TWI791862B - 氧化物槽溝低淺盤效應化學機械研磨組合物、方法及系統 - Google Patents

氧化物槽溝低淺盤效應化學機械研磨組合物、方法及系統 Download PDF

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Publication number
TWI791862B
TWI791862B TW108122870A TW108122870A TWI791862B TW I791862 B TWI791862 B TW I791862B TW 108122870 A TW108122870 A TW 108122870A TW 108122870 A TW108122870 A TW 108122870A TW I791862 B TWI791862 B TW I791862B
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TW
Taiwan
Prior art keywords
composition
ceria
weight
cmp
coated
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TW108122870A
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English (en)
Chinese (zh)
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TW202000815A (zh
Inventor
曉波 史
克里希納Ｐ 慕雷拉
約瑟Ｄ 羅斯
周鴻君
馬克李納德 歐尼爾
Original Assignee
美商慧盛材料美國責任有限公司
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Publication of TW202000815A publication Critical patent/TW202000815A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW108122870A 2018-06-29 2019-06-28 氧化物槽溝低淺盤效應化學機械研磨組合物、方法及系統 TWI791862B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201862692639P 2018-06-29 2018-06-29
US201862692633P 2018-06-29 2018-06-29
US62/692,639 2018-06-29
US62/692,633 2018-06-29
US16/450,753 2019-06-24
US16/450,753 US20200002607A1 (en) 2018-06-29 2019-06-24 Low Oxide Trench Dishing Chemical Mechanical Polishing

Publications (2)

Publication Number Publication Date
TW202000815A TW202000815A (zh) 2020-01-01
TWI791862B true TWI791862B (zh) 2023-02-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW108122870A TWI791862B (zh) 2018-06-29 2019-06-28 氧化物槽溝低淺盤效應化學機械研磨組合物、方法及系統

Country Status (8)

Country Link
US (1) US20200002607A1 (https=)
EP (1) EP3587524A1 (https=)
JP (1) JP2020002357A (https=)
KR (1) KR102794696B1 (https=)
CN (1) CN110655869A (https=)
IL (1) IL267715A (https=)
SG (1) SG10201906088YA (https=)
TW (1) TWI791862B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021231090A1 (en) * 2020-05-11 2021-11-18 Versum Materials Us, Llc Novel pad-1 n-a-bottle (pib) technology for advanced chemical-mechanical planarization (cmp) slurries and processes
WO2021242755A1 (en) * 2020-05-29 2021-12-02 Versum Materials Us, Llc Low dishing oxide cmp polishing compositions for shallow trench isolation applications and methods of making thereof
KR102680336B1 (ko) * 2024-02-28 2024-07-02 주식회사 야놀자 Llm 서버 및 외부 서버와 연계하여 사용자가 요청한 기능을 자동으로 수행하는 챗봇 운영 서버 및 그 동작 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6616514B1 (en) * 2002-06-03 2003-09-09 Ferro Corporation High selectivity CMP slurry
TW201213469A (en) * 2010-09-08 2012-04-01 Basf Se Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5028620A (en) * 1988-09-15 1991-07-02 Rohm And Haas Company Biocide composition
US5876490A (en) 1996-12-09 1999-03-02 International Business Machines Corporatin Polish process and slurry for planarization
US6964923B1 (en) 2000-05-24 2005-11-15 International Business Machines Corporation Selective polishing with slurries containing polyelectrolytes
US20120077419A1 (en) * 2009-06-05 2012-03-29 Basf Se Raspberry-type metal oxide nanostructures coated with ceo2 nanoparticles for chemical mechanical planarization (cmp)
WO2012032466A1 (en) * 2010-09-08 2012-03-15 Basf Se Aqueous polishing compositions containing n-substituted diazenium dioxides and/or n'-hydroxy-diazenium oxide salts
RU2588620C2 (ru) * 2010-12-10 2016-07-10 Басф Се Водная полирующая композиция и способ химико-механического полирования подложек, содержащих пленки на основе оксидкремниевого диэлектрика и на основе поликремния
MY166785A (en) * 2011-12-21 2018-07-23 Basf Se Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivatives
WO2018062401A1 (ja) * 2016-09-29 2018-04-05 花王株式会社 研磨液組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6616514B1 (en) * 2002-06-03 2003-09-09 Ferro Corporation High selectivity CMP slurry
TW201213469A (en) * 2010-09-08 2012-04-01 Basf Se Aqueous polishing composition and process for chemically mechanically polishing substrates for electrical, mechanical and optical devices

Also Published As

Publication number Publication date
KR102794696B1 (ko) 2025-04-10
US20200002607A1 (en) 2020-01-02
KR20200002709A (ko) 2020-01-08
TW202000815A (zh) 2020-01-01
JP2020002357A (ja) 2020-01-09
EP3587524A1 (en) 2020-01-01
SG10201906088YA (en) 2020-01-30
CN110655869A (zh) 2020-01-07
IL267715A (en) 2019-10-31

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