884—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Abstract
Sound transducer assembly with a MEMS sound transducer The present invention relates to a sound converter arrangement (1) having a first MEMS sound converter (21) for generating and/or detecting soundwaves in the audible wavelength spectrum which comprises a first cavity (41) and an ASIC (11) which is electrically connected to the first MEMS sound converter. According to the invention, the ASIC (11) is embedded in a first substrate (10), and the first MEMS sound converter (21) is arranged on a second substrate (20). In addition there is provision that the first substrate (10) and the second substrate (20) are electrically connected to one another, and that the first cavity (41) is formed at least partially in the first and/or second substrate (10, 20). FIG. 1
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015107560.1A DE102015107560A1 (en) | 2015-05-13 | 2015-05-13 | Sound transducer arrangement with MEMS sound transducer |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201909786QA true SG10201909786QA (en) | 2019-11-28 |
Family
ID=55963359
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201909786Q SG10201909786QA (en) | 2015-05-13 | 2016-05-10 | Sound transducer assembly with a mems sound transducer |
SG11201709249VA SG11201709249VA (en) | 2015-05-13 | 2016-05-10 | Sound transducer assembly with a mems sound transducer |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201709249VA SG11201709249VA (en) | 2015-05-13 | 2016-05-10 | Sound transducer assembly with a mems sound transducer |
Country Status (10)
Country | Link |
---|---|
US (1) | US10412505B2 (en) |
EP (1) | EP3295683B1 (en) |
KR (1) | KR20180014726A (en) |
CN (1) | CN107864696B (en) |
AU (1) | AU2016261293B2 (en) |
CA (1) | CA2985721A1 (en) |
DE (1) | DE102015107560A1 (en) |
HK (1) | HK1247015A1 (en) |
SG (2) | SG10201909786QA (en) |
WO (1) | WO2016180820A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK3703389T1 (en) | 2016-08-26 | 2020-11-09 | Sonion Nederland Bv | Vibration sensor with low-frequency roll-off response curve |
DE102017108594A1 (en) * | 2017-04-21 | 2018-10-25 | USound GmbH | Speaker unit with an electrodynamic and a MEMS speaker |
DE102017114008A1 (en) * | 2017-06-23 | 2018-12-27 | USound GmbH | In-ear listener |
DE102017114142A1 (en) | 2017-06-26 | 2018-12-27 | USound GmbH | Sound transducer arrangement with a MEMS unit |
EP3651479B1 (en) * | 2018-11-08 | 2022-06-01 | Usound GmbH | Method for producing at least one membrane unit of a mems converter |
DE102019101325A1 (en) * | 2019-01-17 | 2020-07-23 | USound GmbH | Manufacturing process for multiple MEMS transducers |
US11805342B2 (en) | 2019-09-22 | 2023-10-31 | xMEMS Labs, Inc. | Sound producing package structure and manufacturing method thereof |
CN110677788B (en) * | 2019-09-24 | 2021-01-15 | 维沃移动通信有限公司 | Sound production module and electronic equipment |
JP6857271B1 (en) * | 2019-10-14 | 2021-04-14 | シャープ株式会社 | Speaker device and display device |
US11395073B2 (en) * | 2020-04-18 | 2022-07-19 | xMEMS Labs, Inc. | Sound producing package structure and method for packaging sound producing package structure |
CN115918106A (en) * | 2020-05-08 | 2023-04-04 | 弗劳恩霍夫应用研究促进协会 | MEMS for efficient interaction with volumetric flow |
CN111918188B (en) * | 2020-07-10 | 2021-12-14 | 瑞声科技(南京)有限公司 | MEMS loudspeaker and manufacturing process thereof |
DE102021133329A1 (en) | 2021-12-03 | 2023-06-07 | USound GmbH | MEMS transducers with an adhesive damping layer |
CN114125675A (en) * | 2021-12-21 | 2022-03-01 | 歌尔微电子股份有限公司 | MEMS device, microphone and electronic product |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3953675A (en) | 1972-05-08 | 1976-04-27 | Babbco, Ltd. | Audio speaker system |
DE10053326A1 (en) | 2000-10-27 | 2002-05-08 | Bosch Gmbh Robert | Micro-mechanical component for sensing dew point contains membrane and porous material thermal insulating zone membrane support |
US7434305B2 (en) * | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
US6675932B2 (en) * | 2001-07-02 | 2004-01-13 | Harman International Industries, Inc. | Speaker housing configured to minimize standing waves and resonate above the frequency range of transducers |
US6588544B2 (en) * | 2001-08-06 | 2003-07-08 | Joseph C. Fox | Speaker box with molded plastic end caps |
WO2007024909A1 (en) * | 2005-08-23 | 2007-03-01 | Analog Devices, Inc. | Multi-microphone system |
WO2009014015A1 (en) * | 2007-07-20 | 2009-01-29 | Kuraray Chemical Co., Ltd. | Material for speaker device and speaker device using it |
JP2010187076A (en) * | 2009-02-10 | 2010-08-26 | Funai Electric Co Ltd | Microphone unit |
US8292023B2 (en) | 2009-02-13 | 2012-10-23 | Nokia Corporation | Enclosing adsorbent material |
US8885863B2 (en) | 2009-05-19 | 2014-11-11 | Visionarist Co., Ltd. | Loudspeaker device |
JP5691181B2 (en) * | 2010-01-27 | 2015-04-01 | 船井電機株式会社 | Microphone unit and voice input device including the same |
US8577063B2 (en) * | 2010-02-18 | 2013-11-05 | Analog Devices, Inc. | Packages and methods for packaging MEMS microphone devices |
JP5029727B2 (en) * | 2010-06-01 | 2012-09-19 | オムロン株式会社 | Semiconductor device and microphone |
WO2012051340A1 (en) * | 2010-10-12 | 2012-04-19 | Analog Devices, Inc. | Microphone package with embedded asic |
JP4893860B1 (en) * | 2011-02-21 | 2012-03-07 | オムロン株式会社 | microphone |
US8804982B2 (en) * | 2011-04-02 | 2014-08-12 | Harman International Industries, Inc. | Dual cell MEMS assembly |
US8969980B2 (en) * | 2011-09-23 | 2015-03-03 | Knowles Electronics, Llc | Vented MEMS apparatus and method of manufacture |
US9402137B2 (en) | 2011-11-14 | 2016-07-26 | Infineon Technologies Ag | Sound transducer with interdigitated first and second sets of comb fingers |
DE102011086722A1 (en) | 2011-11-21 | 2013-05-23 | Robert Bosch Gmbh | Micromechanical functional device, in particular speaker device, and corresponding manufacturing method |
US8995694B2 (en) * | 2012-02-01 | 2015-03-31 | Knowles Electronics, Llc | Embedded circuit in a MEMS device |
DE102012020819A1 (en) | 2012-10-23 | 2014-05-08 | Liebherr-Werk Biberach Gmbh | crane |
US9006845B2 (en) * | 2013-01-16 | 2015-04-14 | Infineon Technologies, A.G. | MEMS device with polymer layer, system of a MEMS device with a polymer layer, method of making a MEMS device with a polymer layer |
US9432759B2 (en) | 2013-07-22 | 2016-08-30 | Infineon Technologies Ag | Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals |
US9332330B2 (en) | 2013-07-22 | 2016-05-03 | Infineon Technologies Ag | Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals |
DE102013214823A1 (en) | 2013-07-30 | 2015-02-05 | Robert Bosch Gmbh | Microphone component with at least two MEMS microphone components |
DE102014203881A1 (en) * | 2014-03-04 | 2015-09-10 | Robert Bosch Gmbh | Component with microphone and media sensor function |
DE102014105754B4 (en) * | 2014-04-24 | 2022-02-10 | USound GmbH | Loudspeaker arrangement with circuit board integrated ASIC |
DE102014211190A1 (en) * | 2014-06-12 | 2015-12-17 | Robert Bosch Gmbh | Micromechanical sound transducer arrangement and a corresponding manufacturing method |
-
2015
- 2015-05-13 DE DE102015107560.1A patent/DE102015107560A1/en not_active Withdrawn
-
2016
- 2016-05-10 WO PCT/EP2016/060426 patent/WO2016180820A1/en active Application Filing
- 2016-05-10 CN CN201680027830.0A patent/CN107864696B/en active Active
- 2016-05-10 SG SG10201909786Q patent/SG10201909786QA/en unknown
- 2016-05-10 SG SG11201709249VA patent/SG11201709249VA/en unknown
- 2016-05-10 AU AU2016261293A patent/AU2016261293B2/en not_active Ceased
- 2016-05-10 CA CA2985721A patent/CA2985721A1/en not_active Abandoned
- 2016-05-10 US US15/572,825 patent/US10412505B2/en active Active
- 2016-05-10 KR KR1020177035938A patent/KR20180014726A/en not_active Application Discontinuation
- 2016-05-10 EP EP16721805.6A patent/EP3295683B1/en active Active
-
2018
- 2018-05-18 HK HK18106511.7A patent/HK1247015A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
SG11201709249VA (en) | 2017-12-28 |
WO2016180820A1 (en) | 2016-11-17 |
US10412505B2 (en) | 2019-09-10 |
AU2016261293A1 (en) | 2017-12-14 |
EP3295683A1 (en) | 2018-03-21 |
CN107864696A (en) | 2018-03-30 |
CN107864696B (en) | 2021-02-02 |
US20180139543A1 (en) | 2018-05-17 |
DE102015107560A1 (en) | 2016-11-17 |
EP3295683B1 (en) | 2022-05-04 |
AU2016261293B2 (en) | 2020-12-10 |
HK1247015A1 (en) | 2018-09-14 |
KR20180014726A (en) | 2018-02-09 |
CA2985721A1 (en) | 2016-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201909786QA (en) | Sound transducer assembly with a mems sound transducer | |
USD746961S1 (en) | Lavatory | |
USD740784S1 (en) | Portable sound device | |
USD945577S1 (en) | Vanity | |
USD824000S1 (en) | Lavatory | |
USD785593S1 (en) | Headphone | |
USD870199S1 (en) | Electronic device for musical instrument | |
MY177874A (en) | Mems acoustic transducer, and acoustic transducer assembly having a stopper mechanism | |
USD870804S1 (en) | Electronic device for musical instrument | |
WO2015168487A3 (en) | Pairing devices using acoustic signals | |
HK1250192A1 (en) | Mems circuit board module having an integrated piezoelectric structure, and electroacoustic transducer arrangement | |
GB2549644A (en) | MEMS transducer package | |
EA201890662A1 (en) | HYBRID CONNECTION ON THE BASIS OF A GUIDED SURFACE WAVE | |
MY183684A (en) | Flexible mems printed circuit board unit and sound transducer assembly | |
USD827111S1 (en) | Vanity | |
EP3729258A4 (en) | Amplifying, generating, or certifying randomness | |
SG10201909399XA (en) | Mems loudspeaker with position sensor | |
WO2015181727A3 (en) | Methods circuits devices systems and associated computer executable code for acquiring acoustic signals | |
SG10201809403YA (en) | Loudspeaker array with circuit board-integrated asic | |
USD770629S1 (en) | Ultrasound probe | |
WO2014143723A3 (en) | Acoustic transducers | |
USD824002S1 (en) | Lavatory | |
WO2015176042A3 (en) | Determining positions of media devices based on motion data | |
SG10201906105RA (en) | Stress relief mems structure and package | |
SG10201907304XA (en) | Circuit board module with a continuous recess and a related sound transducer assembly and a manufacturing method |