SG10201900899UA - Semiconductor Memory Devices - Google Patents

Semiconductor Memory Devices

Info

Publication number
SG10201900899UA
SG10201900899UA SG10201900899UA SG10201900899UA SG10201900899UA SG 10201900899U A SG10201900899U A SG 10201900899UA SG 10201900899U A SG10201900899U A SG 10201900899UA SG 10201900899U A SG10201900899U A SG 10201900899UA SG 10201900899U A SG10201900899U A SG 10201900899UA
Authority
SG
Singapore
Prior art keywords
memory devices
semiconductor memory
stacks
gate electrode
conductive
Prior art date
Application number
SG10201900899UA
Inventor
Lee Kiseok
Kim Bong-Soo
Kim Jiyoung
Kim Hui-Jung
Park Seokhan
Lee Hunkook
Hwang Yoosang
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SG10201900899UA publication Critical patent/SG10201900899UA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0688Integrated circuits having a three-dimensional layout
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0207Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration

Abstract

Semiconductor memory devices may include first and second stacks on a substrate and first and second interconnection lines on the first and second stacks. Each of the first and second stacks may include semiconductor patterns vertically stacked on the substrate, conductive lines connected to the semiconductor patterns, respectively, and a gate electrode that is adjacent to the semiconductor patterns and extends in a vertical direction. The first stack may include a first conductive line and a first gate electrode, and the second stack may include a second conductive line and a second gate electrode. Lower surfaces of the first and second conductive lines may be coplanar. The first interconnection line may be electrically connected to at least one of the first and second conductive lines. The second interconnection line may be electrically connected to at least one of the first and second gate electrodes. FIG. 5
SG10201900899UA 2018-02-12 2019-01-31 Semiconductor Memory Devices SG10201900899UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862629335P 2018-02-12 2018-02-12
KR1020180058523A KR102494114B1 (en) 2018-02-12 2018-05-23 Semiconductor memory device

Publications (1)

Publication Number Publication Date
SG10201900899UA true SG10201900899UA (en) 2019-09-27

Family

ID=67808335

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201900899UA SG10201900899UA (en) 2018-02-12 2019-01-31 Semiconductor Memory Devices

Country Status (2)

Country Link
KR (1) KR102494114B1 (en)
SG (1) SG10201900899UA (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210056778A (en) 2019-11-11 2021-05-20 삼성전자주식회사 Integrated circuit device and method of manufacturing the same
CN116367540B (en) * 2023-05-10 2023-10-24 长鑫存储技术有限公司 Semiconductor structure and forming method thereof

Also Published As

Publication number Publication date
KR102494114B1 (en) 2023-02-01
KR20190098007A (en) 2019-08-21

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