SG10201803746TA - Cutting blade detecting mechanism for cutting apparatus - Google Patents

Cutting blade detecting mechanism for cutting apparatus

Info

Publication number
SG10201803746TA
SG10201803746TA SG10201803746TA SG10201803746TA SG10201803746TA SG 10201803746T A SG10201803746T A SG 10201803746TA SG 10201803746T A SG10201803746T A SG 10201803746TA SG 10201803746T A SG10201803746T A SG 10201803746TA SG 10201803746T A SG10201803746T A SG 10201803746TA
Authority
SG
Singapore
Prior art keywords
cutting
detecting mechanism
cutting edge
blade detecting
cutting blade
Prior art date
Application number
SG10201803746TA
Other languages
English (en)
Inventor
Sawaki Satoshi
Uehara Ken
Kasai Tsuyoshi
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201803746TA publication Critical patent/SG10201803746TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
SG10201803746TA 2017-05-22 2018-05-03 Cutting blade detecting mechanism for cutting apparatus SG10201803746TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017100492A JP2018192603A (ja) 2017-05-22 2017-05-22 切削装置の切削ブレード検出機構

Publications (1)

Publication Number Publication Date
SG10201803746TA true SG10201803746TA (en) 2018-12-28

Family

ID=64269450

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201803746TA SG10201803746TA (en) 2017-05-22 2018-05-03 Cutting blade detecting mechanism for cutting apparatus

Country Status (6)

Country Link
US (1) US20180333895A1 (zh)
JP (1) JP2018192603A (zh)
KR (1) KR20180127910A (zh)
CN (1) CN108927705A (zh)
SG (1) SG10201803746TA (zh)
TW (1) TW201902615A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7347986B2 (ja) * 2019-08-06 2023-09-20 株式会社ディスコ エッジトリミング装置
JP7445844B2 (ja) * 2019-11-20 2024-03-08 株式会社東京精密 ワーク加工装置及びワーク加工方法
CN113588477A (zh) * 2021-07-05 2021-11-02 武汉理工大学 一种厨刀剪刃口几何形状检测装置及检测方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06196556A (ja) * 1992-12-22 1994-07-15 Hitachi Ltd ダイシング装置
JP3162580B2 (ja) * 1994-08-09 2001-05-08 セイコー精機株式会社 ダイシング装置
JP4590058B2 (ja) * 2000-04-12 2010-12-01 株式会社ディスコ 切削装置の切削ブレード検出機構
US6761615B2 (en) * 2001-11-01 2004-07-13 Advanced Dicing Technologies, Ltd. In-situ wear measurement apparatus for dicing saw blades
JP4791813B2 (ja) * 2005-12-08 2011-10-12 株式会社ディスコ 切削装置
WO2009031432A1 (ja) * 2007-09-06 2009-03-12 Tokyo Seimitsu Co., Ltd. ダイシング装置、及びダイシング方法
JP6205231B2 (ja) * 2013-10-08 2017-09-27 株式会社ディスコ 切削装置
US9263352B2 (en) * 2014-01-03 2016-02-16 Asm Technology Singapore Pte Ltd Singulation apparatus comprising an imaging device

Also Published As

Publication number Publication date
JP2018192603A (ja) 2018-12-06
CN108927705A (zh) 2018-12-04
KR20180127910A (ko) 2018-11-30
TW201902615A (zh) 2019-01-16
US20180333895A1 (en) 2018-11-22

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