SG10201905439VA - Sealable sheet and method for producing electronic element device - Google Patents

Sealable sheet and method for producing electronic element device

Info

Publication number
SG10201905439VA
SG10201905439VA SG10201905439VA SG10201905439VA SG10201905439VA SG 10201905439V A SG10201905439V A SG 10201905439VA SG 10201905439V A SG10201905439V A SG 10201905439VA SG 10201905439V A SG10201905439V A SG 10201905439VA SG 10201905439V A SG10201905439V A SG 10201905439VA
Authority
SG
Singapore
Prior art keywords
electronic element
element device
producing electronic
sealable sheet
sealable
Prior art date
Application number
SG10201905439VA
Other languages
English (en)
Inventor
OHARA Yasumichi
Habu Takashi
Shimizu Yuusaku
Iino Chie
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG10201905439VA publication Critical patent/SG10201905439VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG10201905439VA 2018-06-28 2019-06-14 Sealable sheet and method for producing electronic element device SG10201905439VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018123253A JP7158184B2 (ja) 2018-06-28 2018-06-28 封止用シートおよび電子素子装置の製造方法

Publications (1)

Publication Number Publication Date
SG10201905439VA true SG10201905439VA (en) 2020-01-30

Family

ID=69028650

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201905439VA SG10201905439VA (en) 2018-06-28 2019-06-14 Sealable sheet and method for producing electronic element device

Country Status (4)

Country Link
JP (1) JP7158184B2 (ja)
CN (1) CN110660748A (ja)
SG (1) SG10201905439VA (ja)
TW (1) TW202002194A (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5309352B2 (ja) * 2011-02-15 2013-10-09 Ｔｄｋ株式会社 電子部品内蔵モジュール用層間絶縁シート、電子部品内蔵モジュール及び電子部品内蔵モジュールの製造方法
JP2014192446A (ja) * 2013-03-28 2014-10-06 Toray Ind Inc 電子部材の製造方法
JP2014229769A (ja) * 2013-05-23 2014-12-08 日東電工株式会社 電子部品装置の製造方法
JP2015126124A (ja) * 2013-12-26 2015-07-06 日東電工株式会社 半導体パッケージの製造方法
JP6302801B2 (ja) * 2014-09-03 2018-03-28 日東電工株式会社 封止用シート
JP6646360B2 (ja) * 2015-04-24 2020-02-14 日東電工株式会社 封止用樹脂シート、及び、電子デバイス装置
JP6283624B2 (ja) * 2015-05-28 2018-02-21 日東電工株式会社 中空型電子デバイス封止用シート、中空型電子デバイスパッケージの製造方法、及び、中空型電子デバイスパッケージ
JP6880567B2 (ja) * 2016-04-26 2021-06-02 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法

Also Published As

Publication number Publication date
JP2020004853A (ja) 2020-01-09
TW202002194A (zh) 2020-01-01
CN110660748A (zh) 2020-01-07
JP7158184B2 (ja) 2022-10-21

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