DE102021133329A1 - MEMS transducers with an adhesive damping layer - Google Patents

Abstract

The invention relates to a MEMS sound converter, a converter unit (2) for the MEMS sound converter and a production method for this. The converter unit comprises a carrier (4), at least one converter element (5) which is connected to the carrier (4) and can be deflected along a stroke axis (H), a coupling element (13) for connecting the converter element (5) to one of The membrane (3) is spaced apart from the converter element (5) and can be moved along the stroke axis (H), and a spring area (14) formed between the converter element (5) and the coupling element (13) and having at least one spring element (15, 30) which movably connects the converter element (5) to the coupling element (13), and which has a damping layer (31) which at least partially covers the spring element (15, 30). According to the invention, the damping layer (31) is made from a hardened adhesive (32).

Description

The present invention relates to a transducer unit for a MEMS sound transducer with a carrier, at least one transducer element which is connected to the carrier and can be deflected along a stroke axis, a coupling element for connecting the transducer element to a membrane which is spaced apart from the transducer element and which is positioned along the stroke axis is movable, and a spring area formed between the converter element and the coupling element, which has at least one spring element which movably connects the converter element to the coupling element, and which has a damping layer which at least partially covers the spring element. The invention also relates to a MEMS Sound transducer and a manufacturing method for such a transducer unit and/or such a MEMS sound transducer.

From the DE 10 2015 114 242 A1 discloses a MEMS loudspeaker with an actuator and a membrane, which are spaced apart from one another in the direction of a lifting axis and are indirectly connected to one another via a lifting structure. The actuator is connected to the lifting structure via a flexible connecting element. The flexible connecting element has to be designed very filigree in order to be able to ensure an optimal movement of the lifting structure and the actuator. The disadvantage here is that the flexible connecting element can break in the event of mechanical shock, for example if the MEMS loudspeaker falls on the floor. This in turn leads to failure of the MEMS speaker.

The object of the present invention is to eliminate the disadvantages known from the prior art, in particular to create a MEMS sound transducer that is more robust against external mechanical shocks and/or a manufacturing method with which the manufacturing costs for its manufacture can be reduced.

The object is achieved with a transducer unit, a MEMS sound transducer and/or a manufacturing method having the features of the independent patent claims.

A transducer unit for a MEMS sound transducer is proposed, which includes a carrier. Furthermore, this has at least one converter element which is connected to the carrier and can be deflected along a stroke axis. The converter unit preferably has a plurality of converter elements. The converter unit also includes a coupling element for connecting the at least one converter element to a membrane spaced apart from the converter element. The coupling element can be moved along the lifting axis. In addition, the converter unit comprises a spring area which is formed between the converter element and the coupling element and has at least one spring element. The spring element movably connects the converter element to the coupling element. The converter unit also includes a damping layer which at least partially covers the spring element. The damping layer reduces the amount of vibration, i. H. both the maximum induced strain and the duration of the load acting on the spring element during a mechanical shock. This can prevent the at least one spring element from breaking. Furthermore, the damping layer is formed from a cured adhesive. As a result, the damping layer can be formed very cost-effectively, as a result of which the manufacturing costs of the converter unit can be reduced. Furthermore, the material properties of the damping layer can be selected independently of the material properties of the transducer element. The material properties of the damping layer can thus advantageously be selected in such a way that the damping layer impairs the mobility of the spring element as little as possible and at the same time protects the spring element as best as possible from external mechanical interference.

It is advantageous if the cured adhesive is elastic, flexible and/or has a modulus of elasticity of less than 10 MPa. In this way it can be ensured that the mobility of the spring element and accordingly also the mobility of the converter element is essentially not impaired.

Furthermore, it is advantageous if the cured adhesive is thixotropic, so that its viscosity decreases as a result of ongoing deformation. The damping layer advantageously protects the spring element very well when the converter unit is not in operation. Furthermore, the mobility of the spring element or the converter element is increased or improved during operation of the converter unit.

It is advantageous if the cured adhesive has a density of 0.5 to 1.5 g/cm ³ , in particular 1.09 g/cm ³ .

It is also advantageous if the cured adhesive is an epoxy resin. In order to avoid damaging the spring element, it is advantageous if the adhesive is solvent-free.

In order to be able to ensure the best possible mobility of the spring element, it is advantageous if the spring area has at least one continuous recess.

Furthermore, it is advantageous if the damping layer at least partially covers and/or spans the at least one recess. The term “covering” and/or “spanning” means that the cushioning layer essentially does not extend into the recess. As a result, the adhesive forming the damping layer did not run into the recess during manufacture, or only ran into the opening in an entry area.

There are also advantages if the recess extends in the direction of the stroke axis from a first side of the spring area, which preferably faces away from the membrane provided for this purpose when used as intended, to an opposite second side of the spring area, which preferably faces the diaphragm when used as intended dedicated membrane facing extends.

It is also advantageous if the recess extends in the longitudinal direction of the converter element from the converter element to the coupling element.

It is also advantageous if the recess cuts free a longitudinal side of the spring element. As a result, the mobility of the spring element can be improved.

It is also advantageous if the damping layer is arranged on the first and/or second side of the spring area.

It is also advantageous if the recess has a recess opening in the direction of the stroke axis on the first and/or second side of the spring area. It is also advantageous if the damping layer is arranged in the direction of the stroke axis, in particular only in the area of the recess opening, so that preferably an inner area of the recess adjoining the recess opening is free of adhesive.

It is also advantageous if the at least one cutout, in particular in a top view, has a first section that is formed between two opposing spring element sections of the same spring element. Furthermore, it is advantageous if the at least one recess has a second section, preferably in a plan view, which is formed between the spring element and the converter element. It is advantageous if the at least one recess has a third section, which is formed between the spring element and the coupling element, in a plan view. Furthermore, it is advantageous if the at least one recess has a fourth section, which is formed between two adjacent spring elements, in a plan view.

It is also advantageous if the recess, in particular the first, second, third and/or fourth section, has a width that is designed to correspond to a viscosity of the liquid adhesive in such a way that the liquid adhesive does not drip through the recess. The gap, in particular the first, second, third and/or fourth section, preferably has a width of 5 μm to 40 μm, in particular 30 μm.

Furthermore, it is advantageous if the at least one spring element is arranged between two recesses in the plan view.

It is also advantageous if the damping layer at least partially covers an end face of the coupling element adjoining the spring area. As a result, the effort involved in producing the damping layer and therefore the cost of the converter unit can be reduced.

It is advantageous if the converter element is designed as a cantilever arm. Furthermore, it is advantageous if the transducer element has a base that is firmly connected to the carrier and/or a free end that can be deflected relative to the carrier along the stroke axis. There are advantages if the free end is raised in the direction of the stroke axis relative to the spring area, so that a shoulder is formed between these two, on which the damping layer rests.

It is also advantageous if the converter unit has a multi-layer structure that has at least one carrier layer and/or one piezoelectric converter layer.

Furthermore, it is advantageous if the carrier layer is part of the converter element, the at least one spring element and/or the coupling element.

It is also advantageous if the converter layer at least partially forms the shoulder.

A MEMS sound transducer for generating and/or detecting sound waves with a membrane that can be deflected along a displacement axis and with a transducer unit is also proposed. The converter unit comprises a carrier and a converter element which is connected to the carrier, is spaced from the membrane and can be deflected along the stroke axis. The converter unit also has a coupling element which connects the converter element to the spaced-apart membrane and which can be moved together with the membrane along the stroke axis. Furthermore, the converter unit comprises at least one spring area formed between the converter element and the coupling element, which has at least one spring element which movably connects the converter element to the coupling element. To protect the spring element, the spring area includes a damping layer that at least partially covers at least the spring element. The converter unit is designed according to the above description, it being possible for the features mentioned to be present individually or in any combination.

A manufacturing method for a transducer unit and/or a MEMS sound transducer is also proposed, in particular in accordance with the preceding description, it being possible for the features mentioned to be present individually or in any combination. In the production method, a damping layer is formed on at least one spring element in a spring area of the converter unit. In this case, a liquid adhesive is applied to the spring area, which at least partially covers at least the spring element. The adhesive is then cured, so that the damping layer is formed by the cured adhesive.

It is advantageous if the liquid adhesive is applied as a drop or line in the spring area. This is preferably done with an application device, in particular a needle.

There are advantages if the liquid adhesive has a viscosity of 5000 to 15000 mPa*s, in particular 10000 mPa*s. This can ensure that the liquid adhesive does not drip through the at least one recess formed in the spring area. Furthermore, the liquid adhesive having the above viscosity can be applied quickly and accurately. This also ensures that the liquid adhesive can flow and/or be evenly distributed in that area in which the damping layer is to be formed.

In order to reduce the manufacturing time of the transducer unit and/or the MEMS sound transducer, it is advantageous if the adhesive is cured by means, i.e. with the supply of, light, in particular UV and/or VIS, and/or heat.

It is also advantageous if the liquid adhesive is irradiated for curing with an irradiation intensity of more than 100 mW/cm ³ , in particular 150 mW/cm ³ . In this regard, it is advantageous if the liquid adhesive is irradiated for less than 60 s, in particular 30 s, for curing.

It is also advantageous if the liquid adhesive is cured at a temperature, in particular ambient temperature, of more than 100° C., preferably more than 130° C., particularly preferably more than 150° C. In this regard, it is advantageous if the liquid adhesive is exposed to the temperature for less than 15 minutes, preferably less than 11 minutes, particularly preferably less than 6 minutes.

It is also an advantage if the adhesive is increased by 1 vol. % to 3 vol. %, in particular by 2 vol. % shrinks.

It is also advantageous if a semi-finished product of the transducer unit and/or the MEMS sound transducer, in particular at least the spring area, is produced in an etching process and that the liquid adhesive is applied after the etching process.

• 1 eine seitliche Schnittansicht eines schematisch dargestellten MEMS-Schallwandlers,
• 2 eine Draufsicht des MEMS-Schallwandlers,
• 3 einen Detailausschnitt der seitlichen Schnittansicht des MEMS-Schallwandlers im Bereich eines Federbereichs,
• 4 einen Detailausschnitt der Draufsicht des MEMS-Schallwandlers im Bereich des Federbereichs, und
• 5 einen Verfahrensablauf zur Herstellung einer Dämpfungsschicht eine Wandlereinheit des MEMS-Schallwandlers.

Further advantages of the invention are described in the following exemplary embodiment. Show it:

• 1 a side sectional view of a MEMS sound transducer shown schematically,
• 2 a top view of the MEMS transducer,
• 3 a detail of the lateral sectional view of the MEMS sound transducer in the area of a spring area,
• 4 a detail of the top view of the MEMS sound transducer in the area of the spring area, and
• 5 a method sequence for producing a damping layer a transducer unit of the MEMS sound transducer.

1 and 2 show a MEMS sound transducer 1 for generating and/or detecting sound waves. Accordingly, the MEMS sound transducer 1 can be used to generate and/or detect sound waves in the audible wavelength spectrum. Additionally or alternatively, however, the MEMS sound transducer 1 can also generate and/or detect sound waves in the ultrasonic range. Due to its compact design, it is particularly suitable for use in mobile devices such as cell phones, audio glasses, headphones and/or hearing aids.

The MEMS sound converter 1 includes a converter unit 2. With this, movements can be converted into electrical signals. In this case, the converter unit 2 functions as a microphone, sensor or data receiver. Additionally or alternatively, the converter unit can generate movements from electrical signals. In this case, the converter unit 2 functions as a loudspeaker, actuator or data transmitter. In the present embodiment, the MEMS acoustic transducer 1 includes the width ren a membrane 3, which is coupled to the converter unit 2. The membrane 3 can be deflected along a stroke axis H. It is preferably made of an elastic material.

The converter unit 2 has a carrier 4 and at least one converter element 5 . The converter element 5 is connected to the carrier 4 . How out 1 shows that the transducer element 5 is arranged on a first end face of the carrier 4 . The membrane 3 is fastened in its edge area to an opposite, second end face of the carrier 4 . The membrane 3 can have a stiffening element, not shown here, which is spaced from the edge area.

In the present embodiment, the transducer element 5 is designed as a cantilever. As a result, the transducer element 5 comprises a base 6 which is rigidly connected to the support 4. FIG. Starting from this base 6, the transducer element 5 extends beyond the carrier 4 into a cavity 7 of the MEMS sound transducer. The term “cavity” refers to an acoustic hollow space or an acoustic volume on the back of the membrane 3. The transducer element 5 includes a free end 8. This is formed on an end of the cantilever arm opposite the base. The free end 8 of the converter element 5 can be deflected along the stroke axis H. Here, the transducer element 5 is bent over its length.

In the present exemplary embodiment, the converter element 5 is designed as part of a multi-layer structure 9 . The multilayer structure 9 comprises at least one carrier layer 10 and one converter layer 11. The converter layer 11 is preferably designed as a piezoelectric converter layer 11. FIG. In addition, the multilayer structure 9 can have further layers, not shown here, such as electron layers and/or insulation layers.

How out 1 and 2 shows that the membrane 3 is spaced apart from the transducer element 5 in the direction of the stroke axis H, so that a support cavity 12 is formed between the two. The carrier cavity 12 therefore forms part of the acoustic cavity 7 of the MEMS sound transducer 1. In order to couple the membrane 3 to the transducer element 5, the transducer unit 2 also includes a coupling element 13. This extends in the direction of the stroke axis H from the membrane 3 up to the transducer element 5. The coupling element 13 is preferably connected directly and/or rigidly to the membrane 3. The membrane 3 and the coupling element 13 therefore oscillate together as a unit along the stroke axis H.

In order to be able to compensate for changes in orientation between the coupling element 13 and the converter element 5, in particular the free end 8, the converter unit 2 also has a spring area 14. This is formed between the converter element 5 and the coupling element 13. The converter element 5 is thus indirectly connected to the coupling element 13 via the spring area 14 . For this purpose, the spring area 14 comprises at least one first spring element 15. This at least one first spring element 15 therefore movably connects the converter element 5 to the coupling element 13.

As in particular from the 3 and 4 illustrated details, the first spring element 15 can have a meandering shape. In the present case, the first spring element 15 is formed in such a way that it has two opposite spring element sections 16, 17.

The spring area 14 includes a first recess 18 which determines a contour of the first spring element 15 . The first recess 18 cuts a first longitudinal side 19 of the first spring element 15 free. For this purpose, the first recess 18 extends in the longitudinal direction of the converter element 5 from the free end 8 to the coupling element 13.

The spring portion 14 includes according to 3 a first side 20 and an opposite second side 21 in the direction of the stroke axis H. Here, the first side 20 faces away from the membrane 3 and the opposite second side 21 faces the membrane 3 . The first recess 18 is continuous. As a result, it extends continuously in the direction of the stroke axis from the first side 20 to the second side 21. On the first side 20 and the second side 21, the first recess 18 thus includes a recess opening 22, of which in 3 for reasons of clarity, only one is provided with a reference number. An inner region 23 of the first recess 18 is thus formed between the two recess openings 22 .

Like in particular 4 As can be seen, the spring area 14 comprises a second recess 24. According to the previous description, this is designed analogously to the first recess 18. The second recess 24 cuts a second longitudinal side 25 of the first spring element 15 free. The first spring element 15 is thus located between the two recesses 18, 24 in a plan view. The contour of the first spring element 15 is thus determined by the two adjacent recesses 18, 24.

In the present exemplary embodiment, the converter unit 2 according to FIG 2 and 4 in addition to the first spring element 15, a second spring element 30 that connects the converter element 5 to the coupling element 13. The second spring element 30 can be designed like the first spring element 15 according to the previous description. In the present exemplary embodiment, the two spring elements 15, 30 are merely mirror images of one another.

According to 4 the first recess 18 includes a first section 26 which is formed between the two opposing spring element sections 16, 17 of the first spring element 15. The second recess 24 has a second section 27 which is formed between the first spring element 15 , in particular the first spring element sections 16 , and the converter element 5 . The second recess 24 also has a third section 28 which is formed between the first spring element, in particular the second spring element section 17 , and the coupling element 13 . Furthermore, the second recess 24 includes a fourth section 29 which is formed between the first spring element 15 and the second spring element 30 adjacent to the latter. The second recess 24 is thus assigned both to the first spring element 15 and to the second spring element 30 .

The at least one spring element 15, 30 must be of very filigree design in order to be able to ensure optimal movement of the coupling element 13 and the converter element 5. The disadvantage here is that the at least one spring element 15, 30 can break in the event of mechanical shocks, which in turn leads to the failure of the converter unit 2 or the entire MEMS sound converter 1. To protect the at least one spring element 15, 30, the converter unit 2 therefore includes a damping layer 31 in its spring region 14. The damping layer 31 is here arranged on and/or above the at least one spring element 15, 30. It reduces the amount of vibration, i. H. both the maximum induced strain and the duration of the load acting on the at least one spring element 15, 30 during a mechanical shock. This can prevent the at least one spring element 15, 30 from breaking.

The damping layer 31 in this case covers the at least one spring element 15, 30 at least partially. In the present exemplary embodiment, the damping layer 31 covers one side of the spring element 15, 30 completely and/or over the entire length of the spring element 15, 30. As shown in FIG 1 and 3 shows, the damping layer 31 is applied to the first side 20 of the spring area 14 . Alternatively or additionally, however, the damping layer 31 could also be applied to the second side 21 of the spring area 14 .

The damping layer 31 is arranged in the spring area 14 not only over the at least one spring element 15, 30, but also at least partially over the at least one recess 18, 24 of the spring area 14. As a result, the at least one spring element 15, 30 is additionally supported, dampened and/or stabilized.

The cushioning layer 31 is formed from a cured adhesive 32 . In the hardened state, this adhesive 32 is elastic, so that it essentially does not negatively affect the mobility of the at least one spring element 15, 30. For this reason it is also advantageous if the adhesive 32 is thixotropic. This means that its viscosity decreases with continued deformation. As a result, when the converter unit 2 is active, the resistance that the damping layer 31 offers to the at least one spring element 15, 30 is reduced. It is also advantageous if the adhesive 32 is solvent-free, so that the at least one spring element 15, 30, which is preferably formed from the carrier layer 10 of the multi-layer structure 9, is not attacked.

5 FIG. 12 shows a manufacturing method to form the cushioning layer 31 on the spring portion 14. FIG. At this point in the manufacturing process, the membrane 3 is preferably not yet arranged on the carrier 4 . 5 shows a semi-finished product of the converter unit 2. To produce the in 5 Semi-finished product 33 shown has previously been applied to a carrier substrate, in particular a silicon substrate, a plurality of layers, in particular at least the carrier layer 10, the converter layer 11 and/or electron layers. The carrier substrate was then at least partially etched away in an etching process in order to form the carrier cavity 12 . As part of this etching process, the applied layers were also etched away in certain areas and/or partially in order to form the multilayer structure 9, which in turn formed the at least one transducer element 5 and the at least one spring element 15, 30. As a result, the at least one cutout 18, 24 of the spring region 14 was formed by etching away the carrier layer 10 in certain areas.

After the formation of the semi-finished product 33 according to 5 the liquid adhesive 32 is applied to the spring area 14 to form the damping layer 31 . This is done in accordance with the 5 illustrated embodiment on the first side 20 of the spring portion 14 and / or to utilize the force of gravity from above. The application is done with by means of an application device 34. In the present case, this is designed as an injection needle. As a result, the liquid adhesive 32 is applied as a drop, in particular as a single drop. In an exemplary embodiment that is not shown here, the liquid adhesive 32 could also be applied as a line.

The coupling element 13 is arranged in a center of the converter unit 2 . Because of this, the liquid adhesive 32 according to 5 injected onto an end face 35 of the coupling element 13 . From there, the liquid adhesive 32 is distributed laterally in the direction of the at least one adjoining spring area 14, in particular due to gravity. The liquid adhesive 32 covers an outer side 36 of the at least one spring element 15, 30. The liquid adhesive 32 has a viscosity of 5,000 to 15,000 mPa*s, in particular 10,000 mPa*s. Furthermore, the width of the at least one recess 18, 24 is configured so small or corresponding to the viscosity of the liquid adhesive 32 that the liquid adhesive 32 is essentially cannot penetrate. As a result, the liquid adhesive 32 also flows over this at least one recess 18, 24. The liquid adhesive 32 thus spans and/or covers the corresponding recess opening 22 of the at least one recess 18, 24. As a result, the inner region 23 of the at least one recess 18, 24 remains free of adhesive. The liquid adhesive 32 can therefore not drip through the slots formed by the at least one recess 18, 24.

According to 5 The liquid adhesive 32 is thus distributed evenly over the end face 35 of the coupling element 13 and the at least one spring area 14. How in particular 3 and 5 As can be seen, the free end 8 of the converter element 5 is raised in relation to the adjacent spring area 14 in the direction of the stroke axis H, so that a shoulder 37 is formed between these two. This paragraph 37 laterally delimits the space provided for the damping layer 31, in which the liquid adhesive 32 can be distributed. The amount of liquid adhesive 32 is dosed in such a way that the liquid adhesive 32 does not spill over shoulder 37 . After the adhesive 32 has hardened, the damping layer 31 is thus in contact with this section 37 .

After the liquid adhesive 32 has been evenly distributed in the at least one spring area 14 on the first side 20, it is cured. This is done using light, in particular UV and/or VIS, and/or using heat. As a result, the liquid adhesive 32 is irradiated by a light source 38 and/or the environment is heated by a heat source 39 .

The membrane 3 is then attached to the transducer unit 2 so that the MEMS sound transducer 1 is formed.

The present invention is not limited to the illustrated and described embodiments. Modifications within the scope of the patent claims are just as possible as a combination of the features, even if they are shown and described in different exemplary embodiments.

Reference List

1

MEMS transducer

2

converter unit

3

membrane

4

carrier

5

transducer element

6

Base

7

cavity

8th

free end

9

multi-layer structure

10

backing layer

11

transducer layer

12

carrier cavity

13

coupling element

14

spring range

15

first spring element

16

First spring element section

17

Second spring section

18

First recess

19

First long side

20

First page of the spring area

21

Second side of the pen area

22

recess opening

23

Interior of the recess

24

Second recess

25

Second long side

26

first section

27

second part

28

third section

29

fourth section

30

second spring element

31

cushioning layer

32

adhesive

33

Workpiece

34

applicator

35

end face

36

outside

37

Unit volume

38

light source

39

heat source

H

lifting axis

QUOTES INCLUDED IN DESCRIPTION

This list of documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• DE 102015114242 A1 [0002]

Claims (20)

Converter unit (2) for a MEMS sound converter with a carrier (4), at least one converter element (5) which is connected to the carrier (4) and can be deflected along a lifting axis (H), a coupling element (13) for connecting the Converter element (5) with a membrane (3) which is spaced apart from the converter element (5) and can be moved along the stroke axis (H), and a spring region (14) which is formed between the converter element (5) and the coupling element (13) and which is at least has a spring element (15, 30) which movably connects the converter element (5) to the coupling element (13), and which has a damping layer (31) which at least partially covers the spring element (15, 30), characterized in that the Damping layer (31) is formed from a cured adhesive (32). Transducer unit according to the preceding claim, characterized in that the hardened adhesive (32) is elastic and/or has a modulus of elasticity of less than 10 MPa. Transducer unit according to one or more of the preceding claims, characterized in that the hardened adhesive (32) is thixotropic, so that its viscosity decreases as a result of permanent deformation. Transducer unit according to one or more of the preceding claims, characterized in that the hardened adhesive (32) has a density of 0.5 to 1.5 g/cm ³ , in particular 1.09 g/cm ³ . Transducer unit according to one or more of the preceding claims, characterized in that the hardened adhesive (32) is solvent-free. Transducer unit according to one or more of the preceding claims, characterized in that the spring area (14) has at least one continuous recess (18, 24) and that the damping layer (31) at least partially covers and/or strained. Transducer unit according to one or more of the preceding claims, characterized in that the recess (18, 24) cuts free a longitudinal side (19, 25) of the spring element. Transducer unit according to one or more of the preceding claims, characterized in that the damping layer (31) is arranged on a first and/or second side (20, 21) of the spring area (14). Transducer unit according to one or more of the preceding claims, characterized in that the damping layer (31) is arranged in the direction of the stroke axis (H) in the region of a recess opening (22) of the recess (18, 24) and spans this, so that a the inner region (23) of the recess (18, 24) adjoining the recess opening (22) is free of adhesive. Converter unit according to one or more of the preceding claims, characterized in that the at least one recess (18, 24) has a first section (26) which is formed between two opposite spring element sections (16, 17) of the same spring element (15, 30), a second section (27) which is formed between the spring element (15, 30) and the converter element (5), a third section (28) which is formed between the spring element (15, 30) and the coupling element (13), and /or a fourth section (29) which is formed between two adjacent spring elements (15, 30). Transducer unit according to one or more of the preceding claims, characterized in that the damping layer (31) at least partially covers an end surface (35) of the coupling element (13) adjoining the spring region (14). Converter unit according to one or more of the preceding claims, characterized in that a free end (8) is raised in the direction of the lifting axis (H) in relation to the spring area (14), so that a shoulder (37) is formed between these two, on which the damping layer (31) is applied. MEMS sound transducer for generating and/or detecting sound waves, having a membrane (3) which can be deflected along a displacement axis (H), and having a transducer unit (2) comprising a carrier (4), a transducer element (5) which is is connected to the support (4), is spaced from the membrane (3) and can be deflected along the stroke axis (H), a coupling element (13) which connects the converter element (5) to the spaced-apart membrane (3) and which together with the diaphragm (3) can be moved along the stroke axis (H), and at least one between the converter element (5) and the spring area (14) formed on the coupling element (13), which has at least one spring element (15, 30) which movably connects the converter element (5) to the coupling element (13), and which has a damping layer (31) which the spring element (15, 30) at least partially covered, characterized in that the converter unit (2) is designed according to one or more of the preceding claims. Manufacturing method for a transducer unit (2) and/or a MEMS sound transducer, in particular according to one or more of the preceding claims, in which a damping layer (31 ) is formed, characterized in that a liquid adhesive (32) is applied to the spring area (14), which at least partially covers the spring element (15, 30) and that the adhesive (32) is cured, so that the cured Adhesive (32) the damping layer (31) is formed. Manufacturing method according to the preceding claim, characterized in that the liquid adhesive (32) is applied as drops or lines in the spring area (14). Production method according to one or more of the preceding claims, characterized in that the liquid adhesive (32) has a viscosity of 5000 to 15000 mPa*s, in particular 10000 mPa*s. Manufacturing method according to one or more of the preceding claims, characterized in that the adhesive (32) is cured by means of light and/or heat. Manufacturing method according to one or more of the preceding claims, characterized in that the liquid adhesive (32) for curing with an irradiance of more than 100 mW / cm ³ , in particular 150 mW / cm ³ , and / or less than 60s, in particular 30s , is irradiated. Manufacturing method according to one or more of the preceding claims, characterized in that the liquid adhesive (32) is cured at a temperature of more than 100 °C, preferably at more than 130 °C, particularly preferably at more than 150 °C, and/or is exposed to the temperature for less than 15 minutes, preferably less than 11 minutes, more preferably less than 6 minutes. Production method according to one or more of the preceding claims, characterized in that the spring area (14) is produced in an etching process and that the liquid adhesive (32) is applied after the etching process.

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