SG10201906088YA - Low oxide trench dishing chemical mechanical polishing - Google Patents
Low oxide trench dishing chemical mechanical polishingInfo
- Publication number
- SG10201906088YA SG10201906088YA SG10201906088YA SG10201906088YA SG10201906088YA SG 10201906088Y A SG10201906088Y A SG 10201906088YA SG 10201906088Y A SG10201906088Y A SG 10201906088YA SG 10201906088Y A SG10201906088Y A SG 10201906088YA SG 10201906088Y A SG10201906088Y A SG 10201906088YA
- Authority
- SG
- Singapore
- Prior art keywords
- mechanical polishing
- chemical mechanical
- oxide trench
- low oxide
- trench dishing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/06—Planarisation of inorganic insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/06—Planarisation of inorganic insulating materials
- H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862692639P | 2018-06-29 | 2018-06-29 | |
| US201862692633P | 2018-06-29 | 2018-06-29 | |
| US16/450,753 US20200002607A1 (en) | 2018-06-29 | 2019-06-24 | Low Oxide Trench Dishing Chemical Mechanical Polishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201906088YA true SG10201906088YA (en) | 2020-01-30 |
Family
ID=67137867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201906088YA SG10201906088YA (en) | 2018-06-29 | 2019-06-29 | Low oxide trench dishing chemical mechanical polishing |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20200002607A1 (https=) |
| EP (1) | EP3587524A1 (https=) |
| JP (1) | JP2020002357A (https=) |
| KR (1) | KR102794696B1 (https=) |
| CN (1) | CN110655869A (https=) |
| IL (1) | IL267715A (https=) |
| SG (1) | SG10201906088YA (https=) |
| TW (1) | TWI791862B (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021231090A1 (en) * | 2020-05-11 | 2021-11-18 | Versum Materials Us, Llc | Novel pad-1 n-a-bottle (pib) technology for advanced chemical-mechanical planarization (cmp) slurries and processes |
| WO2021242755A1 (en) * | 2020-05-29 | 2021-12-02 | Versum Materials Us, Llc | Low dishing oxide cmp polishing compositions for shallow trench isolation applications and methods of making thereof |
| KR102680336B1 (ko) * | 2024-02-28 | 2024-07-02 | 주식회사 야놀자 | Llm 서버 및 외부 서버와 연계하여 사용자가 요청한 기능을 자동으로 수행하는 챗봇 운영 서버 및 그 동작 방법 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5028620A (en) * | 1988-09-15 | 1991-07-02 | Rohm And Haas Company | Biocide composition |
| US5876490A (en) | 1996-12-09 | 1999-03-02 | International Business Machines Corporatin | Polish process and slurry for planarization |
| US6964923B1 (en) | 2000-05-24 | 2005-11-15 | International Business Machines Corporation | Selective polishing with slurries containing polyelectrolytes |
| US6616514B1 (en) * | 2002-06-03 | 2003-09-09 | Ferro Corporation | High selectivity CMP slurry |
| US20120077419A1 (en) * | 2009-06-05 | 2012-03-29 | Basf Se | Raspberry-type metal oxide nanostructures coated with ceo2 nanoparticles for chemical mechanical planarization (cmp) |
| WO2012032466A1 (en) * | 2010-09-08 | 2012-03-15 | Basf Se | Aqueous polishing compositions containing n-substituted diazenium dioxides and/or n'-hydroxy-diazenium oxide salts |
| EP2614121B1 (en) * | 2010-09-08 | 2019-03-06 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices |
| RU2588620C2 (ru) * | 2010-12-10 | 2016-07-10 | Басф Се | Водная полирующая композиция и способ химико-механического полирования подложек, содержащих пленки на основе оксидкремниевого диэлектрика и на основе поликремния |
| MY166785A (en) * | 2011-12-21 | 2018-07-23 | Basf Se | Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivatives |
| WO2018062401A1 (ja) * | 2016-09-29 | 2018-04-05 | 花王株式会社 | 研磨液組成物 |
-
2019
- 2019-06-24 US US16/450,753 patent/US20200002607A1/en not_active Abandoned
- 2019-06-28 TW TW108122870A patent/TWI791862B/zh active
- 2019-06-29 SG SG10201906088YA patent/SG10201906088YA/en unknown
- 2019-06-30 IL IL26771519A patent/IL267715A/en unknown
- 2019-07-01 EP EP19183697.2A patent/EP3587524A1/en not_active Withdrawn
- 2019-07-01 KR KR1020190079028A patent/KR102794696B1/ko active Active
- 2019-07-01 CN CN201910585884.4A patent/CN110655869A/zh active Pending
- 2019-07-01 JP JP2019122998A patent/JP2020002357A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR102794696B1 (ko) | 2025-04-10 |
| US20200002607A1 (en) | 2020-01-02 |
| KR20200002709A (ko) | 2020-01-08 |
| TW202000815A (zh) | 2020-01-01 |
| JP2020002357A (ja) | 2020-01-09 |
| EP3587524A1 (en) | 2020-01-01 |
| CN110655869A (zh) | 2020-01-07 |
| IL267715A (en) | 2019-10-31 |
| TWI791862B (zh) | 2023-02-11 |
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